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Supplier: Rego Electronics Inc.
Description: Heat Sink : Forged AL1070 fins with C1100 Base, 60 x 60 x 16 mm Fan : 50 x 50 x 10mm / 50 x 50 x 20 mm, Two Ball Bearing Connector Type : 3 ways / 4 ways Screw & Back Plate : rPGA Socket CPU / BGA Package CPU
- Device: Passive Heat Sink
- Heat Sink Fin Style: Straight Fin
- Height: 16 mm
- Length: 60 mm
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Description: The traditional copper water-cooled plates are brazed or buried copper tubes, the processing technology is complicated, the contact thermal resistance is large, and the cost is high: Wanbang uses friction stir welding to weld copper water-cooled plates. Low
- Device: Passive Heat Sink
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Supplier: ToneCooling Technology Co., Ltd
Description: The copper heat sink is renowned for its high thermal conductivity and durability, effectively managing heat in high-power electronic devices and ensuring long-term stable operation. Its compact design is suitable for space-constrained applications, and it supports
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Supplier: Richardson RFPD
Description: the epoxy layer above the tube to protect the tube from leakage. Key Specifications: Base Plate: Extruded Aluminum Copper Tube Material: 0.0375” OD x 0.049” wall Thermal Epoxy fill with high thermal conductivity
- Device: Liquid Cooler/Cold Plate
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Supplier: Richardson RFPD
Description: the epoxy layer above the tube to protect the tube from leakage. Key Specifications: Base Plate: Extruded Aluminum Copper Tube Material: 0.0375” OD x 0.049” wall Thermal Epoxy fill with high thermal conductivity
- Device: Liquid Cooler/Cold Plate
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Supplier: Richardson RFPD
Description: the epoxy layer above the tube to protect the tube from leakage. Key Specifications: Base Plate: Extruded Aluminum Copper Tube Material: 0.0375” OD x 0.049” wall Thermal Epoxy fill with high thermal conductivity
- Device: Liquid Cooler/Cold Plate
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Supplier: Richardson RFPD
Description: the epoxy layer above the tube to protect the tube from leakage. Key Specifications: Base Plate: Extruded Aluminum Copper Tube Material: 0.0375” OD x 0.049” wall Thermal Epoxy fill with high thermal conductivity
- Device: Liquid Cooler/Cold Plate
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Supplier: Xoxide
Description: Enhance your cooling performance with the Thermalright AXP-140 Low Profile High Performance Heat Sink. This low profile CPU cooler incorporates a unique down draft style of air cooling that makes it perfectly ideal for an HTPC case. This innovative down draft air flow is built to cool
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Supplier: Boyd
Description: have high thermal conductivity, however brazing offers greater structural integrity and the best thermal performance. Aavid employs a variety of brazing techniques including CAB, vacuum, and dip brazing. Any bonded fin heat sink assembly that contains copper components must be
- Device: Passive Heat Sink
- Heat Sink Fin Style: Bonded Fin
- Material: Aluminum, Copper, Other Materials
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Supplier: Mi-Tech Metals
Description: Small space, big capacity. Mi-Tech developers designed our copper tungsten composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion
- Device: Passive Heat Sink
- Material: Copper, Mixed Material, Other Materials
- Mounting: Other
- Thermal Resistance: 0.5490 °C / W
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Supplier: Plansee SE
Description: expansion, we recommend our PMC laminates. PMC is a 3-layer composite with a MoCu core plated with pure OF copper. This laminate is usually structured with a thickness ratio between layers of 1:4:1. As a result, we can guarantee excellent heat distribution and dissipation in
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Supplier: National Bronze & Metals Inc.
Description: Requiring Greater Strength than Copper, Arcing and Bridging Parts, Circuit Breaker Parts, Electron Tube Grid Side Rods INDUSTRIAL: Seam Welding Wheels, Electrode Holder Jaws, Flash Welding Electrodes, Plastic Mold Components, Resistance Welding Machine Electrodes, Flash Welding Electrodes,
- Applications: Electrical / HV Parts, Resistance Alloy / Heating
- CDA Grade: 182
- Features: Cold Finished / Rolled, Extruded, Forged, Heat Resistant
- Overall Length: 144 inch
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Supplier: National Bronze & Metals Inc.
Description: C18000 Copper Chromium Nickel Silicon RWMA Class III Economical high strength, high conductivity copper base alloy. It is a heat treatable copper base alloy and its excellent properties are obtained largely through heat treatment. Its properties combine high
- Applications: Wear Parts / Tooling
- CDA Grade: 180
- Features: Cold Finished / Rolled, Extruded, Forged, Heat Resistant, Wear Resistant
- Hollow Stock: Yes
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Supplier: ToneCooling Technology Co., Ltd
Description: decade or two ago. The power density was relatively low, and tin was typicaly used as solder.Oxygen-free copper heat sinks can be utiized,nickel-plate d instead of gold-plated,but gold-plated soldering offers betterreliabiity.The tungsten copper bar
- Fan Airflow: 41.4 SCFM
- Fan Noise: 47.67 dB
- Fan Speed: 6800 rpm
- Fan Voltage: 12 VDC
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Supplier: ToneCooling Technology Co., Ltd
Description: -term reliability, allowing stable performance in various harsh environments. Versatile Applications: Vapor Chambers can be combined with other cooling solutions, such as heat sinks and fans, to further enhance cooling performance. Electronics and
- Device: Cold Plate
- Height: 6 mm
- Length: 110 mm
- Width: 92 mm
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Supplier: ToneCooling Technology Co., Ltd
Description: -term reliability, allowing stable performance in various harsh environments. Versatile Applications: Vapor Chambers can be combined with other cooling solutions, such as heat sinks and fans, to further enhance cooling performance. Electronics and Computing
- Device: Cold Plate
- Height: 4.5 mm
- Length: 108 mm
- Width: 78 mm
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Supplier: Boyd
Description: Aavid, Thermal Division of Boyd Corporation’s tube liquid cold plates feature copper or stainless steel tubing pressed into aluminum plates. Tube cold plates feature a joint free continuous tube mechanically interlocked into an extruded aluminum plate. These cost
- Device: Liquid Cooler/Cold Plate
- Length: 152 to 305 mm
- Material: Aluminum, Other Materials
- Weight: 400 to 900 g
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Supplier: Boyd
Description: liquid cold plates feature copper or stainless steel tubing mechanically interlocked into aluminum plates. These cost effective liquid cold plates are designed specifically for low to medium power density applications. Standard Aavid Hi-Contact™ tube liquid cold
- Device: Liquid Cooler/Cold Plate
- Height: 14 to 15.2 mm
- Length: 57.2 to 610 mm
- Material: Aluminum, Other Materials
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Supplier: Ohmite Manufacturing Co.
Description: The Ohmite CP4 series Liquid Coldplates are designed for Ohmite heatsinkable type resistors, such as TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages. The CP4 series also provides maximum heat removal for SCRs, rectifiers, diodes, thyristors, and other high-power
- Device: Cold Plate
- Height: 19.05 mm
- Length: 114 mm
- Material: Aluminum, Copper
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Supplier: National Bronze & Metals Inc.
Description: Requiring Greater Strength than Copper, Arcing and Bridging Parts, Circuit Breaker Parts, Electron Tube Grid Side Rods INDUSTRIAL: Seam Welding Wheels, Electrode Holder Jaws, Flash Welding Electrodes, Plastic Mold Components, Resistance Welding Machine Electrodes, Flash Welding Electrodes,
- Applications / Industry: Circuit Breakers, Contactors, Electronics (IC Packaging / Interconnect), Switches / Relays
- Base Metal / Spring Material: Copper Beryllium (CuBe), Copper / Copper Alloy
- Conductivity: 80 %IACS
- Contact Material: Copper (Cu)
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Supplier: Xoxide
Description: restriction. The CPU-370 contains a copper cold plate with brass top. As with all Koolance products, nickel plating is added to improve corrosion resistance. Two universal steel mounting brackets are included for mainstream Intel and AMD processors. The CPU-370 has standard G 1/4 BSP
- Device: Cold Plate
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Supplier: FX PCB Co., Ltd.
Description: Heat Sink Dissipation The following methods are used by heatsink PCBs to dissipate heat: Heat transfer compounds Metal heat-conducting plate Higher copper thickness Metal core Heat transfer compounds The heat transfer
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Supplier: Xoxide
Description: thermal compound is pre-applied. You'll be up and running in minutes. The latest cooling technology. Both the H80 and the H100 include a low-profile, light-weight cooling unit with a micro-channel copper cold plate and a split-flow manifold. The result of all this attention to
- Device: Cold Plate
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Supplier: Corsair Memory
Description: -applied. You'll be up and running in minutes. The latest cooling technology. Both the H80 and the H100 include a low-profile, light-weight cooling unit with a micro-channel copper cold plate and a split-flow manifold. The result of all this attention to fluid dy
- Device: Liquid Cooler/Cold Plate, Cold Plate
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Supplier: Corsair Memory
Description: -applied. You'll be up and running in minutes. The latest cooling technology. Both the H80 and the H100 include a low-profile, light-weight cooling unit with a micro-channel copper cold plate and a split-flow manifold. The result of all this attention to fluid dy
- Device: Liquid Cooler/Cold Plate, Cold Plate
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Supplier: TONGYU Technology Co., Ltd.
Description: Name: CPU Liquid Cooler Item No.: TY-C03 Material: C1100 Appearance: No oxidation, inner and outer surfaces clean, no impurities Parameters: 200PSIto detect leak Application: PC Liquid cooling, CPU heatsink, water cooling, thermoelectric cooling system Custom Design: Available
- Device: Liquid Cooler/Cold Plate, Thermo-Electric Cooler
- Material: Copper, Other Materials
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Supplier: Cooliance
Description: Custom heat pipes Cooliance offers a wide range of heat pipes. The path, length and width of heat pipes vary from application to application so most heat pipes are custom designed. Cooliance can integrate heat pipes with remote cool plates or heat
- Device: Passive Heat Sink
- Heat Sink Fin Style: Heat Pipes
- Material: Aluminum, Copper
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Supplier: Cooliance
Description: require more efficient thermal transfer. Our advanced copper embedding process allows us to insert a copper spreader plate as part of the forging process. These heat sinks provide exceptional performance at a cost effective price. Cooliance's heat pipe
- Device: Passive Heat Sink
- Material: Aluminum, Copper
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Supplier: Xoxide
Description: Features: Designed for the XBOX 360 GPU, to provide better cooling and heat dissipation, reduces the chances of break down, and prolongs GPU usage. Four dedicated heatpipe design. Nickel plated heatsink, and soldered with the finest work. Note: If you are
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Supplier: RS Components, Ltd.
Description: contact with the heated devices to handle high heat concentrations . Aluminium mounting plate with copper cooling coil . High conductivity epoxy filler between tube and plate. Mounting surface machined smooth and flat for reduced resistance . Heat transferred
- Height: 15.2 mm
- Length: 305 mm
- Material: Aluminum
- Mounting: Other
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Supplier: RS Components, Ltd.
Description: contact with the heated devices to handle high heat concentrations . Aluminium mounting plate with copper cooling coil . High conductivity epoxy filler between tube and plate. Mounting surface machined smooth and flat for reduced resistance . Heat transferred
- Height: 14 mm
- Length: 152 mm
- Material: Aluminum
- Mounting: Other
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Supplier: RS Components, Ltd.
Description: contact with the heated devices to handle high heat concentrations . Aluminium mounting plate with copper cooling coil . High conductivity epoxy filler between tube and plate. Mounting surface machined smooth and flat for reduced resistance . Heat transferred
- Height: 14 mm
- Length: 305 mm
- Material: Aluminum
- Mounting: Other
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Supplier: RS Components, Ltd.
Description: contact with the heated devices to handle high heat concentrations . Aluminium mounting plate with copper cooling coil . High conductivity epoxy filler between tube and plate. Mounting surface machined smooth and flat for reduced resistance . Heat transferred
- Height: 15.2 mm
- Length: 152 mm
- Material: Aluminum
- Mounting: Other
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Supplier: Plansee SE
Description: Wafer substrates are bonded to the semiconductor layers of LED chips. With molybdenum and molybdenum-copper wafer substrates, PLANSEE offers the optimum material for a reliable heat dissipation in LED chips. The uniform thermal expansion of the wafer substrate, sapphire substrate and
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Supplier: Lake Shore Cryotronics, Inc.
Description: Heat sink bobbins for cryostat lead wires are gold-plated OFHC or ETP copper for removing heat flowing down sensor leads. The small bobbin holds 4 to 8 phosphor bronze or manganin wires, and the large bobbin holds up to 40, depending on wire gauge and number of
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Electronic devices often face overheating issues that can reduce performance, shorten lifespan, and increase maintenance costs. Our high-efficiency copper heat sink is engineered to tackle these challenges, providing reliable thermal dissipation even in space (read more)
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impact overall performance. Tone Cooling Copper Heat Sinks are engineered for applications requiring efficient heat transfer and stable thermal performance. Compared with conventional aluminum solutions, copper offers superior thermal conductivity, helping (read more)
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?Performance Validation ? 25% better thermal transfer than JEDEC standard heatsinks (tested @ 15W/in² heat flux) ? 5000+ hr salt spray certified for industrial environments (ASTM B117) ? -40°C to 150°C operational range with <3% thermal resistance (read more)
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Forging is a manufacturing process involving metal shaping by localized compressive forces. Rego's Precision Forge Technology is capable to produce both aluminum and copper heat sinks. These sinks are processed with high pressure, below temperatures of 300°C. Under this circumstance, forged (read more)
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Copper heat sinks for high-power electronics requiring maximum thermal conductivity (read more)
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Thermal Conductivity: Materials like aluminum and copper provide rapid and effective heat dissipation, improving the performance and reliability of your systems. Versatile Designs: Finned, plate, and heat pipe designs tailored to various electronic components and (read more)
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High-Performance Aluminum Heat Sink for Effective Thermal Management Aluminum heat sinks are designed to effectively dissipate heat from critical components, ensuring optimal performance across various applications. With exceptional thermal conductivity, they enhance cooling (read more)
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The HEXNOVAS Brazed Plate Heat Exchanger (BPHE) is engineered for high-efficiency thermal transfer in demanding HVAC, refrigeration, and industrial applications. Constructed with stainless steel plates and copper brazing, the unit offers a compact footprint, high thermal efficiency, and (read more)
Browse Heat Exchangers Datasheets for Hexnovas Heat Exchanger Technology Co., Ltd -
The HEXNOVAS Full Stainless Steel Brazed Plate Heat Exchanger is designed for applications requiring high corrosion resistance and hygienic performance. Unlike conventional copper brazed plate heat exchangers, this unit is constructed using stainless steel plates and stainless steel or (read more)
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Indicates content that may require registration and/or purchase.
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Electromagnetically-driven ultra-fast tool servos for diamond turning
Copper plate heat sink .
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Design of micro-channel heat sink with diamond heat spreader for high power LD
In this study, a type of water cooled copper plates heat sink with micro-channels for high power LD is designed and simulated with Computational Fluid Dynamics (CFD) and Numerical Heat Transfer (NHT) methods as follows.
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Light Emitting Diodes And Injection Lasers For Fiber Optic Communication Systems
Laser chips are usually soldered with the p -side shown to a gold plated copper heat sink .
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High bandwidth rotary fast tool servos and a hybrid rotary/linear electromagnetic actuator
292 4-82 Copper plate heat sink with the four power operational amplifiers and nine cooling fans for the 10 kHz FTS. . . . . . . . . . . . . . .
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Thermal conductivity of graphene in Corbino membrane geometry
…expected and seen in this fig- ure, the laser excitation heats locally the membrane most efficiently when the laser spot is at the center of the mem- brane and significantly less when it is placed closer to the copper plate heat sink .
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High power AlGaAs window lasers
The devices are mounted either junction- side -up to gold plated copper heat sinks , or junction- side -down to thermal expansion matched Silicon submounts.
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1.55µm BH-DFB lasers grown by LP-MOCVD
After metallisation, the wafer was cleaved to obtain 240pm -long laser chips which were bonded with In onto Ni plated copper heat sinks .
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Mode-Controlled Galnasp-Inp Long Wavelength Lasers
Room temperature CW operation of these lasers was also obtained by bonding the laser chips on In- plated copper heat sinks .
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Development of lead-chalcogenide tunable diode lasers for 3 to 40 &mgr;m spectral region at Lebedev Physical Institute
packaged by In-welding to In- plated copper heat sink .
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Dynamics of Plasma-Surface Interactions using In-situ Ion Beam Analysis
Samples are mounted to a 10 cm · 9 cm copper plate heat sink suspended in the vessel from above.