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Supplier: Richardson RFPD
Description: 4000 series O-ring tub for the Wolfspeed. XM3 module with MDT pin fin baseplate. The 4012 O-ring tub is an aluminum friction stir welded tub for direct cooling of the Wolfspeed XAB525M12XM3. Flow paths have been optimized specifically for the high heat flux of silicon
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Supplier: Richardson RFPD
Description: 4000 series O-ring tub for the Wolfspeed. XM3 module with MDT pin fin baseplate The 4012D O-ring tub is a double-sided aluminum friction stir welded tub for direct cooling of the Wolfspeed XAB525M12XM3 Flow paths have been optimized specifically for the high heat flux of silicon
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Supplier: Richardson RFPD
Description: Optimized for use with Wolfspeed CAB450M12XM3 1200V/450A silicon carbide power module The CP3012 aluminum friction stir welded coldplate has been optimized specifically for the high heat flux of silicon carbide. The MDT (micro deformation technology) inside
- Device: Liquid Cooler/Cold Plate
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Supplier: Richardson RFPD
Description: The CP3012 aluminum friction stir welded coldplate has been optimized specifically for the high heat flux of silicon carbide. The MDT (micro deformation technology) inside allows for the very low thermal resistance, low pressure drop and balanced parallel flow.
- Device: Liquid Cooler/Cold Plate
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Supplier: Plansee SE
Description: , our aluminium heat sinks are directly connected to the target material. You can also take a look at our targets and cathodes made from aluminium-chromium, chromium, titanium, zirconium, titanium-silicon, tungsten carbide and tungsten carbide. Our team develops
- Type: Sputtering Target
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Supplier: Plansee SE
Description: sinks are directly connected to the target material. You can also take a look at our targets and cathodes made from titanium-aluminum, chromium, titanium, zirconium, titanium-silicon, tungsten carbide and titanium diboride.
- Type: Sputtering Target
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Description: industry because it does not pose a health risk when machined. Aluminum Nitride possesses electrical insulating qualities and a coefficient of thermal expansion similar to silicon wafer material, making it a valuable material for electronics applications where high temperatures and
- Material Type: Aluminum Nitride
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Description: industry because it does not pose a health risk when machined. Aluminum Nitride possesses electrical insulating qualities and a coefficient of thermal expansion similar to silicon wafer material, making it a valuable material for electronics applications where high temperatures and
- Material Type: Aluminum Nitride
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Description: in telecommunications technology since it can be processed using both thick and thin film technologies. As a result, Aluminum Nitride ceramic is utilized as a substrate for semiconductors as well as high-power electronic devices, housings, and heat sinks. Typical Features
- Dielectric Strength: 2.00E7 V/m
- Material Type: Aluminum Nitride
- Thermal Conductivity: 180 to 200 W/m-K
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Description: dielectric and mechanical strength due to its excellent thermal conductivity. It is especially well suited for use as a diode laser and semiconductor heat sinks, as well as as a rapid thermal transfer medium for miniaturized circuitry and tightly contained electronic assemblages.
- Material Type: Beryllia / Beryllium Oxide
- Shape / Form: Tube / Sheath - Immersion (Closed End)
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Supplier: RS Components, Ltd.
Description: Aavid Thermalloy insulating full lengths of extruded aluminium alloy heatsinks. Length = 114.3mm Height = 51.31mm Mounting = Horizontal Colour = Black Series = 8064 Material = Aluminium Finish = Black Anodized
- Height: 51.31 mm
- Length: 114 mm
- Material: Aluminum
- Mounting: Other
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Supplier: RS Components, Ltd.
Description: ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks
- Height: 40 mm
- Length: 200 mm
- Material: Aluminum
- Mounting: Other
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Supplier: RS Components, Ltd.
Description: Ohmite M series high performance, configurable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides easy assembly, large surface area and small footprint. It is the ideal type of heat sink for high
- Height: 38.6 mm
- Length: 55 mm
- Material: Aluminum
- Mounting: Clips, Other
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Supplier: RS Components, Ltd.
Description: = Black Anodized Material = Aluminium Special Features = Economy, Low Profile Channel Style Heat Sink is Perfect for Use on Printed Circuit Boards, Narrow Base
- Height: 21.6 mm
- Length: 19.8 mm
- Material: Aluminum
- Thermal Resistance: 15.6 °C / W
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Supplier: Sensata Technologies
Description: 0.7°C/W Thermal resistance Suitable for 1 or 2 single or dual Solid State Relays Panel mounting
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Mounting Holes
- Thermal Resistance: 0.7000 °C / W
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Supplier: Dynatron Corp.
Description: CPU Support : Intel® Xeon? 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508 CPU
- Height: 64 mm
- Length: 90 mm
- Material: Aluminum, Copper, Mixed Material
- Weight: 490 g
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Supplier: Airflow/Y.S. Tech, Inc.
Description: modules Material Options for Custom Heat Sinks Aluminum heat sink Copper heat sink Size Options for Custom Heat Sinks 19-57mm Heatsinks 69-120mm Heatsinks 122-174mm Heatsinks 186-250mm Heatsinks 271-482mm Heatsinks
- Device: Passive Heat Sink
- Heat Sink Fin Style: Straight Fin
- Length: 19 to 482 mm
- Material: Aluminum, Copper
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Description: We provide OEM CNC machined heat sink, modest price, short lead time and good quality.
- Device: Passive Heat Sink, Vapor Cooler, Cold Plate
- Heat Sink Fin Style: Round Pin, Elliptical Fin, Straight Fin, Machined Plate
- Material: Aluminum
- Mounting: Mounting Holes
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Supplier: DigiKey
Description: HEATSINK 60X60X10MM XCUT T766
- Device: Passive Heat Sink
- Height: 10.01 mm
- Length: 59.99 mm
- Material: Aluminum
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Supplier: Boyd
Description: liquid cold plates feature copper or stainless steel tubing mechanically interlocked into aluminum plates. These cost effective liquid cold plates are designed specifically for low to medium power density applications. Standard Aavid Hi-Contact™ tube liquid cold plates feature a joint
- Device: Liquid Cooler/Cold Plate
- Height: 14 to 15.2 mm
- Length: 57.2 to 610 mm
- Material: Aluminum, Other Materials
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Supplier: Utmel Electronic Limited
Description: Heatsink; TO-220; 15.6degC/W; 44.45 x 17.78 x 12.7mm; Through Hole Mount
- Material: Aluminum
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Supplier: Ohmite Manufacturing Co.
Description: C Series For TO Package Heatsinks No tool, camming clip system Compatible with TO-264, TO-247,TO-220 and TO-126 Devices. Mount up to 3 devices per heatsink Spring Clip delivers constant repeatable pressure For TBH, TCH, TEH, and TFH series
- Device: Passive Heat Sink
- Height: 32.5 to 38 mm
- Length: 25 to 75 mm
- Material: Aluminum, Mixed Material
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Supplier: Broadband TelCom Power, Inc.
Description: Longitudinal fin orientation
- Device: Passive Heat Sink
- Heat Sink Fin Style: Straight Fin
- Height: 6.35 mm
- Length: 36.07 mm
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Supplier: Sanyo Denki America, Inc.
Description: CPU cooler for Intel® 775-land LGA Package.
- Device: Active Heat Sink
- Fan Noise: 42 dB
- Fan Speed: 3900 rpm
- Fan Voltage: 12 VDC
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Supplier: Cooliance
Description: Cooliance offers a wide variety of standard radial fin options ranging in diameter from .5" to 3" and from 1 to 7 fins. Radial fin heatsinks do not require any specific orientation. Our Smart-CLIP™ attach mechanism allows the fins to extend beyond the dimensions of the chip package without
- Device: Passive Heat Sink
- Heat Sink Fin Style: Other
- Height: 6.35 to 19.94 mm
- Material: Aluminum
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Silicon carbide grades can be distinguished by its porosity and composoition. Remarkably dense at less than 99 (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for Saint-Gobain Performance Ceramics & Refractories -
Wolfspeed offers a family of 1200 V silicon carbide MOSFETs and Schottky diodes that are optimized for use in high power applications such as UPS, motor control and drives, switched-mode power supplies, solar and energy storage systems, electric vehicle charging, high (read more)
Browse Diodes Datasheets for DigiKey -
civil field, aluminum nitride has been widely used in integrated circuits, automobiles, high-speed rail, electric power, semiconductors and other fields, such as integrated circuit substrates, IGBT control modules, electrostatic chucks for wafer processing, high-power LED heat sinks, etc. . At the (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
-compression bonding cannot conduct sufficient heat which results in low productivity. Stainless Steel Heat-Resistant Alloys Ceramics Molybdenum Tungsten Aluminum Nitride Silicon Carbide SiC-based MMC ?It is very hard to find a (read more)
Browse CNC Machining Services Datasheets for Top Seiko Co., Ltd. -
. Thermally Conductive Materials: 1. DIAMOND – 2000 – 2200 W/m•K 2. SILVER – 429 W/m•K 3. COPPER – 398 W/m•K 4. GOLD – 315 W/m•K 5. SILICON CARBIDE – 270 W/m•K 6. BERYLLIUM OXIDE– 255 W/M•K 7 (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
alkalis through attack on the aluminum nitride grains. The material hydrolyzes slowly in water. Most current applications are in the electronics area where heat removal is important. This material is of interest as a non-toxic alternative to beryllia. Metallization methods are available to allow AlN to (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Wintrustek Advanced Materials Co., Ltd. -
thermal expansion coefficient, close to that of Silicon Non-reactive with normal semiconductor process chemicals and gases Applications Heat sinks & heat spreaders Electrical (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Wintrustek Advanced Materials Co., Ltd. -
Induction heating is a fast, precise, repeatable and safe non-contact method for heating metals or other electrically-conductive materials. The material may be a metal such as brass, aluminum, copper or steel or it can be a semiconductor such as silicon carbide, carbon or graphite. To heat non (read more)
Browse Welding, Brazing, and Soldering Equipment Datasheets for Ambrell Induction Heating Solutions -
strength, wear resistant windows or lenses. Thermal conductivity varies tremendously between materials as well. For instance, some grades of silicon carbide conduct heat on a par with (read more)
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materials such as silicon carbide. It is also an efficient, clean and environmentally-friendly process, as it does not produce any emissions. Those are just some of the reasons induction heating has become increasingly popular in manufacturing. Now, let's look at some of the specific reasons (read more)
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High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation
This includes Al backed SiC JFETs, AlN (aluminum nitride) and aluminum oxide electrical insulators, Al interconnects (in place of copper), and AlSiC ( aluminum silicon carbide ) heat sinks .
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The Effects of Sintering Parameter to the Microstructure and Thermal Properties of
CuSiC Composite for Electronic Packaging Application
With the presence of silicon carbide (SiC) as reinforcement, copper silicon carbide (CuSiC) metal matrix composite (MMC) should be able to perform better as a heat spreader or a heat sink than aluminium silicon carbide (AlSiC) metal matrix composite.
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Investigation on fabricating high SiC volume fraction of electronic package shell by means of semi-solid forming
Occhionero M A, et al, “ Aluminum silicon carbide microprocessor lids and heat sinks for integrated,” Thermal Management Solutions 2000 HDI Conference, America, April.
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Computational fluid dynamic and heat transfer analysis of an Al/SiC IGBT power hybrid package
Aluminum Silicon Carbide has evolved as a heat sink material of choice for certain high power hybrid packages.
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High heat flux issues for plasma-facing components in fusion reactors
Low neutron-activation heat sink materials, such as aluminum alloys or silicon carbide /silicon carbon .
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Americam Society of Composites: 29th Technical Conference
Occhionero, M. A., Hay, R. A., Adams, R. W., Fennessy, K. P. and Sundberg, G. " Aluminium Silicon Carbide (AlSiC) Microprocessor Lids and Heat Sinks for Integrated Thermal Management Solutions,", Presented at the IMAPS Denver 2000, HDI and System Packaging conference…
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Precision milling of high volume fraction SiCp /Al composites with monocrystalline diamond end mill
(2000) Aluminum silicon carbide (AlSiC) microprocessor lids and heat sinks for integrated thermal management solutions. Proc. IMAPS, Denver, CO, Apr. 26–28, 2000. http://www.alsic.com/ papers/cpsdenver2000.pdf 4.
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Heat pipe embedded AlSiC plates for high conductivity - low CTE heat spreaders
…Toletant Capillary Two-Phase Loop Technology for Vehicle Thermal Control”, Proceedings of Summer Heat Transfer Conference, Jacksonville Fl, 2008 [4] Occhionero M.A., Hay R.A., et al., “ Aluminum silicon Carbide (AlSiC) Microprocessor Lids and Heat Sinks for Integrated Thermal Management…
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Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration
[9] M. A. Occhionero, R. A. Hay, R. W. Adams, K. P. Fennessy, and G. Sundberg, “ Aluminum silicon carbide (AlSiC) microprocessor lids and heat sinks for integrated thermal management solutions,” in Proc. IMAPS, Denver, CO, Apr. 26–28, 2000, [Online].
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The WIYN one degree imager: project update 2010
The OTA detector packages are directly mounted onto a Silicon Carbide focal plate, which sinks heat through cold straps to an aluminum thermal distribution plate, which itself is connected to four Ricor cryocooling heads.