Product Announcements:
Leveling and Filling Compounds

MacuSpec THF 100 is a single step copper through hole filling process that enables improved thermal and structural designs for IC substrates. Read more...

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (T_g), and extremely high modulus. Read more...