CMP Slurry

Description: The Lapmaster range of diamond slurries has been formulated for use on many different types of lapping plates and polishing pads. The slurries can be hand sprayed onto the lapping/polishing platen or applied by an electronic dispensing system to control cost and reduce waste. Many

• Abrasive Grain Type: Diamond
• Form: Slurry
• Grading / Grit System: Micron Graded
• Grit Size: 0.1000 to 45

Description: The Lapmaster range of diamond slurries has been formulated for use on many different types of lapping plates and polishing pads. The slurries can be hand sprayed onto the lapping/polishing platen or applied by an electronic dispensing system to control cost and reduce waste. Many

• Abrasive Grain Type: Diamond
• Form: Slurry
• Grading / Grit System: Micron Graded
• Grit Size: 0.1000 to 45

Description: The Lapmaster range of diamond slurries has been formulated for use on many different types of lapping plates and polishing pads. The slurries can be hand sprayed onto the lapping/polishing platen or applied by an electronic dispensing system to control cost and reduce waste. Many

• Abrasive Grain Type: Diamond
• Form: Slurry
• Grading / Grit System: Micron Graded
• Grit Size: 0.1000 to 45

Description: As machining tasks become more critical in the pursuit of maximum efficiency, economy and the perfection of the finished component, so too does the need for best-in-class specialty fluids and abrasive suspensions. Precision Microchemicals Technical Center operates a fully equipped laboratory to

• Form: Slurry

Description: from batch-to-batch. Our soft alumina slurry has shown that when used in select chemistry packages, it can provide good rates and selectivity for Cu CMP applications with superior defectivity performance. The hardness of this particle is slightly lower than an alpha alumina particle

• Abrasive Grain Type: Aluminum Oxide
• Form: Slurry
• Grading / Grit System: Micron Graded
• Products / Materials Finished: Semiconductors / Electronics (Wafers)

Description: The iSIS™1100 Slurry Blending and Distribution System is a high accuracy, low to midvolume slurry system that supports mission-critical CMP processes for R&D or small scale manufacturing applications. The system features MassFusion™ Technology that enables up to ±0.1% blend

• Additional Capabilities: Other Additional Capabilities
• Additional Features: Programmable
• Application / Industry Use: Chemical Processing, Other Applications / Industry
• Display Type: Digital Numerical Display

Description: The iSIS™ 1000 Slurry Blending and Distribution System is a high-accuracy, point-of-use slurry system that supports mission-critical CMP processes for R&D and manufacturing applications. The system features MassFusion™ Technology that enables up to ±0.5% blend

• Additional Capabilities: Other Additional Capabilities
• Additional Features: Programmable
• Application / Industry Use: Chemical Processing, Other Applications / Industry
• Display Type: Digital Numerical Display

Description: The iSIS 2000 is a redundant CMP blend and dispense system for high volume manufacturing applications that delivers high slurry quality and availability. The MassFusion load cell-based blending system supports advanced processes and ensures process stability through high accuracy and

• Additional Capabilities: Other Additional Capabilities
• Additional Features: Programmable
• Application / Industry Use: Chemical Processing, Other Applications / Industry
• Display Type: Digital Numerical Display

Description: The internal structure is proprietarily simple and prevents clogging and cohesion in CMP slurry applications. Pneumatically controlled to provide adjustments in pressure. In case of failure, the valves shuts off flow.

• Port Size: 0.2500 to 0.5000 inch

Description: Semitron® CMP XL20 Polyamideimide PAI shapes were specifically developed for CMP ring applications in the semiconductor and electronics industry, due to their excellent long wear life in CMP slurries. In addition to these characteristics, Semitron® CMP XL20 PAI

• Chemical / Polymer System Type: Polyamide-imide
• Industry: Electronics, Semiconductors / ICs, Other
• Tensile Modulus: 575 ksi
• Tensile Strength (Break): 20000 psi

Description: period to dry on a work piece or polishing cloth, it will dry soft and so reduce scratching otherwise associated with standard colloidal silica re-crystallization. Applications: Chemical - Mechanical Planarization (CMP) of sapphire wafers, silicon wafers, gallium nitride, quartz, ceramics,

• Abrasive Grain Type: Ceramic, Silica
• Form: Liquid / Dispersion, Other
• Grading / Grit System: Micron Graded
• Products / Materials Finished: Ceramics / Glass, Semiconductors / Electronics (Wafers), Specialty / Other

Description: 25g, standard mesh size is 16-35, controllable flow characteristics

• Application: Catalyst, Planarization Slurry (CMP), Specialty / Other
• Glassy / Amorphous: Yes
• Material Type: Ceramic / Carbide, Chemical / Precursor, Nanocomposite
• Type: Nano Powder / Particulate

Description: 100g, for: enhancement of near IR reflection, optical polishing

• Application: Catalyst, Planarization Slurry (CMP), Specialty / Other
• Material Type: Ceramic / Carbide, Chemical / Precursor, Nanocomposite, Other
• Particle / Feature Size: 7 nm
• Specific Surface Area (SSA): 50 m²/g

Description: 25g, standard mesh size is 16-35, controllable flow characteristics

• Application: Catalyst, Planarization Slurry (CMP)
• Glassy / Amorphous: Yes
• Material Type: Ceramic / Carbide, Chemical / Precursor, Nanocomposite
• Type: Nano Powder / Particulate

Description: 1Kg, standard mesh size is 16-35, controllable flow characteristics

• Application: Catalyst, Optoelectronics / Optical Components, Planarization Slurry (CMP)
• Glassy / Amorphous: Yes
• Material Type: Ceramic / Carbide, Chemical / Precursor, Nanocomposite
• Type: Nano Powder / Particulate

Description: The Dymatrix™ Pinch Valve's design provides superior durability and eliminates cohesion and particle generation in CMP slurry applications. The proprietary tube design provides complete seal and full shape restoration. The Dymatrix™ philosophy is CMP valves shouldn't be

• Actuation: Manual / Hand
• Valve Size: 0.2500 to 1 inch
• Valve Type: Pinch Valves

Description: The LFC-7000 Series is a line of high-performance closed-loop flow controllers designed for use in a wide variety of high-purity liquids including DI water, harsh chemicals, and CMP polishing slurries. Features High Accuracy - Controls flowrate to within

• Accuracy: 1 ±% FS
• Control Signal Output: Analog Voltage, Current Loop
• Control Technique: Limit / Set Point Control
• Controller Inputs: DC Voltage Input, Current Loop (Transmitter) Input

Description: The Dymatrix™ Pinch Valve's design provides superior durability and eliminates cohesion and particle generation in CMP slurry applications. The proprietary tube design provides complete seal and full shape restoration. The Dymatrix™ philosophy is CMP valves shouldn't be

• Actuation: Pneumatic
• Valve Size: 0.2500 to 1 inch
• Valve Type: Pinch Valves

Description: The MFC-8100 Series is a closed-loop flow controller designed for use in a wide variety of high-purity liquids including DI water, harsh chemicals and CMP polishing slurries. It is capable of controlling flow rates from 5 mL/min to 1250 mL/min at ±3% accuracy of the 'set point' with a

• Accuracy: 3 ±% FS
• Control Signal Output: Analog Voltage
• Control Technique: Limit / Set Point Control
• Controller Inputs: DC Voltage Input

Description: Asahi's patented Ultrasonic Flow Meter Technology and Dymatrix™ Pinch Valves make Falconics™ the ultimate choice for flow control of CMP slurry. Our ultrasonic technology creates a directionally concentrated and repeatable flow signal despite bubbles and temperature fluctuations

• Liquid Volumetric Flow Rate: 0.0066 to 0.1320 GPM
• Electrical Output: Analog Current, Analog Voltage
• End Fittings: Other
• Media Temperature Range: 59 to 95 F

Description: .0-10.5 Mainly oligomers Internal hydrogen bonding stabilizes solution Aqueous primer, adhesion promoter for resin-to-metal applications Additive for chemical mechanical planarization (CMP) slurries Primary amine and an internal secondary amine coupling agent for UV cure and epoxy

• Flash Point: 230 F
• Ionic Component: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)

Description: with UHP liquid chemicals, DI water and CMP slurries (slurry module with Pt cured Silicone tubing) Mass flow measurement accuracy is independent of fluid density and viscosity

• Accuracy: 1.5 ±% FS
• Control Signal Output: Analog Voltage, Current Loop
• Control Technique: Limit / Set Point Control
• Controller Inputs: DC Voltage Input, Current Loop (Transmitter) Input

Description: The CMFC-5000 Series is a line of high-performance closed-loop flow controllers designed for use in a wide variety of high-purity liquids including DI water, harsh chemicals, and CMP polishing slurries. A typical flow control module consists of a high-accuracy, advanced Coriolis flow

• Accuracy: 1.5 ±% FS
• Control Signal Output: Analog Voltage, Current Loop
• Control Technique: Limit / Set Point Control
• Controller Inputs: DC Voltage Input, Current Loop (Transmitter) Input

Description: operating costs. Plus, the cartridge&rsquo,s stiff construction prevents media migration and particle unloading. Eaton&rsquo,s LOFTREX-C cartridge is designed to handle coarse to fine filtration in a variety of applications, including: paint, CMP slurries, plating solutions, perfumes,

• Assembly / Element Type: Cartridge
• Features: FDA Compliant
• Filter Media: Polypropylene (PP)
• Filtration Grade (Micron Rating): 0.5000 to 150 µm

Description: bath life of the etch solution (e.g. heated KOH). Increase wafer throughput typically by +25%, and reduce cleaning chemical consumption (e.g. SC-1 or EKC-265) in FEOL and BEOL cleaning. Achieve tight control of CMP slurries and better uniformity of the planarization process

• Features: Alarms, Automatic Temperature Compensation, Measures Temperature
• Measurement Scale: RI Detector
• Monitoring: Continuous
• Mounting: Permanent or Fixtured