Product Announcements:
Electronics and Microelectronics Manufacturing

Microporous ceramic chuck ensures precise wafer handling with uniform adsorption, high strength, and chemical resistance. Read more...

Line And Panel Mounting Adjustable Low Pressure Propane And Nitrogen Pressure Regulator JSR-3L & JSR-3LP Series Read more...

High-precision ceramic chuck with precision-machined ring groove patterns for wafer clamping and backside gas cooling. Available in alumina and silicon carbide. Compatible with 150-300mm wafer etch, CVD, and PVD chambers. Read more...

Suntech’s innovative ceramic nozzles offer unmatched wear resistance and precision placement for surface mount systems, featuring a minimum aperture of 0.07mm and self-developed anti-static materials for enhanced performance. Read more...

High-precision ceramic capillaries designed for wire bonding applications, ensuring optimal bond strength and functionality across various wire diameters (0.025mm to 0.050mm). Read more...

High-purity SiC wafer pins and chucks for semiconductor equipment, providing plasma resistance, thermal stability, precision wafer support, and low particle generation. Read more...

A precision ceramic ring groove chuck designed for semiconductor wafer handling applications. It provides stable wafer support, excellent flatness, low particle generation, and reliable performance in cleanroom environments. Read more...

Choosing Right EFO Wand Material: Boosting Wire Bonding Quality Read more...

High-performance ceramic components, including SiC, Al₂O₃, AlN, and Si₃N₄, engineered for semiconductor equipment with superior strength, corrosion resistance, and precision processing. Read more...

This porous ceramic chuck is engineered for uniform suction and damage-free holding, providing micron-level flatness and cross-contamination prevention in high-precision semiconductor manufacturing. Read more...