Product Announcements:
Leveling and Filling Compounds

ALPHA HiTech CF31-4010 is a one component, high filler content, heat curable cornerfill designed to be dispensed on the corners (corner bonding) or edges (edge bonding) of BGA devices. Read more...

MacuSpec THF 100 is a single step copper through hole filling process that enables improved thermal and structural designs for IC substrates. Read more...