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Supplier: DigiKey
Description: "Connector Chip Carrier For 0.4"" DIP Sockets"
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Supplier: Richardson RFPD
Description: LSB relative accuracy and no missing codes from -55°C to +125°C.Three package configurations are offered. All versions are offered in a 20-pin hermetically sealed ceramic DIP. The AD573J and AD573K are also available in a 20-pin plastic DIP or 20-pin leaded chip carrier.
- Resolution: 10 bits
- Package Type: DIP
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Supplier: Win Source Electronics
Description: Manufacturer: Exar Corporation Win Source Part Number: 1119546-XR2211ACP-F Packaging: Tube/Rail Mounting: Through Hole Power (Watts): 900mW Includes: Carrier Detector Family Name: XR2211A Categories: Integrated Circuits Status: Obsolete(EOL) Temperature Range - Operating: 0°C to 70°C Case /
- TJ: 0 to 70 C
- Package Type: DIP, PDIP
- Features: Other
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Supplier: Microchip Technology, Inc.
Description: (Pb/Halide-free) Packaging Only 32-lead, Plastic J-leaded Chip Carrier (PLCC) 32-lead, 0.600" wide, plastic, dual inline package (PDIP)
- Density: 8,000 kbits
- Access Time: 90 ns
- Data Retention: 20 years
- Operating Temperature: -40 to 85 C
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Supplier: Microchip Technology, Inc.
Description: (Pb/Halide-free) Packaging Only 32-lead, Plastic J-leaded Chip Carrier (PLCC) 32-lead, 0.600" wide, plastic, dual inline package (PDIP)
- Density: 4,000 kbits
- Access Time: 70 to 90 ns
- Data Retention: 20 years
- Operating Temperature: -40 to 85 C
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Supplier: Microchip Technology, Inc.
Description: Industrial Temperature Range: -40°C to 85°C Available in Green (Pb/Halide-free) Packaging Only 44-lead, Plastic J-leaded Chip Carrier (PLCC) 40-lead, 0.600" wide, plastic, dual inline package (PDIP)
- Density: 4,000 kbits
- Access Time: 55 to 90 ns
- Data Retention: 20 years
- Operating Temperature: -40 to 85 C
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Supplier: Microchip Technology, Inc.
Description: Industrial Temperature Range: -40°C to 85°C Available in Green (Pb/Halide-free) Packaging Only 44-lead, Plastic J-leaded Chip Carrier (PLCC) 40-lead, 0.600" wide, plastic, dual inline package (PDIP)
- Density: 1,000 kbits
- Access Time: 45 to 70 ns
- Data Retention: 20 years
- Operating Temperature: -40 to 85 C
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Supplier: Broadcom Inc.
Description: are 8 and 16-Pin DIP through hole, 16-Pin surface mount DIP flat pack, and 20 pad Leadless Ceramic Chip Carrier. Most devices may be purchased with a variety of lead forms and plating options. See the datasheet for details. Because the same electrical die (emitters and
- Isolation Voltage: 1,500 volts
- Rise Time: 0.035 µs
- Collector Emitter Breakdown Voltage: 5 volts
- Operating Temperature: -55 to 125 C
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Supplier: Richardson RFPD
Description: greater functionality with low power dissipation. The part is packaged in both a 0.6', 40-pin plastic DIP and a 44-pin plastic leaded (J-lead) chip carrier, PLCC.
- Resolution: 10 bits
- Package Type: CSP
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Supplier: Broadcom Inc.
Description: power supply bypass precautions. Package styles for this die set in one, two or four channels are 8-Pin DIP through hole, 16-Pin surface mount DIP flat pack, and 20 pad leadless ceramic chip carrier. Most devices may be purchased with a variety of lead forms and plating
- Isolation Voltage: 1,500 volts
- Rise Time: 0.045000000000000005 µs
- Collector Emitter Breakdown Voltage: 3 volts
- Operating Temperature: -55 to 125 C
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http://repositories.lib.utexas.edu/bitstream/handle/2152/ETD-UT-2011-05-3231/MONTI-DISSERTATION.pdf?sequence=1
Figure 6.4: This picture shows the resistivity probe, that is connected to the side brazed DIP chip carrier , that has a wire-bonded sample attached to it.
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Thiol passivation of MWIR type II superlattice photodetectors
For the electrical and optical measurements, samples were bonded to a 40 pin DIP chip carrier (figure 1c).
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Optical microsensor for continuous glucose measurements in interstitial fluid
Linear variable filter and detector array subassembly on a 40-pin DIP chip carrier .
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http://dspace.mit.edu/bitstream/handle/1721.1/39737/181375270-MIT.pdf?sequence=2
After being wired to a DIP chip carrier , QD solids are drop cast from 9:1 hexane:octane, filling the 100-nm deep channel between electrodes with glassy QD solid.
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http://dspace.mit.edu/bitstream/handle/1721.1/28653/58965956-MIT.pdf?sequence=2
The samples are mounted onto ceramic 24 pin dual in-line ( DIP ) chip carriers with silver epoxy.
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Monolithic InGaAs-on-silicon shortwave infrared detector arrays
It can be packaged in a 24 pin DIP chip carrier , or a 68 pin LCC chip carrier.
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Fabrication and characterization of an SOI-based thermally tuned phase modulator
By packaging the device on a basic dual inline package ( DIP ) chip carrier , and using the existing bond pads, a much more stable platform could be realized for test and characterisation.
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Fabrication and characterization of a thermo-mechanically tunable grating-assisted suspended waveguide filter
A standard DIP chip carrier is used to hold the die.
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Magnetic Tunnel Junction (MTJ) sensors for integrated circuits (IC) electric current measurement
The fabricated devices were cut into 8.2 mm × 8.2 mm chips and then wire-bonded and encapsulated into 40- DIP chip carriers , for characterization.
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Incorporation of Novel MEMS Tactile Sensors into Tissue Engineered Skin
For connection to an electrical measurement system, the fabricated sensors (figure 2) were mounted onto standard DIP chip carriers (figure 3) and wire bonded (using 25 µm aluminium wires).