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Supplier: USUSTK LIMITED
Description: Application: High-power Laser Equipment
- Material: Copper
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Supplier: Boyd
Description: Bonded fin heat sinks are an assembly of a grooved base with individual fins bonded into the grooves. This type of heat sink fabrication allows for higher fin densities and fin aspect ratios which greatly improve thermal performance due to the increased surface area.
- Material: Aluminum, Copper
- Heat sink Fin Style:: Bonded Fin
- Features: Other Materials
- Device: Passive Heat Sink
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Supplier: ToneCooling Technology Co., Ltd
Description: Lasers come in many different qualities,and carbon dioxide lasers are stillused in certain specific situations. However, solid-state lasers are currently the main type, and semiconductorlasers are the most common. The use of crystal” oxygen-free copper heat
- Length: 89.50000000000001 mm
- Width: 89.50000000000001 mm
- Height: 69 mm
- Fan Airflow: 41.4 SCFM
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Supplier: USUSTK LIMITED
Description: Application: High-power Laser Equipment
- Material: Copper
- Device: Liquid Cooler/Cold Plate
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Supplier: USUSTK LIMITED
Description: Application: Laser Equipment
- Material: Aluminum, Copper
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Supplier: ToneCooling Technology Co., Ltd
Description: applications. ToneCooling provides expert insights on a […] This comprehensive guide covers how are heat sinks solutions for industrial and OEM applications. ToneCooling provides expert insights on how […] What Is Choosing Heat Sink Computers Cpu? This guide on Choosing
- Length: 89.50000000000001 mm
- Width: 89.50000000000001 mm
- Height: 69 mm
- Fan Airflow: 41.4 SCFM
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Supplier: LaserStar Technologies Corporation
Description: with little or no warping Repair parting line edges and heat sensitive areas Alloys include tool steel, aluminum, copper, titanium and powdered metals The LaserStar micro welding laser systems produces a high quality result, reduces the amount of handwork required before
- Equipment Type: Complete System
- Process Capability: Laser Welding, Welding Equipment
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Supplier: LaserStar Technologies Corporation
Description: sensitive areas Alloys include tool steel, aluminum, copper, titanium and powdered metals The LaserStar micro welding laser systems produce a high quality result, reduces the amount of handwork required before polishing and practically eliminates sink lines.
- Equipment Type: Complete System
- Process Capability: Laser Welding, Welding Equipment
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Supplier: LaserStar Technologies Corporation
Description: Frequency 1 - 500 kHz Laser Peak Power >10 kW Output Power 10 - 100 Watts Output Fiber Length 3.0 meters Cooling System Fully air cooled, heat-sink Marking Field Size Variable Focusing Optics (mm) 100, 163, 254 1 Profile Laser Visible, red-beam pilot laser for easy
- Wavelength Range: 1,064 nm
- Laser Power: 10,000 to 100,000 milliwatts
- Operating Voltage: 110 to 230 volts
- Repetition Rate: 1,000 to 500,000 Hz
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Supplier: LaserStar Technologies Corporation
Description: FiberCube Laser Marking Sources offer the benefits of a Direct Metal Marking, non-contact, abrasion-resistant, permanent laser marking onto almost any type of material. High-speed, high precision, micro-marking, laser engraving and laser cutting FiberStar laser
- Laser Output Power: 10 to 100 watts
- Type: Complete / Turnkey System
- Options / Components: Laser Head / Focusing Unit, Laser Optics / Beam Delivery, Laser System Enclosure
- Laser Operation: Laser Marking
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Supplier: Peridot Corporation
Description: shop to make fixturing. Torch brazing, induction heating, furnace brazing, resistance welding, laser welding and hand soldering are just a few of our joining proficiencies.
- Process Capability: Active Brazing / Soldering, Furnace, Gas / Oxyfuel Torch, Induction / RF, Laser, Resistance / Conventional
- Applications / Industry: Aerospace / Avionics, Electrical Parts / Assemblies (Contacts, Connectors, etc.), Heat Sinks / Thermal Management, Medical Devices / Health Care, Process Equipment (Heat Exchangers, Tanks, etc.), Specialty / Other, Tool & Die, Tubing Assembly / System
- Additional Services: Assembly, CAD / CAM Support, Design Assistance, Fixture Design / Fabrication, High Volume Production, Low to Mid Volume Production, Machining, Testing and Inspection
- Services: Braze-Welding, Brazing, Soldering
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Supplier: Plansee SE
Description: conductivity and appropriate thermal expansion properties to dissipate heat reliably in electronic components. The diagram shows the generic structure of a hermetically sealed electronic package. We have the ideal material. Our MoCu and WCu composites and Mo/Cu laminates reliably dissipate
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Supplier: ToneCooling Technology Co., Ltd
Description: insights on how […] What Is Choosing Heat Sink Computers Cpu? This guide on Choosing the right heat provides key insights for engineers and […] Introduction — Heat sink skiving Heat sink skiving is a big deal in the electronics industry. This involves
- Material: Copper
- Features: Other Materials
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Description: problems associated with microelectronic applications. Proper material selection is fundamental to an efficient thermal management solution. We offer technically robust, advanced thermal management materials, such as molybdenum/copper (MoCu), copper/molybdenum copper (CMC), and
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Description: Composite heat-sinks made of molybdenum/copper (Mo/Cu) or copper tungsten (Cu/W) are then integrated into strategic locations of the structure. This combination of titanium and Mo/Cu or Cu/W is ideal for achieving lightweight, low-coefficient of thermal expansion (CTE),
- Features: Other
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Supplier: Boyd
Description: or challenging geometries & designs CNC laser, turret punch press & wire cutting, including materials as thin as 3mm, ideal for quick turn arounds & prototyping Metal forming: roll forming, bending, shearing, shaping Robotic laser & spot welding Deburring, graining, polishing,
- Secondary Operations: CNC Machining, Drilling / Tapping, Heat Treating / Stress Relieving, Painting / Powder Coating, Tool Making, Welding
- Features: East Asia / Pacific Only, Europe Only, North America, Oceania Only, Other
- Materials: Ferrous Metals, Nonferrous Metals
- Stamping Capabilities: Progressive Dies
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Supplier: ToneCooling Technology Co., Ltd
Description: unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance
- Device: Liquid Cooler/Cold Plate
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Description: PA&E offers vacuum brazing processes to join dissimilar materials such as titanium, alumina, Zirconia, and more. Bonding Solutions for Electronic Packaging Our experienced staff of material scientists and process engineers can meet the highest demands for quality — through finite control of these
- Process Capability: Active Brazing / Soldering, Furnace, Laser, Resistance / Conventional
- Applications / Industry: Aerospace / Avionics, Electrical Parts / Assemblies (Contacts, Connectors, etc.), Heat Sinks / Thermal Management, Medical Devices / Health Care, Specialty / Other
- Materials: Aluminum, Ceramics / Ceramic-to-Metal, Copper / Copper Alloy, Dissimilar Materials, Steel - Stainless, Titanium Alloy
- Services: Braze-Welding, Brazing, Soldering
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Supplier: FX PCB Co., Ltd.
Description: will imprint the layout on the copper base. Printing the layout on the copper base using the Cloth Iron takes 20 to 30 seconds. It leaves a laser ink trace on the base. With a scrubber, we will remove the trace of the laser ink from the copper base. It needs
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Supplier: DigiKey
Description: Heat Sink TO-220 Copper 0.5W @ 20°C Board Level, Vertical
- Thermal Resistance: 12 °C / W
- Mounting: Clips, Socket Mount
- Material: Copper
- Device: Passive Heat Sink
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Supplier: RS Components, Ltd.
Description: Heat pipe 3mm OD, 100mm, 15W, sintered
- Length: 100 mm
- Width: 3 mm
- Height: 3 mm
- Material: Copper
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Supplier: USUSTK LIMITED
Description: Application: Telecommunication Equipment
- Material: Aluminum, Copper
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Supplier: Dynatron Corp.
Description: CPU Support : AMD® Socket AM2/AM2+/AM3 CPU Socket : AM2/AM2+/AM3 Solution : 70 x 70 x 15 aluminum blower, Copper Heatsink, 1U server solution
- Length: 106.00000000000001 mm
- Width: 79 mm
- Height: 27.5 mm
- Weight: 510 g
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Supplier: TONGYU Technology Co., Ltd.
Description: Name: CPU Liquid Cooler Item No.: TY-C03 Material: C1100 Appearance: No oxidation, inner and outer surfaces clean, no impurities Parameters: 200PSIto detect leak Application: PC Liquid cooling, CPU heatsink, water cooling, thermoelectric cooling system Custom Design: Available
- Material: Copper
- Device: Liquid Cooler/Cold Plate, Thermo-Electric Cooler
- Features: Other Materials
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Supplier: Sanyo Denki America, Inc.
Description: CPU cooler for Intel® Pentium4 (Socket478).
- Length: 95 mm
- Width: 90 mm
- Height: 62 mm
- Weight: 450 g
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Supplier: Newark, An Avnet Company
Description: HEAT SINK, COPPER, SMD; Thermal Resistance:-; Packages Cooled:TO-263; External Width - Metric:25.4mm; External Height - Metric:19.38mm; External Length - Metric:11.43mm; External Diameter - Metric:-; Heat Sink Material:Copper RoHS Compliant: Yes
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Supplier: Mi-Tech Metals
Description: Small space, big capacity. Mi-Tech developers designed our copper tungsten composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion
- Thermal Resistance: 0.68 °C / W
- Material: Copper, Mixed Material
- Features: Other, Other Materials
- Device: Passive Heat Sink
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Supplier: Newark, An Avnet Company
Description: LIQUID COLD PLATE, 4-PASS, 12 INCH; Thermal Resistance:-; Packages Cooled:-; External Width - Metric:-; External Height - Metric:-; External Length - Metric:305mm; External Diameter - Metric:-; Heat Sink Material:Aluminium, Copper RoHS Compliant: Yes
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Supplier: Boyd
Description: For high volume production, Aavid zipper fins are the most cost efficient method for high fin density heat sinks. These fins are made from a stamped material, typically aluminum or copper, and are folded into shape with interlocking grooves. The fins are then typically soldered,
- Material: Aluminum, Copper
- Features: Other
- Device: Passive Heat Sink
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Supplier: Cooliance
Description: Custom heat pipes Cooliance offers a wide range of heat pipes. The path, length and width of heat pipes vary from application to application so most heat pipes are custom designed. Cooliance can integrate heat pipes with remote cool plates or heat
- Material: Aluminum, Copper
- Heat sink Fin Style:: Heat Pipes
- Device: Passive Heat Sink
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Supplier: Newark, An Avnet Company
Description: LIQUID COLD PLATE, 6-PASS, 24 INCH; Thermal Resistance:-; Packages Cooled:-; External Width - Metric:-; External Height - Metric:-; External Length - Metric:610mm; External Diameter - Metric:-; Heat Sink Material:Aluminium, Copper RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: HEAT SINK, COPPER, 58X58X11MM; Thermal Resistance:7.7°C/W; Packages Cooled:-; External Width - Metric:58mm; External Height - Metric:10.92mm; External Length - Metric:58mm; External Diameter - Metric:-; Heat Sink Material:Copper RoHS Compliant: Yes
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Supplier: Ohmite Manufacturing Co.
Description: The Ohmite CP4 series Liquid Coldplates are designed for Ohmite heatsinkable type resistors, such as TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages. The CP4 series also provides maximum heat removal for SCRs, rectifiers, diodes, thyristors, and other high-power
- Length: 114.29993827803334 mm
- Width: 152.39991770404444 mm
- Height: 19.049989713005555 mm
- Weight: 805.0000000000001 g
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Supplier: Boyd
Description: of a custom heat sink, or utilized in a thermal system such as a heat exchanger. Benefits/Features Materials of Construction: Aluminum-Carbon Steel Alloys Copper Cupro Nickel Inconel Nickel Alloys Stainless Steel Design Configuration: Custom Flat Crested Lanced and Offset
- Height: 0.76 to 50.800000000000004 mm
- Material: Aluminum, Copper, Mixed Material
- Heat sink Fin Style:: Folded Fin
- Features: Other Materials
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Supplier: Airflow/Y.S. Tech, Inc.
Description: CAD modeling, contact analysis, spring pressure, and interface materials. Style Options for Custom Heat Sinks Castings Pin fin heatsinks Skived fin heatsinks High aspect ratio heatsinks Extrusion Thermal modules Material Options for Custom Heat Sinks Aluminum heat
- Length: 19 to 482 mm
- Material: Aluminum, Copper
- Device: Passive Heat Sink
- Heat sink Fin Style:: Straight Fin
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Electronic devices often face overheating issues that can reduce performance, shorten lifespan, and increase maintenance costs. Our high-efficiency copper heat sink is engineered to tackle these challenges, providing reliable thermal dissipation even in space (read more)
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impact overall performance. Tone Cooling Copper Heat Sinks are engineered for applications requiring efficient heat transfer and stable thermal performance. Compared with conventional aluminum solutions, copper offers superior thermal conductivity, helping (read more)
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The USUSTK C1020 Copper Skived Fin Heat Sink is designed for component-level electronic cooling in industrial equipment, power electronics and automation systems. Manufactured from C1020 oxygen-free copper, the heat sink combines precision skiving with CNC machining. The fins are formed (read more)
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Forging is a manufacturing process involving metal shaping by localized compressive forces. Rego's Precision Forge Technology is capable to produce both aluminum and copper heat sinks. These sinks are processed with high pressure, below temperatures of 300°C. Under this circumstance, forged (read more)
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The Extruded Aluminum Heat Pipe Heat Sink is designed to provide efficient thermal management for demanding telecommunication equipment. Manufactured from AL6063 aluminum and Cu1020 copper, the heat sink combines the lightweight, high-thermal-conductivity properties of extruded aluminum with the (read more)
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High-Performance Aluminum Heat Sink for Effective Thermal Management Aluminum heat sinks are designed to effectively dissipate heat from critical components, ensuring optimal performance across various applications. With exceptional thermal conductivity, they enhance cooling (read more)
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boards, let’s see its uses in different sectors. You will see the maximum use of heavy copper PCBs in power modules. It is used expansively in the electrical and power industries for greater heat sink and voltage-carrying capacity. The next bis use of these PCBs is seen in (read more)
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. While its high thermal conductivity makes copper the ideal material for heat exchangers, the properties of the material can create challenges when using an AM system. The laser sintering of copper powder with an infra-red laser at a wavelength of 1070 nm is difficult, because copper is very (read more)
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Indicates content that may require registration and/or purchase.
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Thermal resistance and temperature distribution in double-heterostructure lasers: Calculations and experimental results
A value of 22”C/W has been achieved in a reproduciblemanner for 6 X 300 pm lasers mountedon copper heat sinks .
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High-power single-mode operation in DFB and FP lasers using diffused quantum-well structure
lateral dimension of the laser and copper heat sink are assumed identical in order to reduce our computational effort.
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Electro-optic Q-switched Yb:YAG slab laser
Q. Liu, M. Gong, et al.: Electro-optic Q-switched Yb:YAG slab laser . copper heat sink . front mirror . water PVC tube . indium foil . polariz output mirror .
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High power semiconductor laser sources for defense and security: a review of current technology
The mismatch in coefficient of thermal expansion between GaAs lasers and copper heat sinks in combination with the high modulus, shear strength and solidification temperature of eutectic AuSn, requires a GaAs die to be mated with an expansion-matched heat sink material.
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Advances in photonics thermal management and packaging materials
Diamond-particle-reinforced- copper diode laser heat sinks .
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Optimization of microchannel heat sinks for high-power diode lasers in copper technology
micro channel, heat sink, micro cooler, micro channel heat sink, copper heat sink , laser diode, laser array, high power laser diode, micro cooling system .
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10-GHz passively mode-locked surface-emitting semiconductor laser with 1.4 W output power
Afterwards the GaAs is removed by etchingafter the stnictnre is metallized and solderedon a copper heat sink The laser cavity is V-shaped (Fig. 1) with an 15mm output coupler with 2.5% transmission, the VECSEL as folding mirror, and the SESAM…
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Study of the mechanism of “smile” in high power diode laser arrays and strategies in improving near-field linearity
For GaAs-based laser chip and copper heat sink , equation 2 describes the stress as follows, /( .
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Thermal resistance in dependence of diode laser packages
Nevertheless the lifetime is still limited due to the use of indium soft solder for mounting the laser on the copper heat sink .
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Preparation and property study of gold-tin alloys for packaging of high-power semiconductor lasers
Using AlN as submount matching the TEC of laser chip and copper heat sink without increasing the thermal resistance remarkably , which reduce the thermal stress when lasers are in operation.