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Supplier: Accuris
Description: DEPOSITION SYSTEMS, VACUUM EVAPORATION, RESISTANCE TYPE AND ELECTRON BEAM TYPE
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Supplier: Denton Vacuum
Description: The Discovery HDG provides a turnkey system for a range of processes: Ion Beam Deposition, Ion Beam Assisted Deposition, Ion Beam Etch, Reactive Ion Etch. Features Cool Substrate During Process Tilting to Off Axis Angles Rotation to 20 RPM
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Supplier: Denton Vacuum
Description: The Explorer® offers the widest range of configurations and deposition modalities in the thin film industry: Electron beam evaporation, resistance evaporation, sputtering, ion plating, and ion assisted deposition. Able to Sputter dielectric, magnetic, and composite
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Supplier: Hitachi High Technologies America, Inc.
Description: The MI4050 High-Performance Focused Ion Beam System is equipped with new optics and provides the world-leading SIM imaging resolution and high-definition TEM sample preparation with improved imaging resolution at low kV. The MI4050 accommodates a variety of applications such as
- Application: Biological / Life Science, Medical / Forensic
- Grade: Research
- Microscope Type: Scanning Electron Microscope (SEM)
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Supplier: ASTM International
Description: practices, and available system and process monitoring technologies. 1.2 DED is an additive manufacturing process in which focused thermal energy is used to fuse materials by melting as they are being deposited. 1.3 DED Systems comprise multiple categories of machines using laser
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Supplier: Hitachi High Technologies America, Inc.
Description: The SU8200 FE-SEM is equipped with a novel CFE gun which employes Hitachi's patented "Mild Flashing" technology and a new vacuum system, minimizing gas mulecule deposition on the emitter tip. Hitachi's next generation Cold Field Emission SEM offers unmatched low-voltage imaging and
- Application: Biological / Life Science, Medical / Forensic
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Supplier: Edwards Vacuum
Description: The FC-4400A represents our largest scale design lift off oriented evaporation and our ultimate high throughput platform. This system is designed to support the metallization of thirty 6 inch wafers per load via high capacity e-beam evaporation. The load locked, 44 inch x 44 inch x 28
- Maximum Part Diameter / Width: 152.39991770404444 mm
- High Vacuum Type: Cryogenic / Cryosorption
- Process: Evaporation - Electron Beam, Physical Vapor Deposition (PVD)
- Features: Gas Control Unit, Integral Process Controller, Metrology / Film Monitor
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Supplier: HiTek Power Ltd.
Description: The Series OL20K is a range of high reliability, high voltage power supply systems designed to meet the rigorous requirements of Ion and Electron beam systems. These high performance switch mode systems are based on a power converter using zero-volt switching. A
- Type: High Voltage Power Supply
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Supplier: SynSysCo
Description: Vacuum Deposition, Ion Plating Accelerator and Synchrotron Radiation Helium Leak Detection Systems, Gas Recovery Equipment Vacuum Furnace Systems Laboratory Applications Electron Beam Processes Vacuum Packaging Machinery Features Oil- Free Improved Sealing Design
- Ultimate Operating Vacuum: 0.038 torr
- Pumping Speed: 3.2 to 3.8 CFM
- Operating Temperature: 41 to 104 F
- Motor Power: 1.74228650037367 HP
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Description: configured by the user to suit their particular requirements. Typical applications: Ion Beam Implantation Semiconductor Processing Electron Beam Welding Capacitor Charging High Power RF Transmitters Electrostatic Precipitators X-Ray Systems Features: Single 3U (5.25”)
- AC Input Voltage: 264 volts
- DC Output Voltage: 1,000 volts
- DC Output Current: 4 amps
- DC Output Power: 4,000.0000000000005 watts
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Description: be configured by the user to suit their particular requirements. Power >100kW’s can be provided by configuring additional chassis in parallel. Typical applications: Ion Beam Implantation Semiconductor Processing Electron Beam Welding Capacitor Charging High Power RF Transmitters
- AC Input Voltage: 264 to 528 volts
- DC Output Voltage: 1,000 volts
- DC Output Current: 12 amps
- DC Output Power: 11,999.99999999997 to 100,000 watts
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Supplier: Advanced Energy Industries, Inc.
Description: The OLS10K series of single-output high voltage power supplies meet the 24 x 7 requirements of electron beam, ion beam, X-ray systems, ion and chemical vapor deposition, and electrostatic precipitation. Max Output Voltage/Power: 80 kV/10 kW Ripple: < 500 ppm (0.05
- DC Output Voltage: 1,000 to 80,000 volts
- DC Output Current: 0.125 to 10 amps
- DC Output Power: 10,000.000000000002 watts
- AC Input Voltage: 208 to 400 volts
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Supplier: Advanced Energy Industries, Inc.
Description: OLH10K series single-output, high voltage power supplies meet the requirements of electron beam, ion beam, and X-ray systems, and ion and chemical vapor deposition, electrostatic precipitation, and other 24 x 7 production processes. Max Output Voltage/Power: 500
- DC Output Voltage: 60,000 to 500,000 volts
- DC Output Current: 0.01 to 0.166 amps
- DC Output Power: 10,000.000000000002 watts
- AC Input Voltage: 208 volts
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Description: be configured by the user to suit their particular requirements. Typical applications: Ion Beam Implantation Semiconductor Processing Electron Beam Welding Capacitor Charging High Power RF Transmitters Electrostatic Precipitators X Ray Systems Digital Interface The STR
- AC Input Voltage: 264 to 528 volts
- DC Output Voltage: 60,000 volts
- DC Output Current: 0.1 amps
- DC Output Power: 6,000 watts
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Supplier: Deposition Sciences, Inc.
Description: levels as high as 25 MW/cm2. These are ideal for use in laser and other high-energy systems such as gas, diode and diode-pumped solid-state (DPSS) systems. Evaporative Coating DSI’s evaporative coating chambers are used for complex infrared coatings. Advanced thin film designs are
- Coating: Antireflection, Beamsplitter, Dielectric, Filter, Mirror
- Materials: Glass, Substrate Fabrication
- Wavelength Range: IR, UV, Visible
- Features: North America, Other, United States Only
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Supplier: ASTM International
Description: nonvulnerability) of components to be used in such systems. Manufacturers are currently selling semiconductor parts with guaranteed hardness ratings, and the military specification system is being expanded to cover hardness specification for parts. Therefore test methods and guides are
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For example: Electron beam evaporation coating conductive boron nitride crucible (BN crucible) – for thin film deposition equipment. Conductive boron nitride crucibles are (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
are typical state-of-the-art narrowband pass filters from legacy deposition processes such as ion-assisted electron beam. Filters from 330 to >2000nm can be built to similar or even narrower specifications. Ultra-narrowband filters require extremely low extinction coefficients of the (read more)
Browse Optical Filters Datasheets for Alluxa, Inc. -
your Electron Beam Guns or Magnetron Sputtering applications. We also offer standard coaxial feedthroughs that support the needed signal information for your Crystal Sensor Holders and Crystal Sensing Devices to ensure your coating thicknesses are being deposited correctly. We understand your (read more)
Browse Feedthroughs Datasheets for MPF Products, INC. -
crystals, reducing the occurrence of crystal defects and improving the quality of semiconductor materials. MBE Crucibles: In Molecular Beam Epitaxy (MBE) processes, PBN MBE crucibles are used as evaporation vessels. The CVD-produced PBN crucibles have a solid body (read more)
Browse Specialty Ceramics Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
of SLA techniques. Powder bed fusion, on the other hand, uses a laser to fuse atomized powder particles. This additive manufacturing technology encompasses diverse methods such as direct metal laser sintering, electron beam melting and selective laser sintering. While more expensive, this (read more)
Browse Silica, Quartz, and Silicate Materials Datasheets for AGC Chemicals Americas, Inc.
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Thin Film Deposition Introduction
Thin film deposition of metallic, insulating, conductive and dielectric materials plays an important role in a large number of manufacturing, production and research applications. Resistance heating, heating and electron beam heating are the processes most widely used. Techniques employed
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e-Vap Mighty Source
Practical, low-cost, and highly reliable electron beam deposition sources are the future as we know it today. MDC introduces the e-Vap® 'Mighty Source™”– a 4 pocket x 2cc rotary electron beam source. Affordable and extremely compact, it stands just 2.4-inches tall by 4-inches long by 2.8-inches
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e-Vap 100 System
e-Vap 100 is a precision monolayer deposition source employed for evaporative coatings in UHV applications. Its unique design uses an electron beam power source for thermionic emission and pinpoint electrostatic focusing of an electron beam onto a 1-millimeter diameter wire. The wire being
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e-Vap 3000 System
MDC's 3kW Electron Beam Source is a versatile and economical deposition tool used for thin film coating processes in high and ultrahigh vacuum environments. The e-Vap® 3000 system evaporates virtually all rare earth refractory and dielectric materials. It provides researchers a simple, relatively
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Second-Generation HTS Conductors
Pulsed electron beam deposition system using pseudospark-discharge (adopted from Hoebel et al., 1990).
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Preparation and characterization of PTFE coating in new polymer quartz piezoelectric crystal sensor for testing liquor productsProject supported by the Nationa...
tains an electron beam deposition system in the vacuum cham- ber (EBVDS), a control system (CS), and a real-time moni- toring system of polymer coating’s thickness (RTMS).
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http://vbn.aau.dk/ws/files/197597024/afhandling_sva.pdf
This chapter gives a short presentation of the electron beam deposition system used to deposit silicon monoxide thin films along with the atomic layer deposition process used to produce ZnO thin films.
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Thin Film Structures in Energy Applications
In the electron beam deposition system the accelerated electron is deflected by the applied magnetic field, B.
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IV and CV measurements of Schottky diodes deposited on Ge by electron beam and sputter deposition
filament of which was mechanically shielded from the samples, generated the electron beam in the electron beam deposition system .
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http://dspace.mit.edu/bitstream/handle/1721.1/53268/547103311-MIT.pdf?sequence=2
Wafers were then loaded in an electron beam deposition system for coating with 10 nm of titanium and 100 nm of gold (using pre-determined recipes).
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http://dspace.mit.edu/bitstream/handle/1721.1/45160/317872369-MIT.pdf?sequence=2
Rebuilt a vacuum electron beam deposition system with enhanced deposition capabilities and control.
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Test circuits for deep sub-micron surface acoustic wave devices
a thin metal using sputtering and electron beam deposition systems and tried to form a fine pattern using a simple 2 layer electron beam lithography.
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Energy-Efficient VCSELs for Optical Interconnects
Evaporation of alignment markers and top metal contacts The alignment markers and the Ti/Pt/Au top metal contacts are evaporated using an electron beam deposition system Remove surface oxides .
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Nanostructured Materials for Magnetoelectronics
… deduced value of the exchange parameter for the Py (20 Å)/Cr(10 Å)/Py(30 Å) trilayer film is nearly half of the values given for the (Py/Cr(12 Å))40 multilayer system prepared by an electron beam deposition system [50].