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Supplier: Microchip Technology, Inc.
Description: The BM64 stereo audio module is a fully-certified Bluetooth 5 module for designers who want to add Bluetooth wireless audio and voice applications to their products. This Bluetooth SIG certified module provides a complete wireless solution with Bluetooth
- Pin Count: 43 #
- Features: Bluetooth, Other
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Supplier: Microchip Technology, Inc.
Description: The IS2020 Stereo Audio Chip is a compact, highly integrated, CMOS single-chip RF and baseband IC for Bluetooth 5.0 applications. This chip is fully compliant with Bluetooth specification and completely backward-compatible with Bluetooth 3.0, 2.0 or
- Pin Count: 48 #
- Features: 3 V, 3.3 V, 3.6V, Bluetooth, Other, QFN, Receiver, Transmitter
- Interface: I2C
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Supplier: QUALCOMM, Incorporated
Description: CSRB5342 dual mode SoC allows rapid development for next generation differentiated wireless gaming controllers enabling low latency control and ultra-low power operation. CSRB5342 specs Bluetooth Bluetooth Version Bluetooth 4.1 Bluetooth Technology Bluetooth Low
- Operating Frequency: 80 MHz
- Features: BGA, Bluetooth, Other, QFN
- Bluetooth Component: Bluetooth® Single Chip Solutions
- Interface: USB
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Supplier: Infineon Technologies AG
Description: AIROC™ CYW20719 Bluetooth® and Bluetooth® LE System on Chip The CYW20719 is a Bluetooth® 5.1-compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver with Bluetooth® LE, EDR and BR. The device is intended for use in audio, IoT,
- TJ: -30 to 85 C
- Features: Bluetooth, Other, RoHS Compliant
- Bluetooth Component: Bluetooth® EDR Chip
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Supplier: RS Components, Ltd.
Description: Bluetooth Audio Module with Wireless Con
- Features: Bluetooth, Other, RoHS Compliant
- Interface: UART
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Supplier: Infineon Technologies AG
Description: Applications Adapters and chargers Consumer electronics Mobile devices and smartphones Refrigerators and freezers AIROC™ CYW20721 Bluetooth® and Bluetooth® LE System on Chip The CYW20721 is a Bluetooth® 5.1-compliant, stand-alone baseband processor with an integrated 2.4
- TJ: -30 to 85 C
- Features: Bluetooth, Other, RoHS Compliant
- Bluetooth Component: Bluetooth® EDR Chip
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Supplier: QUALCOMM, Incorporated
Description: Entry-level, flash programmable audio platform for Bluetooth speakers QCC3007 Specs Bluetooth Bluetooth Version Bluetooth 5.0 Bluetooth Technology Dual-mode Bluetooth Bluetooth Profiles HFP v1.7 A2DP v1.3 AVRCPv1.5 Audio Audio
- Features: Bluetooth, Other, QFN
- Bluetooth Component: Bluetooth® Single Chip Solutions
- Interface: I2C, USB
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Supplier: QUALCOMM, Incorporated
Description: Flash Solution for Mono & Stereo Bluetooth Apps The Qualcomm® BlueCore™ 5 multimedia Bluetooth chip is designed to provide a graceful, simple solution to integrating wireless multimedia functionality into embedded devices. BlueCore 5 Specs Bluetooth Bluetooth
- Operating Frequency: 32 MHz
- Features: Bluetooth, Other, QFN
- Bluetooth Component: Bluetooth® Single Chip Solutions
- Interface: PCM, UART, USB
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Supplier: Infineon Technologies AG
Description: SPI communication, and a Bluetooth® audio interface. This device provides all necessary components required to operate Bluetooth® LE and/or BR/EDR communication standards with a Maximum TX output power of +12 dBm for Bluetooth® Classic, +9 dBm for Bluetooth® Low
- TJ: -30 to 85 C
- Features: Bluetooth, Other, RoHS Compliant
- Bluetooth Component: Bluetooth® EDR Chip
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Supplier: Infineon Technologies AG
Description: Infineon’s AIROC™ CYBT-413055-02 is a fully certified dual mode Bluetooth® BR/EDR and Bluetooth® Low Energy wireless embedded module based on a proven hardware design and Infineon’s AIROC™ CYW20719 silicon device. The CYBT-413055-02 includes a royalty-free Bluetooth® stack
- TJ: -30 to 85 C
- Features: Bluetooth, Other, RoHS Compliant
- Bluetooth Component: Bluetooth® EDR Chip
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Supplier: TOP-electronics USA
Description: LM746-0421, Bluetooth® v4.1 Dual Mode Multimedia Module The LM746 Bluetooth® Dual Mode audio module is an extremely versatile and cost effective solution. Enabling audio data to be wirelessly communicated between audio devices using a Bluetooth® v2.0, v2.1
- Features: Bluetooth
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Supplier: VAST STOCK CO., LIMITED
Description: Bluetooth Modules (802.15.1) Phantom Bluetooth Audio Receiver
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Supplier: TOP-electronics USA
Description: LM506, Bluetooth USB Adapter 4.0 Dual Mode Class 2 Host Controller Interface (HCI) via USB Interface The LM506 Bluetooth Smart Ready adapter is a small, simple and highly compatible solution. A plug and play USB adapter, it is compatible with Linux, MAC OSX and Windows XP – 10
- Features: Bluetooth
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Supplier: ROHM Semiconductor USA, LLC
Description: BM94715EKU is 1-Chip SOC for multimedia audio systems, which supports the USB memory, SD memory card, and CD. This IC has a built-in ARM946ES processor, SDRAM, and various peripherals. It is designated to download programs from external Serial Flash ROM and execute system control, file
- Supply Voltage: 3 to 3.6 volts
- Interface: I2C, SPI, UART
- Features: System-on-Chip
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Supplier: Advance Security Products
Description: Video Surveillance Hidden in a Bluetooth Our Bluetooth DVR records crisp color video and audio at the single press of a button. DVR attaches easily to bag, backpack, shirt, or purse using built-in spring loaded clip. Record video and audio and download the recorded
- Camera Function: Video
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Supplier: TOP-electronics USA
Description: data applications. Features: Bluetooth® v4.0 (Backwards compatible with Bluetooth® v2.0, v2.1 and v3.0) USB 2.0 (Full Speed) for data and power source Host Controller Interface (HCI) Plug and Play (OS X, Linux and Windows XP – 10 compatible) iBeacon compatible Voice and Data
- Features: Bluetooth
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Supplier: TOP-electronics USA
Description: developing voice and data applications. Features: Bluetooth® v4.0 (Backwards compatible with Bluetooth® v2.0, v2.1 and v3.0) USB 2.0 (Full Speed) for data and power source Host Controller Interface (HCI) Plug and Play (OS X, Linux and Windows XP – 10 compatible) iBeacon compatible
- Features: Bluetooth
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Supplier: Richardson RFPD
Description: data rates up to 433 Mbit/s (PHY), beamforming Supports 802.11d/e/h/i/k/r/u/v/w/ai Wi-Fi 20, 40, and 80 MHz channels Wi-Fi operation: Station, Access Point (AP) (with up to 10 clients), and Wi-Fi Direct Dual-mode Bluetooth v5.1 Bluetooth and Bluetooth low energy v5.0;
- Technology: GPS
- Device Type: Receiver
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Supplier: ODG (Origin Data Global)
Description: BLUETOOTH 5.0 AUDIO SOC
- TJ: -40 to 85 C
- Sensitivity: -92 dBm
- Features: Other
- Device Type: Transceiver
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Supplier: Richardson RFPD
Description: Bluetooth Low Energy Compliant and 2.4-GHz Proprietary System-on-Chip The HS6621 is a power-optimized true system-on-chip (SoC) solution for both Bluetooth low energy and proprietary 2.4-GHz applications. It integrates a high performance and low power RF transceiver with
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Supplier: Nordic Semiconductor ASA
Description: RAM. The nRF52832 is multiprotocol capable with full protocol concurrency. It supports Bluetooth LE, including the. can be run concurrently with Bluetooth LE, enabling smartphones to provision, commission, configure and control mesh nodes. NFC, ANT and 2.4 GHz proprietary protocols are
- Clock Frequency: 64 MHz
- ROM Size: 2 KB
- RAM Size: 0.032 MB
- Operating Voltage: 1.7 to 3.6 volts
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Supplier: Nordic Semiconductor ASA
Description: such demanding applications. The nRF52840 is fully multiprotocol capable with full protocol concurrency. It has protocol support for Bluetooth LE, Bluetooth mesh, Thread, Zigbee, 802.15.4, ANT and 2.4 GHz proprietary stacks. The nRF52840 is built around the 32-bit ARM® Cortex™-M4 CPU
- Clock Frequency: 64 MHz
- ROM Size: 1,000 KB
- RAM Size: 0.256 MB
- Operating Voltage: 1.7 to 5.5 volts
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Supplier: Eteily Technologies India Pvt. Ltd.
Description: equipment, and scientific devices. The 5.8 GHz frequency, specifically, is commonly used in Wi-Fi applications, Bluetooth, remote sensing, and wireless audio and video transmission. Key features of a 5.8GHz ISM Band Chip Antenna include: Compact Design: The chip antenna
- Form Factor / Mounting: Internal / Chip
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Supplier: Nordic Semiconductor ASA
Description: details on . The nRF5340 SoC supports an extensive range of wireless protocols. It supports Bluetooth LE and is capable of all Angle-of-Arrival (AoA) and Angle-of-Departure (AoD) roles in . In addition, it supports LE Audio, high-throughput 2 Mbps, Advertising Extensions and Long
- RAM Size: 0.512 MB
- Operating Voltage: 1.7 to 5.5 volts
- Operating Temperature: -40 to 221 F
- Processor Core: ARM
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Supplier: Silicon Labs
Description: devices with integrated Bluetooth to receive FM transmissions without an external FM antenna and transmit the FM content to Bluetooth-enabled headsets. This is the best, most cost-effective solution to enable wire-free FM reception. The Si4705 IC also offers digital audio out
- Number of Receivers: 1 #
- Operating Frequency: 64 to 108 MHz
- Pin Count: 20 #
- Number of Devices in Package: 1 #
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Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 1159452-CC2564BRVMT Packaging: Reel - TR Type: TxRx Only Operating Temperature Range: -40°C ~ 85°C Package: 76-VQFN Dual Rows, Exposed Pad Frequency: 2.4GHz Operating Supply Voltage: 2.2 V ~ 4.8 V Protocol: Bluetooth v4.1 Power - Output:
- Frequency: 2,400,000,000 Hz
- Read Rate: 4,000 kbps
- Operating Temperature: -40 to 85 C
- Features: Other
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Supplier: Microchip Technology, Inc.
Description: ATWILC3000 is a single chip IEEE 802.11 b/g/n RF/Baseband/MAC link controller and Bluetooth 5 IC. The ATWILC3000 connects to Microchip AVR/SMART MCUs, SMART MPUs, FPGAs and other processors with minimal resource requirements and a simple SPI/SDIO-to-Wi-Fi and UART-to-Bluetooth
- Operating Temperature: -40 to 85 C
- Device Type: Serial Data Converter
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Supplier: SECO
Description: configurable FPGA, the programmable Kinetis Cortex M0+ MCU, the HiFi Audio Codec and the WLAN/Bluetooth module.
- Capacity: 8,000 MB
- Operating Temperature: -40 to 185 F
- Socket: Card
- Ports / Buses: I2C, PCI Express, SPI, Serial Ports, USB
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Supplier: Microchip Technology, Inc.
Description: Processing Unit (GPU) Audio data communication: I2S, LJ, RJ, USB Audio data control interface: SPI and I2C™ Audio data master clock: Fractional clock frequencies with USB synchronization 12-bit ADC Module: 18Msps rate with six Sample and Hold (S&H) circuits (five dedicated and
- Clock Speed: 200 MHz
- Internal RAM Size: 256 KB
- Internal ROM Size: 2,048 KB
- Number of Timers: 9
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