LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173 material is compliant with REACH SVHC toxicity-free and CMR-free legislative requirements. Read more...More Product Announcements from Henkel Adhesive Technologies - Aviation, Space and Rail
Master Bond offers USP Class VI approved one and two component adhesives, sealants and coatings formulated for the assembly of medical devices. These specialty compounds are designed to adhere to dissimilar substrates, resist exposure to sterilization and for easy application. Watch Now Read more...More Product Announcements from Master Bond, Inc.
Master Bond EP36FR is a one component, B-staged epoxy for potting, encapsulation, coating and bonding. It meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. Read more...More Product Announcements from Master Bond, Inc.
EP40Med resists sterilization to gamma, EtO, chemicals, and liquid disinfectants. It is recommended for use in medical device manufacturing and repair for both disposable and reusable instruments. Read more...More Product Announcements from Master Bond, Inc.
Master Bond Super Gel 9 cures readily at room temperature to form a soft, resilient, gel-like system with excellent dimensional stability. Extremely low viscosity and exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super Gel 9 is deal for use in a variety of applications, especially the encapsulation of sensitive electronic parts and sealing delicate optical comp... Read more...More Product Announcements from Master Bond, Inc.
Master Bond LED401 is a unique single component compound that cures rapidly upon exposure to 405 nm light. This formulation has a low viscosity, high bond strength and superior electrical insulation properties. Read more...More Product Announcements from Master Bond, Inc.