Help with Resins and Compounds specifications:
Material Type / Grade
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Material Type / Grade | |||
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Elastomer / Rubber | Elastomers and rubber materials are characterized by their high degree of flexibility and elasticity (high reversible elongation). They are based on a variety of different systems, including silicone, polyurethane, chloroprene, butyl, polybutadiene, neoprene, natural rubber or isoprene, and other synthetic rubber or compounds. | ||
Composite Material | Composite material is filled with a strengthening phase, reinforcement fibers, toughening phase, or other specialty fillers that provide unique properties. | ||
Thermoplastic | Thermoplastics can be repeatedly softened by heat and then hardened or set by cooling, which allows parts to be injection molded or thermoformed and scrap to be reprocessed. | ||
Thermoset | Thermoset plastics and thermoset resins are cross-linked polymeric resins that are cured using heat or heat and pressure. Cured thermoset resins generally have higher resistance to heat than thermoplastics, but melting cannot reprocess them. | ||
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Material System
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Chemical / Polymer System Type | |||
Your choices are... | |||
Polyphenylene Oxide (PPO) | Polymers or thermoplastics are based on the polyphenylene oxide (PPO) chemical system. | ||
Polypropylene (PP) | Polypropylene (PP) is commonly used in hot-melt adhesive systems. PP is a polymer based on polypropylene chemical bonds. | ||
Polysulphide | Polymer resins or compounds are based on polysulfide or polyphenylene sulfide (PPS) chemical systems. | ||
Polysulphone | Sulphones include polysulphones, polyarylsulphones, and polyethersulphones. | ||
Aramid | Aramid thermoplastics are based on a polyphthalamide or aromatic polyamide system with a highly crystalline or linear nature. Aramid fibers are based on a polyphthalamide system. DuPont’s Kevlar® fibers are an example of aramid fibers. | ||
Polyurethane | Polyurethane (PUR) resins provide excellent flexibility, impact resistance, and durability. Polyurethanes are formed through the reaction of an isocyanate component with polyols or other active hydroxyl group compounds. Polyurethanes require a catalyst, heat, or air evaporation to initiate and complete curing. | ||
Silicone | Plastic compounds, elastomer resins, or polymers are based on the silicone chemical system. Silicones are produced through the hydrolysis and polymerization of silanes and siloxanes. | ||
Polystyrene | Polystyrene is a polymer made from the styrene monomer. It can be rigid or foamed. General purpose polystyrene is clear, hard and brittle. It is also available as a copolymer to reduce brittleness. | ||
Styrene Copolymer (SIS / SBS) | Products are based upon a styrene copolymer system such as styrene acrylonitrile (SAN), acrylic styrene acrylonitrile (ASA), acrylonitrile ethylene styrene (AES), styrene maleic anhydride (SMA), styrene-isoprene-styrene (SIS), styrene-butadiene-styrene (SBS), or styrene butadiene rubber (SBR). Styrene butadiene rubber (SBR) has good resistance to petroleum hydrocarbons and fuels. SBR is used widely with oils, hydraulic fluids, and alcohol. Many compound variations are available for specific applications. The suggested operating temperature for SBR is -30° to 275° F. Styrene-isoprene-styrene (SIS) and styrene-butadiene-styrene (SBS) copolymers are commonly applied in pressure-sensitive adhesive applications. | ||
PolyVinyl Chloride (PVC) | Polymers are based on the vinyl chemical system. Examples include polyvinyl chloride (PVC), polyvinylidene chloride (PVDF), polyvinyl vinyl acetate (PVA), and polyvinyl alcohol (PVOH). | ||
ABS | Acrylonitrile-butadiene-styrene (ABS) is a hard, rigid, thermoplastic polymer. It provides good chemical and creep resistance along with dimensional stability. ABS is used in many industries and in a wide array of applications. It is generally inexpensive, but prone to cracking under stress. Common trade names include Cycolac® (GE Plastics), Lustran® (Bayer), and Novodur® (Bayer). | ||
Acetal | Acetal is a polyacetal or polyoxymethylene (POM) that provides higher strength than polyethylene-type polymers. Polyacetal materials are susceptible to oxidation at elevated temperatures. DuPont’s Delrin® is a common polyacetal engineering resin that is also used to mold plastic parts. | ||
Acrylic | Acrylic polymers are formed by polymerizing acrylic acids through a reaction with a suitable catalyst. Acrylics are known for excellent environmental resistance and fast setting times compared to other resin systems. | ||
Butyl / Polyisobutylene | Elastomeric materials are based upon or use a butyl, polybutene, or polyisobutylene chemical system. Chlorinated isobutylene or chlorobutyl can be used alone or in blends with other polymers to achieve special properties. Butyl is a common term used for the isobutylene isoprene elastomer. It provides resistance to water, steam, alkalis, and oxygenated solvents. Butyl has low gas permeation and is capable of providing high-energy absorption (dampening) and good hot tear strength. The suggested operating temperature for butyl is -75° to 250° F. | ||
Epoxy | Epoxy resins exhibit high strength and low shrinkage during curing. Epoxies are used for their toughness and resistance to chemical and environmental damage. Most epoxies are two-part resins cured at room temperature. Some thermally-cured or thermoset one-part epoxies are also available. Depending on the formulation, epoxy resins are used as casting resins, potting agents, resin binders, or laminating resins in fiberglass or composite construction. They are also used to encapsulate electrical conductors in microelectronic packaging, and adhesives in structural bonding applications. | ||
Ethylene Copolymer (EEA, EVA) | Ethylene copolymers include (poly)ethylene acrylate acid (EAA), (poly)ethylene methyl acrylate (EMAC), (poly)ethylene ethyl acrylate (EEA), (poly)ethylene vinyl acetate (EVA), (poly)ethylene butyl acrylate (EBAC), (poly)ethylene vinyl acetate (EVA or EVAC), (poly)ethylene vinyl alcohol (EVAL or EVOH), and (poly)ethylene propylene terpolymer (EPM). | ||
Fluoropolymer (PTFE / PVDF) | Polymers are based on fluoropolymer chemical systems, such as polytetrafluoroethylene (PTFE) or polyvinylidene fluoride (PVDF). Fluoropolymers are used in applications requiring superior chemical resistance. PTFE is used in applications requiring superior chemical resistance or low friction. | ||
Ionomer | Thermoplastics are based on the ionomer polymer system. | ||
Isoprene / Polyisoprene | Natural rubber is based on polyisoprene or isoprene chemical systems. Synthetic or man-made versions of isoprene are also available. | ||
Liquid Crystal Polymer (LCP) | Liquid crystal polymers (LCP) are thermoplastics with high strength and temperature resistance. Liquid crystal polymers are used in electrical, electronic, and medical applications where the high cost of the material is not an issue. | ||
PEEK | Ketones encompass polyaryletherketone or polyetheretherketone (PEEK). PEEK is an engineered thermoplastic that can resist high temperatures. It has excellent chemical resistance, fatigue resistance, and thermal stability. PEEK is inert to all common solvents and resists a wide range of organic and inorganic liquids. PEEK has a maximum continuous working temperature of 480°F, and retains its mechanical properties up to 570°F in steam or high-pressure applications. | ||
Phenolics (Melamine, Furan) | Phenolic and formaldehyde resins are thermosetting molding compounds and adhesives that have strong bonds and provide good resistance to high temperatures. Phenolic or phenol formaldehyde, urea formaldehyde, furan, and melamine resins fit into this category. Phenolic resin adhesives made from chemicals of the phenol group and formaldehyde are generally the most durable. Phenolic resins are available in liquid, powder, and film form. Special phenolic resins that harden at moderate temperatures when mixed with suitable accelerators are also available. Phenol-formaldehyde, resorcinol-formaldehyde, resol, and novalac resins are types of phenolic resins. Urea resin adhesives are made from urea, formaldehyde, and catalysts or hardeners. Urea formaldehyde resins can harden rapidly at moderate temperatures, but generally do not have the properties of phenolic resins. Melamine resins are made through a reaction of dicyandiamide with formaldehyde. Most of the resins in this group have excellent dielectric properties. Furan formaldehyde (FF) resins are made by the polymerization or poly-condensation of furfural, furfural alcohol, or other compounds containing a furan ring, or by the reaction of these furan compounds with other compounds (not over 50%). Fire-retardant furans are used in hand lay-up, spray-up, and filament winding operations. Furans are commonly used in foundry binders, grinding wheels, refractories, and other high temperature applications. Furan resins and chemicals are also used in fiberglass composites, hybrid resins combined with epoxy or phenolics, and in corrosion-resistant cements. | ||
Polyamide / Nylon | Polyamide is a commonly-used system for molding high-strength engineered components. Polyamides are also used to produce strong hot-melt adhesives. Polyamides provide higher strength than polyethylene or other commodity-type polymers. Nylon is a well-known example of a polyamide engineering resin that is also used to mold plastic parts. | ||
Polyamide-imide (PAI) | Polyamide-imides are amorphous, thermoplastic materials with excellent mechanical properties, especially at elevated temperatures. Trimellitic anhydrides react with aromatic diamines to produce polyamide-imides. Polyamide-imides are applied in demanding engineering applications. Solvay Advanced Polymer's Torlon® is a well-known example of a polyamide-imide engineering resin that is also used to mold, extrude or machine plastic parts, or shape stock. | ||
Polyimide | Products are based on thermoplastic polyimide resins or thermoset bismaleimide (BMI) resins. Aromatic polyimides are among the most thermally-stable organic materials. DuPont’s Kapton® film materials are an example of thermoplastic polyimide. Polyimide thermoplastics and BMI thermoset resins have high temperature resistance. Bismaleimide (BMI) resins have processing characteristics similar to epoxy resins and are used as laminating resins, prepregs, and adhesives. | ||
Polybutadiene | Polybutadiene is a commonly used polymer system with dielectric potting compounds and coatings. It can be combined with other rubber polymers to form flexible sealants. Polybutadiene remains flexible even at low temperatures. | ||
Polycarbonate (PC) | Polycarbonate is an amorphous material with excellent impact strength, clarity, and optical properties. Polycarbonate has excellent mechanical properties, and can be molded to tight tolerances. Polycarbonates can be attacked by solvents and petrochemicals. Brand names include Caliber® (Dow) and Lexan® (GE) as well as Makrofol® and Makrolon® (Bayer). | ||
Polyethylene | Polymers or resins are based on the polyethylene chemical system. Low-density polyethylene polymers are used to form a variety of common or commodity-plastic components. High density (HDPE) and ultra-high molecular weight polyethylene (UHMW PE) have good friction and mechanical properties. They are used in medical devices, wear parts, and engineered components. | ||
Polyester (PET, PBT) | The polyethylene terephthalate (PET) and polybutylene terephthalate (PBT) polymer systems are based on a thermoplastic polyester or terephthalate system. | ||
Vinyl Ester | Thermosetting resins or plastics are based on the polyester (alkyd) or vinyl ester system. These materials should not be confused with thermoplastic polyesters or PET resins. | ||
Specialty / Other | Other specialty, proprietary or unlisted resin, chemical system or compound, or polymer type. | ||
Polyetherimide | Polymers or thermoplastic compounds are based on the polyetherimide chemical system. | ||
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Form / Type
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Compound Type: | |||
Your choices are... | |||
Pellets | Resins are in the form of pellets, powder, granules, or other feed stock forms such as bulk or sheet molding compounds. | ||
Liquid | Adhesive, sealant, or resins are in the form of a low-to-moderate viscosity liquid. | ||
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Features & Industry
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Features | |||
Your choices are... | |||
100% Natural / Recycled | Products are made solely of natural, green, and/or recycled raw materials. | ||
Anti-static | Anti-static materials are designed with relatively high electrical conductivity or low electrical resistivity. They are used in electronic, anti-static, and electrostatic discharge (ESD) applications. | ||
Bullet Proof / Cut Proof | The resin/material has the strength and energy-absorptive properties that make it suitable for use as armor, bulletproof protection, or personnel shielding. | ||
Biocompatible | The resin/material is a biopolymer or a biocompatible polymer suitable for medical and biological use in contact with living tissue. | ||
Electrically Conductive Compound | Resins or compounds have a high degree of electrical conductivity (low resistivity) for applications such as anti-static or ESD control, EMI/RFI shielding, thick film metallization, and device and board electrical interconnection. | ||
EMI / RFI Shielding | Polymers or elastomers are designed to provide shielding from electromagnetic interference (EMI) or radio frequency interference (RFI). These compounds typically have a high degree of electrical conductivity. | ||
Flame Retardant (e.g. UL 94 Rated) | The material is flame-retardant in accordance with industry standards, such as Underwriters Laboratories, Inc. (UL), Flame Class 94, or other ISO standards. These materials reduce the spread of flame or resist ignition when exposed to high temperatures. They also insulate and delay damage to the substrate. | ||
Optical Grade | Polymers or elastomers are designed for optical or photonics applications, such as transparent polycarbonate or acrylic lens materials. | ||
Thermally Conductive | Materials are designed to form a thermally conductive layer on the substrate, between components or within a finished electronic product. Thermally conductive resins, thermoplastics, encapsulants, potting compounds, tapes, pads, adhesives, and greases are often used between a heat-generating electrical device and a heat sink to improve heat dissipation. | ||
Thermally Insulating | Thermally insulating resins, plastics, compounds and encapsulants provide a thermal barrier between components and a hot or cold source. | ||
UL Approved | The material is approved to or recognized under one or more requirements of Underwriters Laboratories, Inc. (UL). | ||
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Industry: | |||
Your choices are... | |||
Aerospace | Products are designed for aerospace applications. For example, they can be used to bond composite structures to other composite or metallic frame components. | ||
Automotive | Products are designed for automotive applications. For example, they can be used to bond panels and seal windows. | ||
Electronics | Products are designed for electronics applications. For example, they can be used in potting or encapsulating compounds, conductive adhesives, and dielectric sealants. | ||
Energy Conversion (Battery/Fuel Cell/PV) | The resin/material is suitable for use in batteries and fuel cells, as well as in photovoltaic (PV) and related devices. | ||
Electric Power | Products are resins, compounds, and plastic composites suitable for electrical power or high voltage applications such as generator or motor assemblies, coil or transformer manufacturing, and switch or circuit breaker insulation. | ||
Optoelectronics | Products are designed for optoelectronics or photonics applications, such as cements for bonding simple lenses into compound structures. | ||
Semiconductor / IC's | Products are designed or suitable for semiconductor or semiconductor packaging applications. | ||
Composite Structures | Products are designed for constructing laminating strip structures or SCRIMP matrix resins for composite construction. SCRIMP is an acronym for Seemann composites resin infusion molding process. | ||
Marine | Products are designed for marine applications. They can be immersed in water and withstand exposure to marine atmospheres. | ||
Medical / Food (FDA) | Products are suitable for medical or food-contact applications. They typically comply with requirements from regulatory agencies such as the Food and Drug Administration (FDA), U.S. Department of Agriculture (USDA), National Science Foundation (NSF), 3A-Dairy, Canada AG, or USP Class VI. | ||
Military / Government (MIL-SPEC) | Products meet U.S. military specifications (MIL-SPEC). | ||
Industrial | Products are designed for use by original equipment manufacturers (OEMs) for the assembly, sealing, or fabrication of products. | ||
Building / Construction | Products are designed for use by construction contractors and in maintenance, repair, and operation (MRO) applications. Adhesives or sealants can be designed for general-purpose construction or architectural applications. Construction materials include wood, wood products, glass, cement products (mortar, concrete, masonry), plaster board, metal trim, flooring tile, sub-floor or underlayment, plaster board, sheet metal roofing or flash, metal ties, insulation materials (fiberglass, foam), and bitumen-based roofing materials. | ||
Tooling / Molds | Products are designed for tooling or mold fabrication such as polyurethane shapes or castable silicones. | ||
Other | Other unlisted industry. | ||
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Thermal Properties
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Use Temperature | Use temperature is the range of temperatures to which products can be exposed without the degradation of structural or other required end-use properties. | ||
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Deflection Temperature (@ 264 psi, 1.8 MPa) | Deflection temperature is the temperature range to which the material can be exposed without the degradation of structural or other required end-use properties at 264 psi or 1.8 MPa. . | ||
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Thermal Conductivity | Thermal conductivity is the linear heat transfer per unit area through a material for a given applied temperature gradient. Heat flux (h) = [thermal conductivity (k) ] x [temperature gradient (Δ T)]. | ||
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Coeff. of Thermal Expansion (CTE) | Coefficient of linear expansion (CFE) is the amount of linear expansion or shrinkage that occurs in a material with a change in temperature. | ||
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Mechanical Properties
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Tensile Strength (Break) | Tensile strength at break is the maximum amount of stress required to fail or break the material under tension loading test conditions. Tensile tests are typically performed according to test procedure standards such as ASTM D-638 or ISO 527-1, ASTM D-1708, ASTM D-2289 (plastics at high strain rates), and ASTM D-882 (thin plastic sheets), as well as other OEM proprietary standards. | ||
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Tensile Modulus | Young's modulus or the modulus of elasticity is a material constant that indicates the variation in strain produced under an applied tensile load. Materials with a higher modulus of elasticity have higher stiffness or rigidity. | ||
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Elongation | Elongation is the percent amount of deformation occurring during a tensile test or other mechanical test. | ||
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Electrical & Optical Properties
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Electrical Resistivity | Resistivity is the longitudinal electrical resistance (ohm-cm) of a uniform rod of unit length and unit cross-sectional area. Resistivity is the inverse of conductivity. | ||
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Dielectric Strength | Dielectric strength is the maximum voltage field that the material can withstand before electrical breakdown occurs. | ||
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Dielectric Constant | The dielectric constant is the relative permittivity of a material compared to a vacuum or free space. k = εr = ε / εo= where ε is the absolute permittivity of the material and εo is the absolute permittivity of a vacuum 8.85 x 10-12 F/m. | ||
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Index of Refraction | The index of refraction is a measure of the speed of light in a material. | ||
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Light Transmission | This is the amount of light transmitted through a material. | ||
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Processing & Physical Properties
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Viscosity | Viscosity is a measurement of a fluid's resistance to flow. Water is lower in viscosity than motor oil or honey. Oil is lower in viscosity than tar or molasses. Depending on the application method, viscosity determines how well a resin fills the cavities or voids in a mold. | ||
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Melt Flow Index (MFI) | Melt flow index (MFI) is the output flow rate in grams that occurs in 10 minute periods through a standard die of 2.0955 mm diameter and 8.000 mm in length, while a fixed pressure is applied to a 190°C melt via a piston. Blow molding and extrusion processes tend to use resins with lower MFI values. Injection molding typically utilizes higher MFI polymers. | ||
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Water Absorption | The amount of water absorbed by the material. | ||
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