MacDermid Alpha Electronics Solutions

ALPHA HiTech CF31-4010 is a one component, high filler content, heat curable cornerfill designed to be dispensed on the corners (corner bonding) or edges (edge bonding) of BGA devices. Read more...

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MacDermid Alpha Electronics Solutions

MacuSpec THF 100 is a single step copper through hole filling process that enables improved thermal and structural designs for IC substrates. Read more...

More Product Announcements from MacDermid Alpha Electronics Solutions