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Supplier: Master Bond, Inc.
Description: Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating.
- Applied Thickness / Gap Fill: 0.004 to 0.006 inch
- Viscosity: 70,000 to 100,000 cP
- Use Temperature: -100 to 250 F
- Coeff. of Thermal Expansion (CTE): 5,555,555.555555555 to 7,222,222.222222222 µin/in-F
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Supplier: Epoxies Etc...
Description: UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE).
- Viscosity: 70,000 to 90,000 cP
- Coeff. of Thermal Expansion (CTE): 19.444444444444443 µin/in-F
- Dielectric Strength: 449.9999999999993 kV/in
- Dielectric Constant (Relative Permittivity): 3.5
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Supplier: MacDermid Alpha Electronics Solutions
Description: significantly different Thermal Expansion Coefficients (CTEs). The adhesive’s reworkable nature offers distinct advantages in applications where thermoset systems are typically less effective.
- Industry: Electronics, Semiconductors / IC Packaging
- Features: Film / Sheet, Thermal Compound / Thermally Conductive, Thermoplastic / Hot Melt, Thermosetting / Crosslinking
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Supplier: Epoxies Etc...
Description: The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of
- Viscosity: 3,000 to 8,000 cP
- Thermal Conductivity: 0.11538232 W/m-K
- Dielectric Strength: 400.000000000001 kV/in
- Features: Die Bonding Adhesive / Compound, Flexible / Dampening, Grease / Paste, Thermal / Heat Conductive
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Supplier: Epoxies Etc...
Description: The 10-2080 and 10-2080 HV were developed to produce a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of
- Viscosity: 3,000 to 9,000 cP
- Thermal Conductivity: 0.11538232 W/m-K
- Dielectric Strength: 400.000000000001 kV/in
- Features: Die Bonding Adhesive / Compound, Grease / Paste, Thermal / Heat Conductive
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film LOCTITE® ABLESTIK 561KAP is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE
- Adhesive: Epoxy
- Features: Specialty / Other
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Supplier: Epoxies Etc...
Description: UV Cure 60-7107 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE).
- Viscosity: 35,000 cP
- Use Temperature: -58 to 311 F
- Tensile Strength (Break): 2,500 psi
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on
- Viscosity: 360,500 cP
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System
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Supplier: SAE International
Description: samples built on Al and Cu substrates exhibited higher thermal resistance due to higher mis-match of coefficient of thermal expansion (CTE) with that of AlN, while TLPS samples assembled on AlSiC substrates were much more reliable and showed
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Supplier: Boyd
Description: of copper Anisotropic Very high thermal diffusivity Graphite is a carbon-based mineral with extreme properties. It is the most stable form of carbon under standard operating conditions with high thermal stability and electrical and thermal conductivity. These
- Thickness / Wall Thickness: 0.0006692917 inch
- Thermal Conductivity: 300 to 1,500 W/m-K
- Material Type: Graphite
- Features: Other
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Supplier: General Plastics Manufacturing Co.
Description: FR-4700 Series products offer outstanding stability and versatility. Their higher glass transition temperature and low coefficient of thermal expansion (CTE) make them suitable for use in vacuum-forming applications where other urethane products may soften or
- Industry Served: Aerospace, Marine, Medical
- Services: CAD/CAM Support, Design Assistance, Prototyping
- Features: Custom / Specialty Tools, North America, Northwest US Only, United States Only
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Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications.
(read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
has made available EP21TCHT-1. Curable at room temperatures, EP21TCHT-1 has high thermal conductivity and superior electrical insulation properties. It has a service operating temperature range of 4K to 400°F. It also has a remarkably low thermal expansion coefficient. EP21TCHT-1 is NASA (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
EP42HT-2LTE Master Bond EP42HT-2LTE is an innovative, two component epoxy system with an ultra low coefficient of thermal expansion. It can be used as an adhesive, sealant, coating and, in some cases, as a casting system. EP42HT-2LTE (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
low outgassing specifications. It provides a tensile modulus that exceeds 1 million psi at room temperature. Minimal shrinkage upon cure combined with a low CTE of 8-12 x 10-6 in/in/°C enables precise alignment for bonding dissimilar substrates with low coefficients (read more)
Browse Leveling and Filling Compounds Datasheets for Master Bond, Inc. -
Mismatch): Differing coefficients of thermal expansion (CTE) in bonded or assembled materials can induce high stresses, leading to delamination, cracking, or joint failure. Performance Drift: Electronic (read more)
Browse Environmental Test Chambers and Rooms Datasheets for Guangdong Atmars Industry Co., Limited -
dissipation effect is better than that of the super copper and aluminum. Ceramics are insulated, resistant to high temperatures, oxidation, acid and alkali, cold and thermal shock, and low coefficient of thermal expansion, ensuring stability in high and low temperatures or other harsh environments (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Coefficient of Thermal Expansion. Learn more about product data and key features. (read more)
Browse Encapsulants and Potting Compounds Datasheets for MacDermid Alpha Electronics Solutions -
are generally selected based on their CTE (Coefficient of Thermal Expansion) value. In general, the ceramic and metal being bonded should have CTE values which are as close as possible. However, the yield strength of almost any metal can be lowered by reducing its cross-sectional area (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
, General Plastics has developed high-performance foam with a low coefficient of thermal expansion (CTE) similar to that of aluminum. Weight and Handling: When designing a very large prototype or component, you may not consider the weight and size of the tool required to make (read more)
Browse Prototyping Services Datasheets for General Plastics Manufacturing Co. -
temperature, low CTE tooling board offers outstanding stability and versatility. Its higher glass transition temperature and low coefficient of thermal expansion (CTE) makes it suitable for use in vacuum-forming applications where other urethane products may soften or deform. (read more)
Browse Tool and Die Makers Datasheets for General Plastics Manufacturing Co.
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How to Manage Stresses Caused By CTE Mismatches
It is important to select the right adhesive, especially when bonding substrates with different coefficients of thermal expansions (CTEs). Learn about the most effective ways to mitigate the occurrence of CTE mismatches and maintain high bond strength in the process.
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Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other assembly operations. These epoxies are used for a variety of different applications such as encapsulation
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Handbook of Adhesion Technology
… shear tests for sealants/foam adhesives, indentation and scratch tests for coatings, tack tests for pressure-sensitive adhesives (PSAs), and bimaterial curvature tests for characterizing residual stress, stress-free temperature (SFT), and coefficient of thermal expansion ( CTE ) of adhesives bonded to substrates of …
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Optical fiber systems for the BigBOSS instrument
Critical factors include the balance of material’s coefficient of thermal expansion ( CTE ) and adhesive shrinkage, strength and modulus.
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Modeling the performance of flexible substrates for lead-free applications
Higher stress was identified along the interface between the conductive particle and the metallization, and the interfacial stress increases with the reflow peak temperature and the coefficient of thermal expansion ( CTE ) ofthe adhesive .
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Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill
Thermo-mechanical properties, i.e. modulus (E), glass transition temperature (Tg), coefficient of thermal expansion ( CTE ) and adhesion strength, of MUF after PMC, reflow and PCT are measured by DMA and TMA (see Table 1).
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Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill
2.1 Thermo-mechanical Properties: after PMC, Refow, and PCT Thenno-mechanical properties, i.e. modulus (E), glass transition temperature (T,), coefficient of thermal expansion ( CTE ) and adhesion strength, of MUF after PMC, reflow and PCT are measured by DMA and TMA …
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Use of microwave technology for rapid cure of chip-on-board glob top encapsulants
Measured properties include glass transition temperature (Tg), Coefficient of thermal expansion ( CTE ), adhesion strength,functionality,and reliability (temperaturecyclingand temperaturehumidity tests).
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Reliability assessment of connection using HSC on LCD
Besides, the difference in coefficient of thermal expansion ( CTE ) of adhesive and polyester base film which are 2 and 50 - 110 ppm/"C respectively, can causes different thermal expansion and hence enhance the formation of cracks in adhesive and base filminterface [4,5].
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Low cost chip-on-dot flip chip technique for unbumped die
This rapid increase in resistance was because the thermal expansion coefficient ( CTE ) of the adhesive above Tg was much higher than that of the dot itself and at about 21VC, the deformation of adhesive in z direction was larger than that of …
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Effects of some parameters on warpage and bump-joint stresses of COG packages
Therefore, the higher the elastic module (E) and thermal expansion coefficient ( CTE ) of the adhesives , the larger the peel bump-joint stress.
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Strength Evaluation of Multilayer Glass–Ceramic Sealants
Most specifically the property of electrical insulation should be preserved, as well as a good adhesion , coefficient of ther- mal expansion ( CTE ) compatibility, and other requisites of this application.