Shiu Li Technology Co., Ltd
LiPOLY’s BS series is an ultra-soft thermally conductive pad with high resilience characteristics which thermal conductivity: 3.0~5.0W / m*K and hardness Shore OO/10-25 provide high flexibility, high compressibility. It can cover the tolerance of design making it very stable. Read more...
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MacDermid Alpha Electronics Solutions
MacuSpec THF 100 is a single step copper through hole filling process that enables improved thermal and structural designs for IC substrates. Read more...
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Master Bond, Inc.
Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus. Read more...
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