Finger Solder Wave

Description: Water-Soluble Wave Solder Tape No adhesive residue after removal Low static upon liner release and when taping board Moisture barrier packaging plus desiccant Humidity extremes do not affect tape properties Easy manual and machine application 3M™ Water-Soluble Wave Solder

Description: Our mid-grade hot air leveling tape features non-stick adhesive even after a long delay between wave soldering and tape removal. Used to protect gold finger contacts during hot air leveling and wave soldering. Features: Used to protect gold finger contacts during the hot

• Temperature Resistance: 250 C
• Features: Removable, Single-Sided Adhesive
• Adhesive: Silicone

Description: warming impact. Quickly Clean Flux Residue From Oven & Wave Fingers Safe on Warm Ovens Non-Flammable Low VOC, Zero GWP Biodegradable Non-Ozone Depleting Applications: For Removal of Baked-On Flux Residues From SMT Oven and Wave Solder Equipment Recommended for Use In All

Description: warming impact. Quickly Clean Flux Residue From Oven & Wave Fingers Safe on Warm Ovens Non-Flammable Low VOC, Zero GWP Biodegradable Non-Ozone Depleting Applications: For Removal of Baked-On Flux Residues From SMT Oven and Wave Solder Equipment Recommended for Use In All

Description: Water-Soluble Wave Solder Tape, 33 m Length Get Reliable Protection for Your Circuit Boards During Wave Soldering with This Water Soluble Tape Saves Time and Clean-Up Costs By Completely Dissolving During In-Line Aqueous Cleaning Operations Biodegradable, Non-Toxic Tape Has a

Description: CHR K103 is manufactured from polyimide film with high-temperature adhesive. K103 has excellent mechanical and electrical properties, plus excellent dielectric strength. Applications: Non-silicone adhesive gold finger connector wave solder protection Solvent and water based

• Thickness: 0.0025196850393700786 inches
• Temperature Resistance: -29 C
• Adhesive: Acrylic
• Backing: Polyimide (e.g., Kapton^®)

Description: Our mid-grade hot air leveling tape features non-stick adhesive even after a long delay between wave soldering and tape removal. Used to protect gold finger contacts during hot air leveling and wave soldering. Features: Deer® Brand is the highest performing PC Board tape

• Temperature Resistance: 250 C
• Features: Removable, Single-Sided Adhesive
• Adhesive: Silicone

Description: This tape consisting of a 5 mil Polyimide Film and silicone adhesive is designed for high temperature masking applications, including the protection of printed circuit board gold finger contacts during wave soldering. This product can also be used in electrical insulation applications

• Width: 0.25 to 20 inches
• Thickness: 0.005 inches
• Peel Strength / Adhesion: 1.25 lbs/in
• Temperature Resistance: 260 C

Description: DuPont Kapton Tape DuPont™ Kapton® Polyimide Film Tape is a polyimide film with silicone adhesive designed for high temperature masking applications. For the protections of printed circuit board gold finger contacts during wave soldering. Custom slit to width. For applications where

• Materials of Construction: Plastic / Polymer, Polyimide (e.g., Kapton^®)
• Adhesive: Pressure Sensitive (PSA)

Description: Polyimide Tapes - Description # 22 Polyimide tape is high temperature film tape used for electrical and thermal insulation. It is also used to mask the Gold fingers on circuit boards during wave soldering. The silicone adhesive means the tape has excellent release properties.

• Carrier / Backing: Plastic / Polymer, Polyimide (e.g., Kapton^®)
• Adhesive: Silicone

Description: a flat-bladed screwdriver in an actuation slot on the block. SMT Compatibility The SCM is the only spring clamp terminal block available which is suitable for SMT reflow solder PCB manufacturing processes as well as wave solder; providing users with additional flexibility and

• Number of Contacts: 2 to 20
• Contacts Pitch: 5 mm
• Conductor Size (North American): 12 to 28 AWG
• Voltage Rating: 300 volts

Description: Applied to mask gold fingers, tab areas and other sections of printed circuit boards (PBCs) during the hot air leveling process. The silicone adhesive is specially formulated to hold down and protect the gold fingers during rigorous HAL operations yet remove cleanly from the board

• Width: 0.25 to 2 inches
• Peel Strength / Adhesion: 3.3125 lbs/in
• Temperature Resistance: -17.77777777777778 to 260 C
• Backing: Paper

Description: Applied to mask gold fingers, tab areas and other sections of printed circuit boards (PBCs) during the hot air leveling process. The silicone adhesive is specially formulated to hold down and protect the gold fingers during rigorous HAL operations yet remove cleanly from the board

• Width: 0.25 to 2 inches
• Peel Strength / Adhesion: 2.8125 lbs/in
• Temperature Resistance: -17.77777777777778 to 260 C
• Backing: Paper

Description: · Scoring (V Grooving) · Panel Routing · Screen Printed Component Legends · Liquid Photoimageable Solder Mask Inks (LPSM) · Dry Film Solder Mask (DFSM) · Peelable Solder masks (For temporary protection from solder during wave soldering) · Screen Printed Conductive

• PCB Type: Double-Sided Boards, Flexible Boards, Multi-Layer Boards, Rigid-Flexible Boards, SMT Components, Single-Sided Boards, THT Components
• Features: East Asia / Pacific Only, North America, Southwest US Only, United States Only
• Supplier Capability: Just-In-Time Capability, PCB Assembly, Production Quantities, Prototype Quantities, Testing and Evaluation

Description: These discs/dots are manufactured from commercial grade polyimide film with a special silicone adhesive. Designed for high temperature masking found in conformal coating of PCBs, protection of gold fingers during circuit board soldering and electrical insulation of high temperature coils,

• Peel Strength / Adhesion: 1.3125 lbs/in
• Temperature Resistance: -17.77777777777778 to 260 C
• Features: Dielectric / Insulating, Removable, Specialty / Other
• Backing: Plastic / Polymer, Polyimide (e.g., Kapton^®)

Description: fingers during wave soldering, it can also be used as a ground barrier and phase insulation in high performance coils, as an outer wrap on small bobbin wound coils and on form wound coils for traction motors. Product Features Temperature Rating: 500° F / 260° C Meets Class H

• Width: 0.125 to 2 inches
• Peel Strength / Adhesion: 1.5625 lbs/in
• Temperature Resistance: -17.77777777777778 to 260 C
• Features: Dielectric / Insulating, Removable, Specialty / Other