CMP Slurry

Description: GRISH CMP slurry is mainly based on colloids. The formula made through scientific proportioning can ensure the stability of pH value during the polishing process, thereby ensuring the stability of the polishing rate and saving time. CMP slurries are widely used in mechanical

• Materials / Substrates Finished: Ophthalmic / Optical Materials, Semiconductors / Electronics (Wafers)
• Features: Other
• Type: Polishing
• Form: Slurry

Description: GRlSH high-efficiency CMP polishing slurry has aracidic pH value. During use, it is more stable and will not change significantly, maintaining a high and stable polishing rate. This product combines rough and fine polishing into a single process, greatly reducing processing costs and

• Grit Size: 70 to 90
• Features: Other
• Type: Polishing
• Form: Slurry

Description: Saint-Gobain Ceramic Materials' NanoSoft Alumina slurry is an aqueous slurry of transitional phase alumina particles. The soft alumina particles are a mixture of delta (δ) and theta (Θ) phase particles manufactured under tightly controlled environments to ensure product consistency

• Compound / Abrasive Type: Aluminum Oxide
• Grading System: Micron Graded
• Type: Polishing
• Materials / Substrates Finished: Semiconductors / Electronics (Wafers)

Description: The internal structure is proprietarily simple and prevents clogging and cohesion in CMP slurry applications. Pneumatically controlled to provide adjustments in pressure. In case of failure, the valves shuts off flow.

• Valve Size: 0.25 to 0.5 inch
• Port Size: 0.25 to 0.5 inch
• Actuation: Manual / Hand, Pneumatic

Description: As machining tasks become more critical in the pursuit of maximum efficiency, economy and the perfection of the finished component, so too does the need for best-in-class specialty fluids and abrasive suspensions. Precision Microchemicals Technical Center operates a fully equipped laboratory to

• Type: CMP / Wafer Planarization, Cleaning / Surface Preparation, Grinding, Lapping, Polishing
• Form: Slurry

Description: The iSIS™1100 Slurry Blending and Distribution System is a high accuracy, low to midvolume slurry system that supports mission-critical CMP processes for R&D or small scale manufacturing applications. The system features MassFusion™ Technology that enables up to ±0.1% blend

• Applications / Industry: Chemical Processing
• User Interface: Digital Front Panel
• Display Type: Digital Numerical Display
• Mounting: Floor-Mounted

Description: Semitron® CMP XL20 Polyamideimide PAI shapes were specifically developed for CMP ring applications in the semiconductor and electronics industry, due to their excellent long wear life in CMP slurries. In addition to these characteristics, Semitron® CMP XL20 PAI components

• Tensile Strength (Break): 20,000 psi
• Tensile Modulus: 575 ksi
• Use Temperature: 500 F
• Industry: Electronics, Semiconductors / ICs

Description: work piece or polishing cloth, it will dry soft and so reduce scratching otherwise associated with standard colloidal silica re-crystallization. Applications: Chemical - Mechanical Planarization (CMP) of sapphire wafers, silicon wafers, gallium nitride, quartz, ceramics, metallographic

• Type: CMP / Wafer Planarization
• Compound / Abrasive Type: Ceramic, Silica
• Materials / Substrates Finished: Ceramics / Glass, Semiconductors / Electronics (Wafers)
• Form: Liquid / Dispersion

Description: The Dymatrix™ Pinch Valve's design provides superior durability and eliminates cohesion and particle generation in CMP slurry applications. The proprietary tube design provides complete seal and full shape restoration. The Dymatrix™ philosophy is CMP valves shouldn't be

• Valve Size: 0.25 to 1 inch
• Actuation: Manual / Hand
• Valve Type: Pinch Valves

Description: No Description Provided

• Application: Catalyst, Planarization Slurry (CMP)
• Material: Chemical / Precursor, Nanocomposite
• Type: Nano Powder / Particulate
• Features: Other, Specialty / Other

Description: No Description Provided

• Application: Catalyst, Planarization Slurry (CMP)
• Material: Ceramic / Carbide, Chemical / Precursor, Glassy / Amorphous, Nanocomposite
• Type: Nano Powder / Particulate

Description: No Description Provided

• Application: Catalyst, Energy, Planarization Slurry (CMP)
• Material: Chemical / Precursor, Nanocomposite
• Type: Nano Powder / Particulate
• Features: Other, Specialty / Other

Description: The Dymatrix™ Pinch Valve's design provides superior durability and eliminates cohesion and particle generation in CMP slurry applications. The proprietary tube design provides complete seal and full shape restoration. The Dymatrix™ philosophy is CMP valves shouldn't be

• Valve Size: 0.25 to 1 inch
• Valve Type: Pinch Valves
• Actuation: Pneumatic

Description: No Description Provided

• Particle / Feature Size: 8 nm
• Specific Surface Area (SSA): 65 m²/g
• Application: Catalyst, Energy, Planarization Slurry (CMP)
• Material: Chemical / Precursor, Nanocomposite

Description: compatibility with UHP liquid chemicals, DI water and CMP slurries (slurry module with Pt cured Silicone tubing) Low maintenance - modules featuring ultrasonic flowmeters with NO moving parts provide the ultimate in “uptime” (slurry module with pinch tube replacement cycle of 3

• Accuracy: 1 ±% FS
• Control Signal: Analog Voltage, Current Loop
• Type: Current Loop (Transmitter) Input, DC Voltage Input
• Control: Limit / Set Point Control

Description: Asahi's patented Ultrasonic Flow Meter Technology and Dymatrix™ Pinch Valves make Falconics™ the ultimate choice for flow control of CMP slurry. Our ultrasonic technology creates a directionally concentrated and repeatable flow signal despite bubbles and temperature fluctuations.

• Media Temperature Range: 59 to 95 F
• Liquid Volumetric Flow Rate: 0.0066 to 0.132 GPM
• Operating Pressure: 14.5 to 43.5 psi
• Media Temperature: 59 to 95 F

Description: 2 types of control valves Excellent for fluid blending and/or dispense applications Compatible with UHP liquid chemicals, DI water and CMP slurries (slurry module with Pt cured Silicone tubing) Longevity with minimal upkeep (Pinch tube replacement every 3 years or longer on

• Accuracy: 3 ±% FS
• Control Signal: Analog Voltage
• Type: DC Voltage Input
• Control: Limit / Set Point Control

Description: of control valves Wide range of flow control capability All PTFE/PFA wetted part construction – compatible with UHP liquid chemicals, DI water and CMP slurries (slurry module with Pt cured Silicone tubing) Mass flow measurement accuracy is independent of fluid density and viscosity

• Accuracy: 1.5 ±% FS
• Control Signal: Analog Voltage, Current Loop
• Type: Current Loop (Transmitter) Input, DC Voltage Input
• Control: Limit / Set Point Control

Description: adhesion promoter for resin-to-metal applications Additive for chemical mechanical planarization (CMP) slurries Primary amine and an internal secondary amine coupling agent for UV cure and epoxy systems WSA-7021 has greater hydrolytic stability

• Flash Point: 230 F
• Features: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)

Description: Plus, the cartridge&rsquo,s stiff construction prevents media migration and particle unloading. Eaton&rsquo,s LOFTREX-C cartridge is designed to handle coarse to fine filtration in a variety of applications, including: paint, CMP slurries, plating solutions, perfumes, magnetic slurries, pre

• Filtration Grade (Micron Rating): 0.5 to 150 µm
• Maximum Pressure: 100 psi
• Type: Cartridge
• Additional Features: FDA Compliant

Description: by +25%, and reduce cleaning chemical consumption (e.g. SC-1 or EKC-265) in FEOL and BEOL cleaning. Achieve tight control of CMP slurries and better uniformity of the planarization process. Key Features: Typical accuracy of 0.1% by weight, e.g. for HCl in water. For multi-component solutions,

• RI Range: 1.26 to 1.53
• Operating Temperature: -20 to 45 C
• Prism / Light Source & Special Features: Alarms, Automatic Temperature Compensation, Measures Temperature
• Monitoring: Continuous