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Supplier: Rego Electronics Inc.
Description: Heat Sink : Forged AL1070 fins with C1100 Base, 60 x 60 x 16 mm Fan : 50 x 50 x 10mm / 50 x 50 x 20 mm, Two Ball Bearing Connector Type : 3 ways / 4 ways Screw & Back Plate : rPGA Socket CPU / BGA Package CPU
- Length: 60 mm
- Width: 60 mm
- Height: 16 mm
- Device: Passive Heat Sink
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Description: The traditional copper water-cooled plates are brazed or buried copper tubes, the processing technology is complicated, the contact thermal resistance is large, and the cost is high: Wanbang uses friction stir welding to weld copper water-cooled plates. Low
- Device: Passive Heat Sink
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Supplier: Richardson RFPD
Description: Wakefield- Vette’s fully buried tube liquid cold plates have the ability to cool both sides of the cold plate because of it’s positioning within the base plate. Another key feature of the fully buried tube is that it is not exposed to the outside environment. Some engineers
- Device: Liquid Cooler/Cold Plate
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Supplier: Mi-Tech Metals
Description: Small space, big capacity. Mi-Tech developers designed our copper tungsten composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion
- Thermal Resistance: 0.68 °C / W
- Material: Copper, Mixed Material
- Features: Other, Other Materials
- Device: Passive Heat Sink
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Supplier: Boyd
Description: Bonded fin heat sinks are an assembly of a grooved base with individual fins bonded into the grooves. This type of heat sink fabrication allows for higher fin densities and fin aspect ratios which greatly improve thermal performance due to the increased surface area.
- Material: Aluminum, Copper
- Heat sink Fin Style:: Bonded Fin
- Features: Other Materials
- Device: Passive Heat Sink
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Supplier: ToneCooling Technology Co., Ltd
Description: expert insights on how […] What Is Choosing Heat Sink Computers Cpu? This guide on Choosing the right heat provides key insights for engineers and […] Introduction — Heat sink skiving Heat sink skiving is a big deal in the electronics industry. This
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Supplier: FX PCB Co., Ltd.
Description: problem with the dissipation of heat loss from processors. There are various ways to connect a heat sink to the heat source. A separate metal heat sink must be made to fabricate a heat sink PCB. Then, producers will affix this heat
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Supplier: Richardson RFPD
Description: The 219 Series heat sinks unique design (Patent Pending) combines the technology of automatically assembling the tin plated solderable wires/rods with that of extruded aluminum anodized heat sink body to configure these SMT heat sinks. Rods/wires named
- Height: 11.683993690643408 mm
- Thermal Resistance: 4 °C / W
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Supplier: USUSTK LIMITED
Description: Application: High-power Laser Equipment
- Material: Copper
- Device: Liquid Cooler/Cold Plate
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Supplier: ToneCooling Technology Co., Ltd
Description: applications. ToneCooling provides expert insights on a […] This comprehensive guide covers how are heat sinks solutions for industrial and OEM applications. ToneCooling provides expert insights on how […] What Is Choosing Heat Sink Computers Cpu? This guide on Choosing
- Length: 89.50000000000001 mm
- Width: 89.50000000000001 mm
- Height: 69 mm
- Fan Airflow: 41.4 SCFM
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Supplier: Newark, An Avnet Company
Description: HEAT SINK CLIP; Accessory Type:Heat Sink Clip; For Use With:Molex 74768 Series QSFP I/O Connectors; Product Range:74768 Series; Connector Mounting:PCB Mount; Contact Material:Copper Alloy; Contact Plating:Nickel Plated Contacts RoHS Compliant: Yes
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Supplier: Lake Shore Cryotronics, Inc.
Description: Heat sink bobbins for cryostat lead wires are gold-plated OFHC or ETP copper for removing heat flowing down sensor leads. The small bobbin holds 4 to 8 phosphor bronze or manganin wires, and the large bobbin holds up to 40, depending on wire gauge and number of wraps. 4
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Supplier: Xoxide
Description: Weight: 550g (Heatsink only) Total Height of Heatsink: 70.2 mm Heat Pipes: 6 x Heat Pipes w/ Nickel-Plating Heatsink Base : Copper Recommended Fans (Optional): 120mm or 140mm Fan Compatibility: CPU Compatibility: Supports Intel Socket 775 Motherboard / Socket 1366 (Optional)
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Supplier: Allied Electronics, Inc.
Description: Electrical Specifications. Max. Operating Voltage: 150 V. Power Rating: 20 W. Heat Sink Plate: Black anodized aluminum. Heat sink dependent; must be attached to a proper heat sink for full power rating. Max. case temp. cannot exceed 150°C. Features
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Supplier: ToneCooling Technology Co., Ltd
Description: ago. The power density was relatively low, and tin was typicaly used as solder.Oxygen-free copper heat sinks can be utiized,nickel-plated instead of gold-plated,but gold-plated soldering offers betterreliabiity.The tungsten copper bar structure was developed to meet the
- Length: 89.50000000000001 mm
- Width: 89.50000000000001 mm
- Height: 69 mm
- Fan Airflow: 41.4 SCFM
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Supplier: ToneCooling Technology Co., Ltd
Description: particles and the copper alloy create a metallurgical bonding interface, resulting in the diamond copper composite material possessing outstanding thermal conductivity and a suitable thermal expansion coefficient. Diamond aluminum, similar to diamond copper, has a lower density,
- Length: 89.50000000000001 mm
- Width: 89.50000000000001 mm
- Height: 69 mm
- Fan Airflow: 41.4 SCFM
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Supplier: Boyd
Description: Aavid, Thermal Division of Boyd Corporation’s tube liquid cold plates feature copper or stainless steel tubing pressed into aluminum plates. Tube cold plates feature a joint free continuous tube mechanically interlocked into an extruded aluminum plate. These cost
- Length: 152.4 to 304.8 mm
- Width: 88.9 to 127 mm
- Weight: 400 to 900 g
- Material: Aluminum
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Supplier: Boyd
Description: contact possible to minimize interface resistance between all contact surfaces. To further increase performance, a thermal epoxy is applied to the tube/plate joint to provide a gap-free thermal interface between the tube and cold plate. Aavid’s patented Hi-Contact™ liquid cold
- Length: 57.2 to 609.6 mm
- Width: 57.2 to 177.8 mm
- Height: 14.000000000000002 to 15.200000000000001 mm
- Material: Aluminum
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Supplier: Newark, An Avnet Company
Description: LIQUID COLD PLATE, 4-PASS, 12 INCH; Thermal Resistance:-; Packages Cooled:-; External Width - Metric:-; External Height - Metric:-; External Length - Metric:305mm; External Diameter - Metric:-; Heat Sink Material:Aluminium, Copper RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: LIQUID COLD PLATE, 6-PASS, 24 INCH; Thermal Resistance:-; Packages Cooled:-; External Width - Metric:-; External Height - Metric:-; External Length - Metric:610mm; External Diameter - Metric:-; Heat Sink Material:Aluminium, Copper RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: LIQUID COLD PLATE, 6-PASS, 6 INCH; Thermal Resistance:-; Packages Cooled:-; External Width - Metric:-; External Height - Metric:-; External Length - Metric:152mm; External Diameter - Metric:-; Heat Sink Material:Aluminium, Copper RoHS Compliant: Yes
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Supplier: Ohmite Manufacturing Co.
Description: The Ohmite CP4 series Liquid Coldplates are designed for Ohmite heatsinkable type resistors, such as TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages. The CP4 series also provides maximum heat removal for SCRs, rectifiers, diodes, thyristors, and other high-power
- Length: 114.29993827803334 mm
- Width: 152.39991770404444 mm
- Height: 19.049989713005555 mm
- Weight: 805.0000000000001 g
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Supplier: National Bronze & Metals Inc.
Description: welding tips, flash welding electrodes, electrical and thermal conductors requiring greater strength than copper, switch contacts. Typical Uses for C18200 Chromium Copper: CONSUMER: Pencil-type & Light Soldering Guns: Tips, Rod Extensions ELECTRICAL: Switch Contacts, Electric Motor and
- UNS Number: 18,200
- AISI / AA / CDA Grade: 182
- Overall Width / OD: 0.375 to 2 inch
- Overall Thickness: 0.375 to 2 inch
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Supplier: National Bronze & Metals Inc.
Description: welding tips, flash welding electrodes, electrical and thermal conductors requiring greater strength than copper, switch contacts. Typical Uses for C18200 Chromium Copper: CONSUMER: Pencil-type & Light Soldering Guns: Tips, Rod Extensions ELECTRICAL: Switch Contacts, Electric Motor and
- OD / Width: 0.125 to 3.5 inch
- Length: 144 inch
- Thickness: 0.25 to 1.5 inch
- Conductivity: 80 %IACS
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Supplier: National Bronze & Metals Inc.
Description: C18000 Copper Chromium Nickel Silicon RWMA Class III Economical high strength, high conductivity copper base alloy. It is a heat treatable copper base alloy and its excellent properties are obtained largely through heat treatment. Its properties combine high
- UNS Number: 18,000
- AISI / AA / CDA Grade: 180
- CDA Grade: 180
- UNS C Number: 18,000
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Supplier: Plansee SE
Description: structure, our materials experts will be happy to help. Finished parts matched to your application. We supply our materials in the form of sheets, pre-cut components and plates or as finished heat spreaders, base plates and submounts. Coatings protect the materials against
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Supplier: Cooliance
Description: Custom heat pipes Cooliance offers a wide range of heat pipes. The path, length and width of heat pipes vary from application to application so most heat pipes are custom designed. Cooliance can integrate heat pipes with remote cool plates or heat
- Material: Aluminum, Copper
- Heat sink Fin Style:: Heat Pipes
- Device: Passive Heat Sink
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Supplier: Cooliance
Description: transfer. Our advanced copper embedding process allows us to insert a copper spreader plate as part of the forging process. These heat sinks provide exceptional performance at a cost effective price. Cooliance's heat pipe technology can also be combined to
- Material: Aluminum, Copper
- Device: Passive Heat Sink
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Supplier: Xoxide
Description: socket G34 (with separate BLT-CPAMDG34) Intel socket LGA 1155/1156 Intel socket LGA 1366 Intel socket LGA 775 Specifications: Model CPU-370 Materials Copper Cold Plate, Brass Top, N ickel-Plating, Stainless Steel Jet Plate Tubing Size, ID Any Product Dimensions WxHxD w/ Intel
- Device: Cold Plate
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Supplier: VAST STOCK CO., LIMITED
Description: CPU & Chip Coolers Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * B = Bore hole
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Supplier: Corsair Memory
Description: low-profile, light-weight cooling unit with a micro-channel copper cold plate and a split-flow manifold. The result of all this attention to fluid dy
- Device: Cold Plate, Liquid Cooler/Cold Plate
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Supplier: Plansee SE
Description: Wafer substrates are bonded to the semiconductor layers of LED chips. With molybdenum and molybdenum-copper wafer substrates, PLANSEE offers the optimum material for a reliable heat dissipation in LED chips. The uniform thermal expansion of the wafer substrate, sapphire substrate and
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Supplier: Xoxide
Description: Features: Designed for the XBOX 360 GPU, to provide better cooling and heat dissipation, reduces the chances of break down, and prolongs GPU usage. Four dedicated heatpipe design. Nickel plated heatsink, and soldered with the finest work. Note: If you are considering of installing the TR 360
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Supplier: TONGYU Technology Co., Ltd.
Description: Name: CPU Liquid Cooler Item No.: TY-C03 Material: C1100 Appearance: No oxidation, inner and outer surfaces clean, no impurities Parameters: 200PSIto detect leak Application: PC Liquid cooling, CPU heatsink, water cooling, thermoelectric cooling system Custom Design: Available
- Material: Copper
- Device: Liquid Cooler/Cold Plate, Thermo-Electric Cooler
- Features: Other Materials
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Supplier: Xoxide
Description: LGA 1366, & LGA 1156 Dissipates Heat Efficiently through Copper Fins Four Copper Heatpipes Solid Copper Base w/ Pristine Finish Quiet 120mm Cooling Fan (Variable Speed PWM) Ideal for Use w/ HTPC Specifications: Material: Solid Copper Base w/ Aluminum Cooling Fins
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tube to remove heat from laser components and transfer it away from the cooling surface. The tube layout can be configured to distribute cooling across different heat-generating areas of the plate. The aluminum base provides the required mounting and structural surface, while the C1020 copper tube offers a highly conductive coolant path. Anti-oxidation treatment helps reduce surface oxidation and discoloration during industrial use. Plate dimensions, copper tube routing, inlet and outlet... (read more)
Browse Heat Sinks Datasheets for USUSTK LIMITED -
The USUSTK Copper Pin-Fin Liquid Cold Plate is designed for thermal management of IGBT and SiC power modules used in electric vehicles, electric drive systems, inverters and other high-power electronic equipment. Manufactured from T2 copper or C11000 copper, the cold plate uses precision cold forging to form multiple dense pin-fin arrays directly from the copper base. The integral pin-and-base structure eliminates separate fin attachment interfaces and provides a continuous thermal path between... (read more)
Browse Heat Sinks Datasheets for USUSTK LIMITED -
The USUSTK C1020 Copper Cold Plate is designed for liquid cooling in data-center servers and high-density computing equipment. Manufactured from C1020 oxygen-free copper, the cold plate combines precision skiving with CNC machining. The skived heat-transfer structure increases the available contact area between the copper and circulating coolant, supporting efficient heat removal from high-power computing components. CNC machining provides accurate contact surfaces, mounting holes... (read more)
Browse Heat Sinks Datasheets for USUSTK LIMITED -
The USUSTK Copper-Aluminum Hybrid Liquid Cold Plate is designed for thermal management in high-power laser systems, laser sources, photonics equipment and industrial optoelectronic applications. The hybrid structure combines an AL6061 aluminum base with C1020 copper thermal-contact sections. Copper provides high thermal conductivity around concentrated heat-load areas, while the aluminum structure provides mechanical support and helps balance thermal performance, structural strength and overall... (read more)
Browse Heat Sinks Datasheets for USUSTK LIMITED -
Roll Formed Heat Transfer Plates. Heat transfer plates are ideally and economically produced using our roll forming processes. Critical to home and industrial heating systems, PEX is fast becoming the chosen alternative to rigid metal tubing and heat transfer plates made by MP Metals are your best bet when increasing the efficiency of your heating systems. Omega shaped transfer plates allow for faster and more efficient heat dissipation. They are made in a variety of gauges, shapes and sizes... (read more)
Browse Datasheets for MP Metal Products -
Critical Thermal Management for High-Power MOSFETs. High-power MOSFETs generate significant heat during operation. Excessive temperature can reduce efficiency, cause thermal stress, and shorten component lifespan. Tailored liquid cooling plates provide precise heat dissipation, protecting your MOSFETs in demanding environments. Custom Design and High Performance. Precision Engineering: Each cooling plate is designed to match the exact layout and thermal profile of your MOSFETs. High Thermal... (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Efficient Cooling, Stable Operation: The L20 liquid cooling plate features an advanced liquid cooling circulation system, paired with a large pure copper base and high-density cooling fins. It rapidly dissipates heat generated by the GPU, effectively lowering GPU temperatures and ensuring system stability, preventing performance throttling or crashes caused by overheating. Quiet Operation, Immersive Experience: Compared to traditional air coolers, the L20 liquid cooling plate operates more... (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
The NVIDIA GPU H800 single-width liquid cooling plate is designed to deliver efficient heat dissipation in high-performance computing environments, ensuring systems operate at peak efficiency. Key features include: High Thermal Conductivity: Quickly transfers heat from the GPU/CPU to the coolant for optimal heat dissipation. Customizable Options: Available in multiple sizes and configurations to fit various CPUs and GPUs for broad compatibility. Precision Crafting: Built with high accuracy... (read more)
Browse CPU Coolers Datasheets for ToneCooling Technology Co., Ltd -
Advantages of the Birch Stream Liquid Cooling Plate: Efficient Heat Dissipation, Stable Operation: The Birch Stream liquid cooling plate features an advanced liquid cooling circulation system, paired with a large pure copper base and high-density cooling fins. It rapidly dissipates heat generated by the CPU, effectively lowering CPU temperatures and ensuring system stability, preventing performance throttling or crashes caused by overheating. Quiet Operation, Immersive Experience: Compared... (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Syst emes SOLIDWORKS Corp. Thermal Design_Case Study A. Application : Medical Pad. IP54 Waterproof. Temperature on Chassie must below 40 deg C. Multi-chips heat source. Thermal module solution. Aluminium plate assembled with heat pipes and stamped aluminum fins / IP55 4510 Blower. Thermal Design_Case Study B. Application : Industrial Computer. Fanless thermal design. TDP 25 watts. Thermal module solution. Extruded aluminium top cover assembled with heat pipes, copper / aluminium blocks and riveted... (read more)
Browse Edge Connectors Datasheets for Rego Electronics Inc.
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Electromagnetically-driven ultra-fast tool servos for diamond turning
Copper plate heat sink .
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Design of micro-channel heat sink with diamond heat spreader for high power LD
In this study, a type of water cooled copper plates heat sink with micro-channels for high power LD is designed and simulated with Computational Fluid Dynamics (CFD) and Numerical Heat Transfer (NHT) methods as follows.
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Light Emitting Diodes And Injection Lasers For Fiber Optic Communication Systems
Laser chips are usually soldered with the p -side shown to a gold plated copper heat sink .
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High bandwidth rotary fast tool servos and a hybrid rotary/linear electromagnetic actuator
292 4-82 Copper plate heat sink with the four power operational amplifiers and nine cooling fans for the 10 kHz FTS. . . . . . . . . . . . . . .
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Thermal conductivity of graphene in Corbino membrane geometry
…expected and seen in this fig- ure, the laser excitation heats locally the membrane most efficiently when the laser spot is at the center of the mem- brane and significantly less when it is placed closer to the copper plate heat sink .
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High power AlGaAs window lasers
The devices are mounted either junction- side -up to gold plated copper heat sinks , or junction- side -down to thermal expansion matched Silicon submounts.
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1.55µm BH-DFB lasers grown by LP-MOCVD
After metallisation, the wafer was cleaved to obtain 240pm -long laser chips which were bonded with In onto Ni plated copper heat sinks .
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Mode-Controlled Galnasp-Inp Long Wavelength Lasers
Room temperature CW operation of these lasers was also obtained by bonding the laser chips on In- plated copper heat sinks .
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Development of lead-chalcogenide tunable diode lasers for 3 to 40 &mgr;m spectral region at Lebedev Physical Institute
packaged by In-welding to In- plated copper heat sink .
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Dynamics of Plasma-Surface Interactions using In-situ Ion Beam Analysis
Samples are mounted to a 10 cm · 9 cm copper plate heat sink suspended in the vessel from above.