Teledyne DALSA, a Teledyne Technologies [NYSE: TDY] company, announces the release of the Xtium™3 PCIe Gen4 family, a next-generation frame grabber engineered to deliver maximum sustained throughput and ready-to-use image data for high-performance industrial applications. (read more)

Teledyne DALSA, a Teledyne Technologies [NYSE: TDY] company and a global leader in machine vision technology, introduces the Z-Trak™ Express 1K5 3D laser profiler series. (read more)

Teledyne DALSA is pleased to introduce Z-Trak™ 3D Apps Studio, a suite of software tools developed for in-line 3D machine vision applications. Designed to work with Teledyne DALSA’s Z-Trak family of laser profilers, it simplifies 3D measurement and inspection tasks on production lines. (read more)

Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is pleased to introduce the Linea™ HS2 TDI line scan camera family. Drawing on over four decades of industry leading expertise, this innovative camera series represents a significant breakthrough in next generation TDI technology. (read more)

Teledyne DALSA is pleased to announce that its AxCIS™ family of high-speed and high-resolution fully integrated line scan imaging modules are now available in color. These easy-to-use Contact Image Sensors (CIS) combine sensors, lenses, and lights all-in-one, offering a lower cost inspection system for many demanding machine vision applications including battery and print inspection. (read more)

Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is pleased to announce that its Linea™ Lite 8k Super Resolution camera is now in production. This compact and cost-effective GigE line scan camera delivers 8k resolution images, a performance that normally requires a camera body twice the size. (read more)

Teledyne DALSA, a Teledyne Technologies company and global leader in machine vision technology, is pleased to announce a radiometric version of its MicroCalibir™ Long Wave Infrared (LWIR) compact camera platform that delivers accurate temperature measurements of +/-2°C or +/-2%.

Developed and manufactured in Canada, the small and lightweight MicroCalibir platform is the... (read more)

Teledyne DALSA’s Rad-icon product family of large-area digital x-ray cameras offers users a high-speed, high-performance x-ray imaging detector with a fast, reliable PC interface (either GigE or CameraLink) for easy integration. (read more)

The semiconductor industry’s recovery and growth are indeed pivotal as we approach 2030. The integration of machine learning and AI into quality control processes can be transformative. By leveraging these technologies, companies can enhance precision and efficiency, turning quality control from a challenge into a strategic asset. This shift not only streamlines production but also... (read more)

Teledyne DALSA is pleased to announce its Xtium™2-XGV PX8, a GigE Vision® compatible image acquisition board that features a real-time depacketization engine to convert GigE Vision image packets into ready-to-use images. It also has a hardware-assisted packet resend logic that improves the reliability of image transfers while reducing the CPU overhead. (read more)

Teledyne DALSA is pleased to announce its latest Sapera™ Vision Software Edition is available. This release includes enhanced versions of its AI training graphical tool Astrocyte™ 1.50, and its image processing and AI libraries Sapera Processing 9.50. (read more)

Teledyne introduces Contact Image Sensors for high-speed, high-resolution line scan imaging (read more)