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Supplier: Dupont Molykote
Description: Silicone-based compound, heavy consistency APPLICATIONS Lubrication for control and pressure plug valves, water softener and faucet valves. Sealant for vacuum and pressure systems. Sealant for outdoor equipment (also shipboard) subject to washing and
- Applications / Function: Automotive / Transportation, Electrical / Electronic, Food Grade / Contact (FDA H1), Marine, Sealing / Barrier
- Chemistry / Constituents: Silicone, Synthetic / Semi-synthetic
- Features: Dielectric (Transformer / EDM)
- Operating / Use Temperature: -40 to 399 F
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Supplier: Master Bond, Inc.
Description: , coupled with its ultra low viscosity, makes it an excellent encapsulating and potting compound. In addition, EP30Med meets USP Class VI specifications, making it well suited for a variety of uses in medical devices as an adhesive, sealant and coating. EP30Med also meets FDA
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Epoxy (EP)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, EMI / RFI Shielding Material
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Master Bond, Inc.
Description: combination of superb physical properties and convenient processing enable EP30HV to be used not only for bonding and coating, but also for potting and encapsulation, especially of electronic or optical assemblies. Master Bond Polymer System EP30HV produces high strength, rigid bonds which
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 3.4
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Supplier: Master Bond, Inc.
Description: combination of superb physical properties and convenient processing enable EP30HV to be used not only for bonding and coating, but also for potting and encapsulation, especially of electronic or optical assemblies. Master Bond Polymer System EP30HV produces high strength, rigid bonds which
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Compound Type: Liquid
- Dielectric Constant: 3.4
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Supplier: Master Bond, Inc.
Description: superb optical clarity. EP30HT-LO version fully meets NASA outgassing test. The EP30HT Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 & 175.300 for Food Applications. Master Bond Polymer Adhesive EP30HT produces high strength, rigid bonds which are
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 36.11 to 108 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Features: Encapsulating / Potting Compound, Glob Top / Daub
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 20.56 to 98.33 µin/in-F
- Features: Thermal Compound / Interface (Thermally Conductive), Electrical Insulation / Dielectric Material, Encapsulanting / Potting
- Industry: Electronics, Medical / Food (Sanitary / FDA), Optical Grade / Material, Photonics / Optoelectronics
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following industries
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 78.89 µin/in-F
- Dielectric Constant (Relative Permittivity): 5.69
- Features: Thermal Compound / Interface (Thermally Conductive), Electrical Insulation / Dielectric Material, Encapsulanting / Potting
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 33.89 to 110 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Features: Encapsulating / Potting Compound
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NASA low outgassing approved epoxy, Master Bond Supreme 121AO, may be used for bonding, sealing and potting applications.
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Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
ELANTAS PDG, Inc. manufactures custom encapsulants and potting compounds to match your specifications. (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
Potting Materials for Electronic Applications ELANTAS offers a broad range of potting and encapsulation materials for electronic protection (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
resilience not only ensures accurate billing but also plays a role in resource conservation and efficient energy management. With a rich legacy of pioneering solutions, ELANTAS PDG is at the forefront of developing exceptional conformal coatings and potting solutions tailored for the smart meter (read more)
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Casting & Potting Materials ELANTAS PDG, Inc. offers a wide range of high performance casting resins and potting resins. Our 2-component casting and (read more)
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QSil-553 2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to (read more)
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Ellsworth Adhesives offers low pressure molding services of Mold-Man® Machines.
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Key Features Convenient processing Good physical strength properties Excellent chemical resistance properties Meets 175.105 food grade requirement Product Advantages Easy to mix and apply Low exotherm, long (read more)
Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Master Bond, Inc. -
“EP21AC withstood over 150 arcs without igniting and therefore was assigned the highest PLC (Performance Level Category) of 0 under the UL746A High Amp Arc Ignition test,” says Rohit Ramnath, Senior Product Engineer. “The compound is also flame retardant, as per the UL94 (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
cures upon exposure to LED light at 405 nm. It will cure rapidly and fully without any oxygen inhibition. It is a low viscosity system that may be used for small potting and encapsulation applications assuming that there are no shadows or concealed areas. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc.
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CR4 - Thread: Repairing Hairline Cracks in Ceramic Glaze
Just put a 1/8" of potting compound in the bottom of the mug! haha Jk although a food grade epoxy might do the trick.