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Supplier: QUALCOMM, Incorporated
Description: Technology Bluetooth Low Energy Dual-mode Bluetooth Maximum Output Power Up to +9dBm Bluetooth Radio 50O -90dBm receiver sensitivity USB USB Version USB 2.0 Audio
- Bluetooth Compliance: Other
- Bluetooth Component: Bluetooth® Single Chip Solutions
- Interface: USB
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Supplier: QUALCOMM, Incorporated
Description: Entry-level, flash programmable audio platform for Bluetooth speakers QCC3007 Specs Bluetooth Bluetooth Version Bluetooth 5.0 Bluetooth Technology Dual-mode Bluetooth Bluetooth Profiles HFP v1
- Bluetooth Compliance: Other
- Bluetooth Component: Bluetooth® Single Chip Solutions
- Interface: I2C, USB
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Supplier: QUALCOMM, Incorporated
Description: Entry-level, flash programmable audio platform for Bluetooth speakers QCC3006 Specs Bluetooth Bluetooth Version Bluetooth 5.0 Bluetooth Technology Dual-mode Bluetooth Bluetooth Profiles HFP v1
- Bluetooth Compliance: Other
- Bluetooth Component: Bluetooth® Single Chip Solutions
- Interface: I2C, USB
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Supplier: QUALCOMM, Incorporated
Description: Entry-level, flash programmable audio platform for Bluetooth headsets QCC3004 Specs Bluetooth Bluetooth Version Bluetooth 5.0 Bluetooth Technology Dual-mode Bluetooth Bluetooth Profiles HFP v1
- Bluetooth Compliance: Other
- Bluetooth Component: Bluetooth® Single Chip Solutions
- Interface: I2C, USB
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Supplier: Infineon Technologies AG
Description: Applications Adapters and chargers Consumer electronics Mobile devices and smartphones Refrigerators and freezers AIROC™ CYW20721 Bluetooth® and Bluetooth® LE System on Chip The CYW20721 is a Bluetooth® 5
- Bluetooth Component: Bluetooth® EDR Chip
- Features: RoHS Compliant
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Supplier: Infineon Technologies AG
Description: AIROC™ CYW20719 Bluetooth® and Bluetooth® LE System on Chip The CYW20719 is a Bluetooth® 5.1-compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver with Bluetooth® LE, EDR and BR. The device is intended for use in audio, IoT,
- Bluetooth Component: Bluetooth® EDR Chip
- Features: RoHS Compliant
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Supplier: Microchip Technology, Inc.
Description: The BM64 stereo audio module is a fully-certified Bluetooth 5 module for designers who want to add Bluetooth wireless audio and voice applications to their products. This Bluetooth SIG certified module provides a complete wireless solution with Bluetooth
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Supplier: Microchip Technology, Inc.
Description: The IS2020 Stereo Audio Chip is a compact, highly integrated, CMOS single-chip RF and baseband IC for Bluetooth 5.0 applications. This chip is fully compliant with Bluetooth specification and completely backward-compatible with Bluetooth 3.0, 2.0 or
- Interface: I2C
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Supplier: Infineon Technologies AG
Description: Bluetooth® audio interface. This device provides all necessary components required to operate Bluetooth® LE and/or BR/EDR communication standards with a Maximum TX output power of +4 dBm for Bluetooth® Classic, +4 dBm for Bluetooth® Low Energy modes. This highly
- Bluetooth Component: Bluetooth® EDR Chip
- Features: RoHS Compliant
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Supplier: Infineon Technologies AG
Description: -02 supports peripheral functions (ADC and PWM), UART, I2C, and SPI communication, and a Bluetooth® audio interface. This device provides all necessary components required to operate Bluetooth® LE and/or BR/EDR communication standards with a Maximum TX output power of +12 dBm
- Bluetooth Component: Bluetooth® EDR Chip
- Features: RoHS Compliant
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Supplier: TOP-electronics USA
Description: LM746-0421, Bluetooth® v4.1 Dual Mode Multimedia Module The LM746 Bluetooth® Dual Mode audio module is an extremely versatile and cost effective solution. Enabling audio data to be wirelessly communicated between audio devices using a Bluetooth® v2.0, v2.1
- Technology: Bluetooth
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Supplier: TOP-electronics USA
Description: compatible) iBeacon compatible Voice and Data Application support (including VoIP over Bluetooth) Stereo Audio supported 19.47mm x 16mm x 8.1mm FCC, CE/ R&TTE, SRRC, TELEC and SIG Certified Solution RoHS, REACH and WEEE Compliant Solution
- Technology: Bluetooth
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Network and Communication Chips - LM1010-0970, Long Range Bluetooth® v4.0 Dual Mode Adapter -- 17732Supplier: TOP-electronics USA
Description: ) Plug and Play (OS X, Linux and Windows XP – 10 compatible) iBeacon compatible Voice and Data Application support (including VoIP over Bluetooth®) Stereo Audio supported 53mm x 28mm x 14mm (Without SMA Connector) RoHS, REACH and WEEE Compliant Solution
- Technology: Bluetooth
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Supplier: TOP-electronics USA
Description: (HCI) Plug and Play (OS X, Linux and Windows XP – 10 compatible) iBeacon compatible Voice and Data Application support (including VoIP over Bluetooth®) Stereo Audio supported 53mm x 28mm x 14mm (Without SMA Connector) RoHS, REACH and
- Technology: Bluetooth
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Supplier: VAST STOCK CO., LIMITED
Description: Bluetooth Modules (802.15.1) Phantom Bluetooth Audio Receiver
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Supplier: Advance Security Products
Description: Video Surveillance Hidden in a Bluetooth Our Bluetooth DVR records crisp color video and audio at the single press of a button. DVR attaches easily to bag, backpack, shirt, or purse using built-in spring loaded clip. Record video and audio and download the recorded
- Camera Function: Video
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Supplier: VAST STOCK CO., LIMITED
Description: Bluetooth Modules (802.15.1) Class2 v2.1+EDR Audio Mod w/ Int Ant
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Supplier: VAST STOCK CO., LIMITED
Description: Bluetooth Modules (802.15.1) WT32 Audio Mod w/ Chip Ant iWRAP 4.0
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Supplier: VAST STOCK CO., LIMITED
Description: Bluetooth Modules (802.15.1) WT32 Audio Mod w/ Chip Ant iWRAP 5.0
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Supplier: Richardson RFPD
Description: for Bluetooth audio Access point mode for up to 8 stations Hardware encryption engines: AES and TKIP Security: WPA, WAPI, WPA2, WPA3, WPS and Easy Connect Applications/Vertica ls General IoT applications requiring Wi
- Device Type: Receiver
- Technology: GPS
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Supplier: RS Components, Ltd.
Description: AAC audio codecs for stereo audio applications. . Bluetooth 3.0 compliant. Excellent Radio Performance. Integrated chip antenna or U.FL antenna connector. Analog, I2S, PCM, SPDIF, and microphone interfaces. Optional aptX® and AAC stereo audio codecs. Optional CVC®
- Bluetooth Compliance: Other
- Interface: I2C, SPI, UART, USB, Other
- Power Class: Class I
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Supplier: RS Components, Ltd.
Description: The RN52SRC from Microchip is a fully-certified Bluetooth Version 3.0 Module. This particular device from the RN-52 family of products supports Advanced Audio Distribution Profile (A2DP-SRC) for audio streaming as an audio source, providing an integrated solution for
- Bluetooth Compliance: Other
- Interface: SPI, UART, USB, Other
- Power Class: Class II
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Supplier: RS Components, Ltd.
Description: The RN52SRC from Microchip is a fully-certified Bluetooth Version 3.0 Module. This particular device from the RN-52 family of products supports Advanced Audio Distribution Profile (A2DP-SRC) for audio streaming as an audio source, providing an integrated solution for
- Bluetooth Compliance: Other
- Interface: SPI, UART, USB, Other
- Power Class: Class II
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Supplier: RS Components, Ltd.
Description: The RN52 Bluetooth audio module provides a fully integrated solution for delivering high-quality stereo audio in a small form factor. It combines a Class 2 Bluetooth radio with an embedded DSP processor, controlled and configured by simple ASCII commands and GPIO.
- Bluetooth Compliance: Other
- Interface: SPI, UART, USB, Other
- Power Class: Class II
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Supplier: ROHM Semiconductor USA, LLC
Description: BM94715EKU is 1-Chip SOC for multimedia audio systems, which supports the USB memory, SD memory card, and CD. This IC has a built-in ARM946ES processor, SDRAM, and various peripherals. It is designated to download programs from external Serial Flash ROM and execute system control, file
- Features: System-on-Chip
- Interface: I2C, SPI, UART
- Supply Voltage: 3 to 3.6 volts
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Supplier: ODG (Origin Data Global)
Description: BLUETOOTH 5.0 AUDIO SOC
- Device Type: Transceiver
- IC Package Type: Other
- Supply Voltage: Other
- TJ: -40 to 85 C
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Supplier: Eteily Technologies India Pvt. Ltd.
Description: communication, industrial equipment, and scientific devices. The 5.8 GHz frequency, specifically, is commonly used in Wi-Fi applications, Bluetooth, remote sensing, and wireless audio and video transmission. Key features of a 5.8GHz ISM Band Chip Antenna include: Compact
- Form Factor: Internal / Chip
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Supplier: Richardson RFPD
Description: Bluetooth Low Energy Compliant and 2.4-GHz Proprietary System-on-Chip The HS6621 is a power-optimized true system-on-chip (SoC) solution for both Bluetooth low energy and proprietary 2.4-GHz applications. It integrates a high performance and low power RF transceiver with
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Supplier: Nordic Semiconductor ASA
Description: protocols are also supported. It is built around an Arm® Cortex™-M4 CPU with floating point unit running at 64 MHz. It has NFC-A Tag for use in simplified pairing and payment solutions. It has numerous digital peripherals and interfaces such as PDM and I2S for digital microphones and audio.
- Clock Frequency: 64 MHz
- Data Bus: 128 Bit
- Interface: UART
- RAM Size: 0.0320 MB
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Supplier: Win Source Electronics
Description: Protocol: Bluetooth v4.1 Power - Output: 12dBm Sensitivity: -95dBm Current - Receiving: 40.5mA ~ 41.2mA RF Family/Standard: Bluetooth Modulation: GFSK, GMSK Serial Interfaces: I2S, UART Current - Transmitting: 40.5mA ~ 41.2mA Family Name: CC2564 Categories: RF
- Frequency: 2.40E9 Hz
- Interface: Other
- Operating Temperature: -40 to 85 C
- Read Rate: 4000 kbps
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Supplier: Silicon Labs
Description: , enabling devices with integrated Bluetooth to receive FM transmissions without an external FM antenna and transmit the FM content to Bluetooth-enabled headsets. This is the best, most cost-effective solution to enable wire-free FM reception. The Si4705 IC also offers digital
- Device Type: Receiver
- IC Package Type: QFN
- Number of Devices in Package: 1 #
- Number of Receivers: 1 #
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Supplier: Microchip Technology, Inc.
Description: ATWILC3000 is a single chip IEEE 802.11 b/g/n RF/Baseband/MAC link controller and Bluetooth 5 IC. The ATWILC3000 connects to Microchip AVR/SMART MCUs, SMART MPUs, FPGAs and other processors with minimal resource requirements and a simple SPI/SDIO-to-Wi-Fi and UART-to-Bluetooth
- Operating Temperature: -40 to 85 C
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Supplier: SECO
Description: and encoders as well as two image signal processors (Dual-ISP - Dual Image Signal Processor). Also, powerful audio and voice functions are available. Displays can be connected via HDMI, (dual-)LVDS or MIPI-DISI interfaces. Besides, the Trizeps VIII Plus extends the functionality of the i.MX
- Capacity: 8000 MB
- Features: Speaker Support
- Memory Type: Other
- Operating Temperature: -40 to 185 F
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Supplier: Microchip Technology, Inc.
Description: MFi, Android, and Bluetooth audio frameworks RTOS Kernels, Express Logic ThreadX FreeRTOS, OPENRTOS, Micriµm, µC/OS and SEGGER embOS
- A/D Converter: Other
- Clock Speed: 200 MHz
- IC Package Type: Other
- Internal RAM Size: 640 KB
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