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Supplier: Richardson RFPD
Description: The 173, 174, and 175 Series are highly efficient thermally conductive insulators designed for semi - conductor interface to heat sinks. Their properties eliminate messy concerns associated with thermal greases.
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies.
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: The 173, 174, and 175 Series are highly efficient thermally conductive insulators designed for semi - conductor interface to heat sinks. Their properties eliminate messy concerns associated with thermal greases.
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: The 173, 174, and 175 Series are highly efficient thermally conductive insulators designed for semi - conductor interface to heat sinks. Their properties eliminate messy concerns associated with thermal greases.
- Compound Type: Thermally Conductive
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Supplier: DigiKey
Description: POTTING COMPOUND HIGH STRENGTH
- Form / Function: Encapsulant / Potting Compound
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Supplier: DigiKey
Description: POTTING COMPOUND CLEAR FLOWABLE
- Form / Function: Encapsulant / Potting Compound
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Supplier: ODG (Origin Data Global)
Description: POTTING COMPOUND RED SPREADABLE
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Supplier: ODG (Origin Data Global)
Description: POTTING COMPOUND CLEAR FLOWABLE
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Supplier: ODG (Origin Data Global)
Description: POTTING COMPOUND SELF LEVELING
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Supplier: ODG (Origin Data Global)
Description: POTTING COMPOUND RED HIGH TEMP
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Supplier: R. S. Hughes Company, Inc.
Description: Momentive SilTrust black SP100-B/P adhesive/sealant is compatible with glass, aluminum and plastics materials.
- Features: Leveling / Filling Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Momentive SilTrust white SP100-W/P adhesive/sealant is compatible with glass, aluminum and plastics materials.
- Features: Leveling / Filling Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 2700HT, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2700HT die attach adhesive is designed for Pbfree array packaging. This adhesive is ideal for small needle dispensing in SiP or MCM die attach applications. Excellent bleed performance
- Compound Type: Thermally Conductive
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Supplier: Sauereisen, Inc.
Description: Sauereisen Insa-Lute Adhesive Cement No. 1 is specified throughout the automotive, appliance and assembly industries for bonding, insulating, and encapsulating applications. A thermally conductive and electrically insulating cement paste, the material bonds well to metal, ceramics and
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Composition: Unfilled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
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Supplier: Titebond
Description: subfloor. Grinding concrete floors is preferred over the use of filling compounds. If filling/leveling compounds are used, they must be portland based cementitious materials and have a compressive strength equal to or greater than 3000 psi when cured. Use of adhesive over light
- Chemical / Polymer System Type: Specialty / Other
- Viscosity: 125000 cP
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: P77000 non-flame retardant silicone self-adhesive tape is composed of self-adhesive, excellent resilience of self-fusing silicone rubber compounded with a layer of easy to separate isolation film. And has excellent high and low temperature resistance, can be used for a
- Backing: Plastic / Polymer, Rubber, Silicone
- Dielectric Strength: 2.20E7 V/m
- Features: Anti-static / ESD Control, Electrically Conductive
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Supplier: MacDermid Alpha Electronics Solutions
Description: A one-component, fast-curing surface mount adhesive, specifically designed for screen printing. Product Overview ALPHA HiTech SM42-120P is suitable for both screen printing and dispensing applications. It is the primary product recommended for customers requiring a screen-printable
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: MacDermid Alpha Electronics Solutions
Description: A thermosetting conductive die attach with very high thermal conductivity designed for high power semiconductor packages. Product Overview ATROX® 800HT2V-P1: Variant of 800HT2VX optimized for specific dispense and flow characteristics in automated die attach systems.
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-P™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials . G6E-P™ is formulated with proprietary nanomaterials and fillers. G6E-P™ epoxy
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material, Grease / Paste
- Filled / Reinforced: Yes
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Supplier: Sauereisen, Inc.
Description: & P-78 ideal for automated applications using dispensing equipment. Due to its inorganic, composition, Electric Resistor Cement is very stable and will neither outgas, nor cause skin irritations like many other adhesives.
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Composition: Unfilled
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 3.4 to 4.5
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: Nano carbon copper foil tape is a functional thermal tape with high-performance heat-conducting copper foil as backing, compounded with nano-carbon on the surface, and then coated with acrylic adhesive. It has the characteristics of high thermal conductivity, electrical conductivity,
- Adhesive: Acrylic
- Backing: Metal Foil / Sheet, Plastic / Polymer, Acrylic / Acrylate
- Features: Anti-static / ESD Control, Electrically Conductive
- Temperature Resistance: 80 C
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: Nano carbon aluminum foil tape is based on high-performance aluminum foil for heat dissipation,The surface is compounded with nano-carbon, and then coated with acrylate functional heat dissipation adhesive. It has good thermal conductivity, shading, temperature resistance and shielding
- Adhesive: Acrylic
- Backing: Metal Foil / Sheet
- Features: Anti-static / ESD Control, Electrically Conductive
- Temperature Resistance: 80 C
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-FRP™ is a flexible version of our G6E-P™ general purpose epoxy. G6E-FRP™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material, Flexible / Dampening, Grease / Paste
- Filled / Reinforced: Yes
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a 4 to 1
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Strength: 440 kV/in
- Dissimilar Substrates: Yes
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: P3123WT wig tape is a medical adhesive tape made of Nonwoven fabric/TPU/PET as the base material, evenly coated on both sides with high-performance acrylic pressure-sensitive adhesive, and compounded with release paper.
- Adhesive: Pressure Sensitive (PSA)
- Backing: Paper, Plastic / Polymer, Acrylic / Acrylate, PET / Polyester
- Features: Anti-static / ESD Control, Electrically Conductive
- Thickness: 0.0091 inches
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Supplier: Wacker Chemical Corp.
Description: Pure white, soft consistency, heat sink paste with marked thermal conductivity. Electrically insulating. Application WACKER® SILICONE PASTE P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat transfer from a
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Dielectric Constant (Relative Permittivity): 3.5
- Dielectric Strength: 254 kV/in
- Features: Electrical Insulation / Dielectric Material
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Supplier: Sauereisen, Inc.
Description: Sauereisen Fib-R-Thane No. 88P is used as a flexible expansion joint for concrete, brick and tile floors; for sealing joints of ducts and conduits; and for general caulking and sealing where permanent flexibility and adhesion are required. Fib-R-Thane is an asphalt-modified urethane material
- Compound Type: Leveling / Filling Compound
- Cure Type / Technology: Two Component System
- Industry: Building / Construction
- Substrate / Material Compatibility: Concrete / Masonry
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Description: , ensuring efficient heat transfer. ? Excellent wetting properties ensure that there is no risk of spillage after thermal cycling, making them a viable alternative to thermal grease/thermal paste. ? Self-adhesive for easy application and rework. ? Complies with RoHS, Halogen
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 4.5
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Elongation: 40 %
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Supplier: Henkel Corporation - Electronics
Description: (Known as Ablestik CDF 815P6B ) LOCTITE ABLESTIK CDF 800 Series are high filled, conductive die attach adhesive film designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It exhibits strong
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
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Supplier: ELANTAS North America LLC
Description: wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Chemical / Polymer System Type: Polyester / Vinyl Ester
- Coeff. of Thermal Expansion (CTE): 83.33 to 172 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
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Supplier: Gelest, Inc.
Description: - propanamine Amine functional dipodal silane Crosslinking agent for hot melt adhesives and for 2-part condensation cure silicones Coupling agent and adhesion promoter for aluminum-polyester multilayer laminates
- Ionic Component: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)
- Purity: 92 %
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Supplier: Gelest, Inc.
Description: Additional Properties Hydrolytic Sensitivity 7: reacts slowly with moisture/water Surface Tension (mN/m) 38.5 Application Used to prepare epoxy-containing hybrid organic-inorganic materials.1 Reference 1. Innocenzi, P. et al
- Flash Point: 275 F
- Ionic Component: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)
- Purity: 98 %
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Supplier: Gelest, Inc.
Description: agent for polyamides with improved hydrolytic stability Adhesion promoter, crosslinking agent for hot melt adhesives Adhesion promoter for aluminum-polyester multilayer laminates Adhesion promoter, crosslinker for 2-part condensation cure silicones Cyclic analog: SIT8187.2 Advanced silane in
- Flash Point: 324 F
- Ionic Component: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)
- Purity: 95 %
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Supplier: Gelest, Inc.
Description: Additional Properties Hydrolytic Sensitivity 7: reacts slowly with moisture/water Safety Hazard Info oral rat, LD50: 2,380 mg/kg Packaging Under Nitrogen 3-Mercaptopropyltrim ethoxysilane; 3-(trimethoxysilyl)p ropanethiol; 3
- Flash Point: 205 F
- Ionic Component: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)
- Purity: 99 %
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Description: Patco 168 P.V.C. Automotive High Temperature Fineline Masking Tape The resilient P.V.C. film substrate provides good solvent resistance, high conformability & a smooth, sharp mask-off edge. The blended rubber based adhesive offers high temp. resistance through bake cycles
- Adhesive: Rubber
- Backing: Plastic / Polymer, PVC / Vinyl
- Peel Strength / Adhesion: 1.62 lbs/in
- Temperature Resistance: 4.44 to 138 C
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Description: Patco 172-68 P.V.C. Automotive High Temperature Fineline Masking This product offers a tough, conformable P.V.C film with a high performance rubber blend P.S.A. laminated to a 68 lb. release liner. Applications ---Designed for use as an automotive fineline
- Adhesive: Rubber
- Backing: Plastic / Polymer, PVC / Vinyl
- Peel Strength / Adhesion: 1.69 lbs/in
- Temperature Resistance: 4.44 to 138 C
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Supplier: ACCRAbond, Inc.
Description: Blue medium strength, low viscosity threadlocking compound. ASTM D5363 AN0241 & Mil-S-46163 Type 3 Grade P. Federal National Stock Numbers: 8030-01-181-5549
- Cure Type / Technology: Anaerobic
- Features: Thread Locker / Retainer
- Substrate / Material Compatibility: Metal
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Description: Patco 179 P.V.C. Automotive High Temp Fineline Tape The resilient 0n-glare matte finish P.V.C. film substrate provides good solvent resistance, high conformability and a smooth, sharp mask-off edge. Applications Mask color separations on plastic (TPO & RIM
- Adhesive: Rubber
- Backing: Plastic / Polymer, PVC / Vinyl
- Peel Strength / Adhesion: 0.8125 lbs/in
- Temperature Resistance: 4.44 to 138 C
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UNISTOLE™ P is a unique line of liquid primers created to coat and bond engineering plastics and rubber materials that are otherwise difficult to coat and bond. Substrates including PP, TPO, TPE, EPDM, Nylon 6, RIM Urethane, PBT, FRP, ABS, EVA, Polyimide, Modified PPO and their blends (read more)
Browse Datasheets for Mitsui Chemicals America, Inc.
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Polymers: synthesis, properties and applications
Spinning-disc-reactor (SDR) 574 spinning process 486 Spirocarbonate 347 Spiroorthocarbonate 346 Spiro- compound 572 injecting blow molding 472 injection molding 463, 468 injecting prägen … … sulfide 348 sulfonium ions 353 Sulfoniumsalze 264f, 350 superabsorbents 528 super adhesives 281 suspending auxiliary 452 … P-S 606 .
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Vie path manual motor vehicle technology
… particle emission, 309, 311, 330, 335, 339 particle filters 129 PCM, 341, 439, 606 pass accuracy, 614 … … pulsation dampers, pulse step control, 431 pulse inverters, 166 powder lacquers 321 878, 349 pump-nozzle-unit, 322 pump arrangement, 811, 812 pump unit, 658 pump element, 303, 319 point welding adhesive bonding , 1079, 1083 point-to-point connection , 576 pump-nozzle Pure-adhesive 806 PZEVs, 1082 polyurethane foams, 615 Push Rod, 1229 PVB film (Polyvinylbutyral) 1082 PVD 409 PZEV, 1063, 1075 p-V -diagram, 300, 301 PWM valves, 1073 PVC-adhesive, 162 .
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Plastics and its properties
… 195 notch impact strength 207 silica glass 199 silicic acid, precipitated 195 195 adhesive raw materials 196 … … 195 Poly(1,4-cyclohexandimethylolterephthalat) 210 Poly(butylenterephthalat) 213 214-ultrahochmolekulares to 210 Poly(chloropren) 215 Poly(ethylen) Poly(ethylen)-Papier 214 Poly(ethylenterephthalat) 210, 211 Poly(m-phenylenisophthalamid) 215, 216 Poly(olefin)-Faser 212 Poly(p-phenylenterephthalamid) 215, 216 Poly(tetrafluorethylen … … layer silicates 195 layer silicate-nanofilling materials 196 slag 199 lubricant 191 silane compounds 191 silver wires … … tensile force, feinheitsbezogene 205 compatibility of polymers 427 compatibility matrix 428 vinyl chloride 606 vinyl chloride / …
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Food chemistry
… 150, 152, 181, 208, 213, 219, 235, 323, 326, 331, 333, 340, 412, 419, 422, 430, 443, 446, 459, 478, 488, 502, 520, 522, 547, 560, 569, 594, 606 Mays 133, 160, 269 … … 113, 438, 525 maize adhesives 525 corn starch 163 … … 415, 480, 481 methionine 60, 183, 184, 187, 426, 578, 591 methyl-2- p -hydroxyphenylethylketon 412 methyl … … 82, 233, 235, 287, 319, 627 nitrite brining salt 235 nitrofuran 391 nitromusk- compounds 393 Nitrosamin 50 …
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Table of contents 2007
606-612 Peters, S.; fox, A.; Knippers, J.; Behling, S.: whole glass staircase with transparent SGP glued joints , construction, and static calculation [glass construction Schaumann, P. ; Böker, C.: fatigue .
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Mutschmann / Stimmelmayr paperback of the water supply
P PE tube -, compound 702 staff - - need 863 - - qualification 862 personal natures 847 pesticides 260 plow method 733 … … 958 annular pistons - - valve more seamless 605 of 605 welded 621-counter 478 risk management 889, 917 crack width 531 tube, - earth covering 682, with plug-in sleeve 606 -, cleaning 901 -, transfer 696 … … method 103 pipe joint -, adhesive sleeve 613 tube propulsion …
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Plastics
Torsional vibration attempt 1248 environment and health 1249 Terepthalsäure 856 terpolymers 46 tetrafluoroethylene / ethylene copolymer 606 wear speed 611 processing, shaving … … low deformation speed 607 pressing compounds , conditionally detachable 612 friction … … and gases impregnating 598 adhesive bonding 605 Kristallinitätsgrad 598 short … … K injection molding 105 throwing method 124 closing forces to 124 orientations 130 p T diagram 136 …
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http://calhoun.nps.edu/public/bitstream/handle/10945/27767/90Jun_Josefson.pdf?sequence=1
… oxygen, water, or hydrogen sulfide can be introduced to reactively sputter a new compound [Ref. 63: p … It has shown higher deposition rates than conventional sputtering or ion-beam deposition [Ref. 61: p. 6602], although problems with producing consistent compositions have been reported [Ref. 68: p . 606 ]. These techniques may also improve compositional control, although cracking and adhesion problems have been reported [Ref. 38 …
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Practice knowledge welding technique
P … branch 441 tube plate 453-connection 453 pipeline construction 427 tube-web-pipe- joint 455 roller seam … Salt bath soldering 317, 334 saddle pipes 442 oxygen-inflating method 287 Schaeffler diagram 308 shear stress 165 shipbuilding steel 270 slag 34, 37 slag agents 35 slag inclusion 42 hot melt adhesives 161 enamel line 18, 278 shrinkage compensation 514 shrinkage … … consideration 524-reduction 511 welding suitability 102, 289 welding slow 67 welding permission 606 welder test, designation …
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Practice knowledge welding technique
… 126 multiple wire system 47 multiple flame burner 178 multiple position welding 512 multiple position weldings 42, 516 brass 218, 560, 579 metal 86 metalization 109 metal adhesive bonding 115 metal combinations 103 … … mixing tube 11 mixing compound 209, 228, 360 medium … … 560, 609 nickel base-alloy 605 nickel base-welding additive Low alloyed to 606 nickel alloy 219 … P .