Product Announcements:
Wire Cutting Machines

SGSM 40 multi-wire diamond wire cutting system with adjustable oscillating swing function, engineered for high-efficiency processing of hard and brittle materials, delivering improved surface finish, reduced material loss, and stable precision control. Read more...

Closed-loop diamond wire saw machines deliver fast, precise cutting for graphite, ceramics, foam cement, and other hard materials. Read more...

SGR 40 Prism Cutting Wire Saw enables fully automated multi-angle cutting of optical materials into cubes and prisms with single clamping and minimal material loss. Read more...

A simple and affordable wire cutting solution for laboratories and workshops, designed for cutting ceramics, glass, graphite, and other brittle materials with minimal chipping. Read more...

Vimfun's SH60-60 graphite cutting wire saw machine uses closed-loop diamond wire for fast, high-precision slicing with adjustable thickness, smooth surfaces, and minimal dust. Handles workpieces up to 600×600×600mm, diamond wire speed up to 38m/s, and repeat positioning accuracy of ±0.05mm. Suited to graphite, raw ceramics, foam cement, and fiberboard slicing. Read more...

High-precision diamond wire cutting machine for large graphite, ceramics, and carbon materials, with dual cutting systems and intelligent remote diagnostics for efficient, reliable production. Read more...

High-efficiency multi-wire cutting machine for wafer slicing, delivering low kerf loss, stable surface quality, and slurry-free processing for semiconductor and advanced material production. Read more...

Vimfun manufactures precision diamond wire saws with high accuracy, low material loss, and efficient cutting performance for silicon, glass, sapphire, quartz, jade, and other hard brittle materials. Read more...

The SVN 60-40 entry-level wire cutting machine provides a simple, cost-effective solution for cutting hard and brittle materials with low maintenance and easy operation. Read more...

Multi wire saw systems designed for high-precision slicing of hard and brittle materials including graphite, ceramics, sapphire and optical glass. Suitable for batch production and large-format cutting, offering stable tension control, programmable feed and consistent thickness performance across multiple wires. Read more...