Wafer Polishing Slurry

Description: The Lapmaster range of diamond slurries has been formulated for use on many different types of lapping plates and polishing pads. The slurries can be hand sprayed onto the lapping/polishing platen or applied by an electronic dispensing system to control cost and reduce

• Abrasive Grain Type: Diamond
• Form: Slurry
• Grading / Grit System: Micron Graded
• Grit Size: 0.1000 to 45

Description: The Lapmaster range of diamond slurries has been formulated for use on many different types of lapping plates and polishing pads. The slurries can be hand sprayed onto the lapping/polishing platen or applied by an electronic dispensing system to control cost and reduce

• Abrasive Grain Type: Diamond
• Form: Slurry
• Grading / Grit System: Micron Graded
• Grit Size: 0.1000 to 45

Description: The Lapmaster range of diamond slurries has been formulated for use on many different types of lapping plates and polishing pads. The slurries can be hand sprayed onto the lapping/polishing platen or applied by an electronic dispensing system to control cost and reduce

• Abrasive Grain Type: Diamond
• Form: Slurry
• Grading / Grit System: Micron Graded
• Grit Size: 0.1000 to 45

Description: Polishing Compounds confine to chemo mechanical polishing action. These are alumina or silica based with controlled PH values to suit various applications. It contains uniformly suspended abrasive particles in slurry form and is soluble in water for dilution & used for

Description: Saint-Gobain Ceramic Materials' sub-micron polishing slurries are calcined aluminum oxide particles (99%+ purity) suspended in aqueous solutions, designed for use in electronics and industrial polishing applications. They are offered with only minimal additives and are intended

• Abrasive Grain Type: Aluminum Oxide
• Form: Slurry
• Products / Materials Finished: Semiconductors / Electronics (Wafers)
• Type: Polishing

Description: Saint-Gobain Ceramic Materials' NanoSoft Alumina slurry is an aqueous slurry of transitional phase alumina particles. The soft alumina particles are a mixture of delta (d) and theta (T) phase particles manufactured under tightly controlled environments to ensure product consistency

• Abrasive Grain Type: Aluminum Oxide
• Form: Slurry
• Grading / Grit System: Micron Graded
• Products / Materials Finished: Semiconductors / Electronics (Wafers)

Description: Saint-Gobain's sub-micron polishing slurries are calcined aluminum oxide particles (99%+ purity) suspended in aqueous solution, designed for use in electronics and industrial polishing applications. They are offered with only a minimal of additives, and are intended as the

• Abrasive Grain Type: Aluminum Oxide
• Form: Powder
• Grading / Grit System: Micron Graded
• Products / Materials Finished: Semiconductors / Electronics (Wafers)

Description: Alumina Submicron Polishing Particles, 7956 Industrial Lapping and Polishing Product Code: 7956 Saint-Gobain Ceramic Materials' sub-micron polishing slurries are calcined aluminum oxide particles (99%+ purity) suspended in aqueous solution, designed for use in

• Abrasive Grain Type: Aluminum Oxide
• Form: Powder
• Grading / Grit System: Micron Graded
• Products / Materials Finished: Semiconductors / Electronics (Wafers)

Description: As machining tasks become more critical in the pursuit of maximum efficiency, economy and the perfection of the finished component, so too does the need for best-in-class specialty fluids and abrasive suspensions. Precision Microchemicals Technical Center operates a fully equipped laboratory to

• Form: Slurry
• Type: Cleaning / Surface Preparation, CMP / Wafer Planarization, Grinding, Lapping, Polishing

Description: Standard grade micron synthetic diamond powder designed for metal bond systems. Designed for reliable and secure performance in polishing applications and lapping of glass, wafers, and polycrystalline diamond.

• Abrasive Grain Type: Diamond
• Type: Lapping, Polishing

Description: Standard grade micron synthetic diamond powder designed for resin bond systems. Designed for reliable and secure performance in polishing applications and lapping of glass, wafers, and polycrystalline diamond.

• Abrasive Grain Type: Diamond
• Type: Lapping, Polishing

Description: period to dry on a work piece or polishing cloth, it will dry soft and so reduce scratching otherwise associated with standard colloidal silica re-crystallization. Applications: Chemical - Mechanical Planarization (CMP) of sapphire wafers, silicon wafers, gallium nitride,

• Abrasive Grain Type: Ceramic, Silica
• Form: Liquid / Dispersion, Other
• Grading / Grit System: Micron Graded
• Products / Materials Finished: Ceramics / Glass, Semiconductors / Electronics (Wafers), Specialty / Other