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  • Reliability of RoHS-Compliant 2D and 3D IC Interconnects > Introduction to RoHS-Compliant Semiconductor and Packaging Technologies
    Most of the back - grinding machines (e.g., Disco ) can do the job and grind the wafers to as thin as 5 μm.
  • Advanced MEMS Packaging > Enabling Technologies for Advanced MEMS Packaging
    Most of the back - grinding machines (e.g., Disco ) can do the job and grind the wafers to as thin as 5 μm.
  • A low-profile three-dimensional neural probe array using a silicon lead transfer structure
    After that, the wafer is thinned to 450 μm using back -side grinding machine [14], DGP8761HC from DISCO Corporation, Japan and then the through-substrate slots are exposed to the back-side of the wafer (figure 3(l)).
  • WNGlosses (finlayson-gwc2014.zip\CICWN-1.0.zip)
    … macadam_N|1 lancet_N|2 joggle_N|1 soaked_J|1 restrictive_J|3 hold_open_V|1 siphon_V|1 spectral_J|2 undoing_N|1 stereotypically_R|2 unoriginally_R|1 source_code_N|2 machine _code_N|1 create_mentally_V|1 visualize_V|1 daydream_N|1 rerun_V|1 get_off_the_ ground _V|1 enter_upon_V|1 drywall_N|1 take_apart_V|1 … … effortless_J|3 majestically_R|1 volitionally_R|1 move_ back _and_forth_V|4 swinging_J|1 flick_V|1 side_V|1 … … charleston_N|1 boogie_V|1 cha-cha_N|1 disco _music_N|1 mambo_N|1 rhumba_N|1 slam_dance_N|1 …
  • wn_sk.pl (finlayson-gwc2014.zip)
    … '). sk(102675522,1,'achromatic_lens%1:06:00::'). sk(102675657,1,'acid%1:06:00::'). sk(102675657,2,' back _breaker%1:06:00::' … … sk(102678738,5,' disco _biscuit%1:06:00::' … … sk(102679257,1,'adding_ machine %1:06:00::' … … 102693413,1,'air-to-air_missile%1:06:00::'). sk(102693540,1,'air-to- ground _missile%1:06:00 …
  • wn_s.pl (finlayson-gwc2014.zip)
    … n,3,0). s(102678738,2,'ecstasy',n,3,0). s(102678738,3,'XTC',n,1,0). s(102678738,4,'go',n,2,0). s(102678738,5,' disco biscuit',n,1,0 … … s(102679257,1,'adding machine ',n,1,0 … … 'air terminal',n,1,0). s(102693246,2,'airport terminal',n,1,0). s(102693413,1,'air-to-air missile',n,1,0). s(102693540,1,'air-to- ground missile',n,1,0 … … s(102697759,3,' back street',n,1,0 …
  • WNSamples (finlayson-gwc2014.zip\CICWN-1.0.zip)
    … unwind_V|1 jampack_V|1 inundate_V|1 overstuff_V|1 malfunction_V|1 plug_in_V|1 idle_V|2 dislodge_V|2 exorcise_V|1 lodge_V|2 lounge_V|1 rubble_N|1 potted_J|2 palm_N|4 repot_V|1 sandwich_V|1 plum_tree_N|1 grain_V|1 dig_in_V|1 batik_N|1 tablecloth_N|4 houseclean_V|1 gi_V|1 barrack_N|1 spring-clean_V|1 blue_jean_N|2 handwash_V|1 machine -wash_V|1 tarnish_V|1 married_man_N|3 blemish_V|1 … … squat_V|2 sandstorm_N|2 kneel_V|1 stand_ back _V|1 bookshelf_N|1 couch_N|3 recline_V|1 … … come_out_of_the_closet_V|1 center_V|2 re-enter_V|1 visa_N|2 transit_N|2 suction_V|1 idaho_N|2 nebraska_N|1 basketball_player_N|2 migrate_V|4 transmigrate_V|2 stay_put_V|1 start_up_V|1 hot-wire_V|1 rein_in_V|2 crank_up_V|1 flag_down_V|1 in_front_R|1 pull_up_short_V|1 subcompact_car_N|1 turn_on_a_dime_V|1 aunt_N|7 florence_N|1 haul_V|2 ply_V|1 get_off_the_ ground _V|1 lurch_V|4 georgia_N|3 tech_N|1 … … fall_back_V|4 swim_N|1 limp_J|7 hoof_it_V|1 disco _N|1 turn_off_V|1 parking_area_N|1 gee_V|1 .
  • 3D probe array integrated with a front-end 100-channel neural recording ASIC
    After removing the PR (figure 3(r)), the wafer was thinned to 450μm using a back-side grinding machine and the through-substrate slots were exposed to the back of the wafer. … after a dicing process was completed using a dicing machine (DFD 6361 from DISCO Corporation, Japan; figure 3 …
  • mysql-wn-data.sql (finlayson-gwc2014.zip\wordnet-3.1_snapshot-mysql-wn-2.7.0b.zip)
    … 'disciplinal'),(36948,'disciplinarian'),(36949,'disciplinary'),(36950,'discipline'),(36951,'disciplined'),(36952,'disclaim'),(36953,'disclaimer'),(36954,'disclike'),(36955,'disclose'),(36956,'disclosed'),(36957,'disclosure'),(36958,'disco'),(36959,'disco biscuit'),(36960,' disco music'),(36961,'discocephali'),(36962 … … 'dishwashing liquid'),(37192,'dishwashing machine '),(37193,'dishwater'),(37194 … … rheims bible'),(38408,'douay-rheims version'),(38409,'double'),(38410,'double agent'),(38411,'double back '),(38412,'double … … 'downy brome'),(38669,'downy bromegrass'),(38670,'downy cheat'),(38671,'downy chess'),(38672,'downy ground cherry'),(38673,'downy …
  • Ultra-Broadband Modulator Packaging for Millimeter-Wave Applications
    The ma- chining process consists of a partial cut into the back side of the LiNbO substrate using a 400- m-wide blade on a Disco DAD3220 dicing saw. … are evaporated on the Kovar housing for adhesion concerns when soldering the CPW ground electrodes of the …