Halogen / Halide Free Fluxes
from Indium Corporation
With the increased demand for flux coatings that have lower voiding, Indium Corporation has developed the next generation of flux coatings. The LV-Series of flux coatings offers low voiding, especially in situations where the component footprint will not allow for proper outgassing of volatized... [See More]
- Type: Soldering Flux / Rosin; Halide Free
- Approvals / Conformance: IPC-TM-650 2.6.3.3,
from Indium Corporation
TACFlux 026 is no-clean and halide-free fl ux designed especially for fl ip-chip and CSP (chip scale package) attachment. It can be also used for 3D packages (POP). TACFlux 026 is designed to accommodate a wide range of refl ow temperatures, and is suitable for all Sn/Pb, Pb-Free and high-Pb... [See More]
- Type: Soldering Flux / Rosin; Halide Free
- Approvals / Conformance: J-STD-004
from Indium Corporation
TACFlux ®057 is an air reflow, halogen-free, no-clean flux used with SnBi and SnBiAg alloys. TACFlux ®057 provides excellent wetting in air and nitrogen and provides the low activation temperature necessar y for the low melting SnBi and SnBiAg alloys. [See More]
- Type: Soldering Flux / Rosin; Halide Free
- Approvals / Conformance: J-STD-004
from Indium Corporation
Features: Halogen-free – no intentionally added (NIA) halogens. Flux rheology applicable for all sphere sizes. Suitable for Pb-free or SnPb applications. Uniform pin transfer over extended periods. Proven high yields in ball-attach process. Excellent solderability on a wide range of surfaces. [See More]
- Type: Soldering Flux / Rosin; Halide Free
- Approvals / Conformance: J-STD-004, J-STD-005
from Indium Corporation
Features. Designed for flip-chip dipping applications. Tackiness suitable for holding die during assembly. Bubble-free airless packaging. Ultra-low residue. Halogen-free. No-clean. Introduction. Flip-Chip Flux NC-26-A is a halogen-free, no-clean flipchip dipping flux which is designed to leave a... [See More]
- Type: Soldering Flux / Rosin; Halide Free
- Approvals / Conformance: J-STD-004/B
from Indium Corporation
Features. Halogen-free (no intentionally-added halogens). Viscosity suitable for 150-300mm wafers. Solvent clean. Nitrogen reflow atmosphere. Suitable for high-Pb, SnPb, and Pb-free solder applications. Introduction. Wafer Flux SC 5R is a low viscosity semiconductor-grade wafer bumping (bump fusion)... [See More]
- Type: Soldering Flux / Rosin; Halide Free
- Approvals / Conformance: J-STD-004
from Indium Corporation
Features. Excellent cleanability, residue can be removed with room temperature DI water. Stencil-printable, high tack. Offers high yields in BGA bumping process. Halide-free with excellent solderability. Wide process window. Introduction. WS-363 Interconnect Flux is a high viscosity paste-type fl ux... [See More]
- Type: Soldering Flux / Rosin; Halide Free
from Indium Corporation
Features. Excellent cleanability; residue can be removed with room temperature water. Pin-transfer and stencil printable. Offers high yields in BGA bumping process. Halide-free with excellent solderability. Wide process window. Suitable for SnPb and Pb-free applications. Introduction. WS-364... [See More]
- Type: Soldering Flux / Rosin; Halide Free