Product Announcements:
Manufacturing and Process Equipment

The NimProbe system combines the handheld i-Probe with the next-generation i-Tracker in a fully wireless, lightweight design. Built for high-precision measurement of small-to-medium parts, it brings together the best of both probing and scanning modes in one innovative solution. Read more...

NimbleTrack-CR, is especially designed for ultimate detail capture. Buillt on the advanced features of the NimbleTrack series—wireless freedom, lightweight and portable design, and high accuracy—this next-generation solution pushes the boundaries of 3D digitization. Read more...

March 4^th, 2026 — SCANOLOGY today announces the launch of the SIMSCAN-S Gen2, a new generation of palm-sized 3D scanner engineered to deliver uncompromising accuracy, assured geometry, and true wireless freedom. Read more...

The TrackProbe 3D probing system, consisting of a tracking i-Probe and the latest optical tracker i-Tracker, is designed for metrology-level measurements. As a versatile 3D digitizer, TrackProbe excels in tasks such as fixture adjustment, benchmark marking, and geometric and dimensional inspection of engineering machinery on the shop floor. Read more...

LED vs. IC Packaging Ceramic Capillaries: Find the Perfect Fit for Your Semiconductor Bonding Needs Read more...

Durable, heat-resistant ceramic burrs for coffee grinders, delivering consistent grind size, authentic flavor, and long-lasting performance. Read more...

CF8 stainless steel pneumatic 3-way globe valve with bellows bonnet, designed for precise flow control and high corrosion resistance in demanding industrial systems. Read more...

Compact, robust DN15 pneumatic valve for precise control under high-differential pressure, with versatile actuators and customizable bonnets. Read more...

ToneCooling manufactures custom liquid cold plates with DFM engineering, rapid RFQ support, and scalable production for EV, data center, and industrial thermal management applications. Read more...

FSW liquid cold plates deliver high thermal conductivity, low thermal resistance, and uniform cooling for high-power electronics, enabling efficient heat dissipation and reliable performance in data centers, HPC systems, aerospace, and advanced electronic applications. Read more...