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Supplier: Cri-Tech, Inc.
Description: Formulation Development, Custom Rubber and Plastic Compounding, Color development & Specialty Toll Manufacturing. Cri-Tech 5,200 m2 state of the art facility has over 3,600 MTs of internal and twin-screw mixing capacity. Cri-Tech's "clean" mixing operation provides overall
- Chemicals / Chemical Products: Pigments / Dyes, Polymers
- Form: Bulk Solids / Granules, Other
- Location: North America, United States Only, Northeast US Only
- Materials / Material Products: Elastomers / Rubber, Plastics
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Supplier: Hapco, Inc.
Description: Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 1.67 to 1.73
- Dielectric Strength: 390 kV/in
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Supplier: Richardson RFPD
Description: Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies.
- Compound Type: Thermally Conductive
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Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond R-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 8000 to 14000 cP
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Supplier: Cri-Tech, Inc.
Description: Formulation Development, Custom Rubber and Plastic Compounding, Color development & Specialty Toll Manufacturing. Cri-Tech 5,200 m2 state of the art facility has over 3,600 MTs of internal and twin-screw mixing capacity. Cri-Tech’s “clean” mixing operation provides overall
- Chemicals / Chemical Products: Polymers
- Form: Bulk Solids / Granules
- Materials / Material Products: Specialty / Exotic Alloy
- Process Technology: Compounding, Formulation, Other
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Supplier: Electro Optical Components, Inc.
Description: The 3 Series (CO, SO2, NO2 and NO) are designed for stack emission monitoring. They can be used in the environment with those high concentration gases for a long time. The sensor electrodes are much bigger and deposited with thicker chemical compounds. The
- Measurement Type: Trace
- Number of Gases Sensed: Single Gas
- Specific Gas Types: Carbon Monoxide (CO)
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Supplier: Cri-Tech, Inc.
Description: Formulation Development, Custom Rubber and Plastic Compounding, Color development & Specialty Toll Manufacturing. Cri-Tech 5,200 m2 state of the art facility has over 3,600 MTs of internal and twin-screw mixing capacity. Cri-Tech’s “clean” mixing operation provides overall
- Dispersion (Coating / Concentrate): Yes
- Material Type: Polymer
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Supplier: Cri-Tech, Inc.
Description: Formulation Development, Custom Rubber and Plastic Compounding, Color development & Specialty Toll Manufacturing. Cri-Tech 5,200 m2 state of the art facility has over 3,600 MTs of internal and twin-screw mixing capacity. Cri-Tech’s “clean” mixing operation provides overall
- Location: North America, United States Only, Northeast US Only
- Materials / Material Products: Elastomers / Rubber, Plastics
- Run / Batch Size: Laboratory / Benchtop Scale
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Supplier: Gelest, Inc.
Description: partition characteristics, and significantly effects the covalent bond between organic and inorganic materials. N-(2-Aminoethyl)-3-a minopropyltrimethoxs ilane-propyltrimetho xysilane,N-[3-(trime thoxysilyl)propyl]et hylenediamine-(trime thoxysilyl)propane, oligomeric
- Flash Point: 230 F
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Supplier: Linde North America, Inc.
Description: Linde offers a four component BTEX gas standard – 1, a six component BTEX gas standard – 2, and a seven component BTEX gas standard – 3 calibration standard in concentrations from 100 ppb to 10 ppm in a balance gas of VOC zero grade nitrogen gas. All concentrations are directly
- Applications: Calibration Gas / Gas Standard
- Supply Options: Gas Cylinder
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Supplier: Indium Corporation
Description: Gallium oxide is the common term for gallium sesquioxide, or (Ga2O3). It is a white powder that consists of rod shaped crystals, with the ß-phase being the dominant crystalline phase. The Ga2O3 rods agglomerate into larger, secondary particles. Gallium sesquioxide is used
- Ionic Component: Metalloids (B, Si, Ge, etc.)
- Non-Metal Compounds: All Non-Metals, Oxides
- Purity: 99.99 to 100 %
- State of Matter: Powder
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Supplier: TCI America
Description: 3-Aminopropionitrile (stabilized with K2CO3) / 2-Cyanoethylamine In this section, proteases are categorized into three modes of actions: (1) serine protease; (2) cysteine protease; (3) metalloprotease.1) Serine proteases are inhibited by AEBSF,
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Supplier: Xoxide
Description: % thermally Conductive filler by weight. In addition to micronized silver, Arctic Silver 5 also contains sub-micron zinc oxide, aluminum oxide and boron nitride particles. These thermally-enhanced ceramic particles improve the compound's performance and long-term stability. Controlled
- Compound Type: Thermally Conductive
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Supplier: Indium Corporation
Description: Indium sulfide (In2S3) is an orange-red to red colored powder with the sulfuric odor that is characteristic to all sulfides. It is insoluble in water and most organic solvents but decomposes in common mineral acids, releasing hydrogen sulfide gas. Indium sulfide is primarily used as a
- Ionic Component: Other Metals (Al, In, Sn, Pb, etc.)
- Non-Metal Compounds: All Non-Metals, Sulfides
- Purity: 99.99 %
- State of Matter: Powder
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Supplier: BigRep
Description: manufacturing aids. Optimized for large-format printers like the BigRep ONE, HI-TEMP also delivers great results on a wide range of third-party FFF 3D printers. HI-TEMP is a thermoplastic derived from organic compounds and is biodegradable under the correct conditions. It is
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Supplier: BigRep
Description: -based material derived from organic compounds, PLX is biodegradable under the correct conditions. CO2 neutral and environmentally friendly, it has a much lower ecological impact than other plastics derived from fossil fuels.
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Supplier: Advanced Abrasives Corp.
Description: due to its water miscibility make this product a favorite for those engaged in polishing metal injection molds to SPI Grades A-3, A-2 and A-1 finishes for the plastics molding industry. Our Uni-Pol universal oil based diamond extender is ideal for use as a lubricant with Uni-Pol
- Abrasive Grain Type: Diamond
- Form: Other
- Grading / Grit System: Micron Graded
- Type: Polishing
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Supplier: Indium Corporation
Description: Fromation : 49.039 cals (2 In + 3H2SO4 = In2(SO4)3 + 3H2 (g)) 72.78 cals (In2O3 + 3H2S04 (adqueous solution) = In2(SO4)3 + 3H2O) Dissociation Pressure : 10mm Hg @ 645 Degrees C 900mm Hg @ 820
- Ionic Component: Other Metals (Al, In, Sn, Pb, etc.)
- Oxoanions: All Oxoanions, Sulfates
- Purity: 99.99 %
- State of Matter: Powder
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Description: Contains the requirements for quartz filled epoxy resinous compounds in the cured form.
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Supplier: Xoxide
Description: Tuniq TX-2 High Performance Thermal Compound achieves the best interface between your CPU and the heatsinks by its unique designed molecular size and shape. Without any metal or electric conductive, Tuniq TX-2 High Performance Thermal Compound is safe, reliable and the
- Compound Type: Thermally Conductive
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Supplier: Master Bond, Inc.
Description: volume facilitates processing. Additionally, EP21BAS has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Adding more part "A" (e.g. 2:1 mix ratio) gives a more rigid cure while adding more part "B" (e.g. 2:3 mix ratio)
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 27 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Description: A two-part, high temperature curing, void filling compound. It is designed for honeycomb sandwich constructions, honeycomb splicing and reinforcement, mismatch areas filling, and inserts bonding. Offers the following advantages: High performance from -55°C to + 175°C, convenient 1
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Other
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Supplier: Parco Scientific Company
Description: those computer-savvy elementary and middle school students. Limited lifetime warranty on microscope, one year warranty on the camera. strong> strong>Features: ul style="border-width: 0px; margin: 18px 0px 18px 2em; padding: 0px; font-size: 12px; vertical
- Application: Biological / Life Science
- Digital Display: Yes
- Eyepiece Style: Monocular
- Grade: Student
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Description: A one part, high temperature curing, void filling compound. This product has the same formula as Scotch-Weld™ 3500–2 B/A, but it is the deaerated one part version. PMF stands for Premixed Frozen. It is designed for honeycomb sandwich constructions where heat resistance is needed
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Other
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Description: Gives the requirements for quartz filled epoxy resinous compounds in the cured form for types EP-F-1 to EP-F-7. Other materials than quartz may be introduced later.
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Description: Description The level regulator type NR 1/2”,3/4”,M20,M24-EE xi for tank insert is a solenoid switch, operating without contact with the function of monitoring and regulating liquid levels and temperatures. The switching tube contains bistable protective gas contacts
- Device Classification: Sensor-Only
- Material Temperature Range: 176 F
- Maximum Operating Pressure: 14.5 psi
- Meter Technology: Mechanical / Magnetic Floats
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Supplier: Transcat, Inc.
Description: measurement, accurate to 0.1°C (0.2°F) Measure 4-20 mA input Internal 24 V Loop Power Supply can power a transmitter under test Measure up to 30 V DC Large graphic style LCD with backlight can be configured to display up to 3 inputs simultaneously (i.e. pressure 1
- Process, Environmental, Thermodynamic Properties: Pressure / Vacuum
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Supplier: Sauereisen, Inc.
Description: -level to the full depth of the joint. The joint compounds cure quick enough to be ready for foot traffic in 24 hours and chemical service in 3 days. To use in vertical joints, add 1/2 to 1 pound of Thixotrope No. 220T (sold separately) to each unit of joint material and mix
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Elongation: 100 %
- Industry: Building / Construction
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Supplier: Scientific Polymer Products, Inc.
Description: 16.2% Acrylonitrile, 3.8% acrylic vinyl
- Chemical / Polymer System Type: PolyVinyl Chloride (PVC)
- Material Type / Grade: Thermoplastic
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Supplier: Indium Corporation
Description: .039 cals (2 In + 3H2SO4 = In2(SO4)3 + 3H2 (g)) : 72.78 cals (In2O3 + 3H2S04 (adqueous solution) = In2(SO4)3 + 3H2O) Dissociation Pressure: 10mm Hg @ 645 Degrees C 900mm Hg @ 820 Degrees C
- Ionic Component: Other Metals (Al, In, Sn, Pb, etc.)
- Oxoanions: All Oxoanions, Sulfates
- Purity: 99.99 %
- State of Matter: Powder
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Supplier: Wacker Chemical Corp.
Description: Silicone rubber base ELASTOSIL® C1451 is a 50 durometer self-lubricating material. The cured ELASTOSIL® C1451 exhibits good tensile, heat age and ASTM #3 oil immersion properties. It has been formulated to meet specific requirements of Ford's ESB-M2D280-A2, Chrylser's MS-AJ30-B
- Chemical / Polymer System Type: Silicone
- Elongation: 375 to 590 %
- Industry: Automotive
- Material Type / Grade: Elastomer / Rubber
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Supplier: Accuris
Description: Solventless Polymerisable Resinous Compounds Used for Electrical Insulation Part 3: Specifications for Individual Materials Section 3.2: Quartz Filled Epoxy Resinous Compounds
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Supplier: Master Bond, Inc.
Description: . Typical cure times range from as little as 5-10 seconds to 2-3 minutes at ambient temperatures. Commercially marketed 200 watt/inch medium pressure mercury vapor or equivalent UV light sources are recommended. Maximum UV absorption takes place in the 280-360 nanometer range. No solvents or
- Coeff. of Thermal Expansion (CTE): 83 to 100 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Single Component System
- Dielectric Constant (Relative Permittivity): Over 4
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Supplier: Accuris
Description: EPOXY RESIN, POTTING COMPOUND
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Supplier: Accuris
Description: PHENOLIC COMPRESSION MOLDING COMPOUND
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Supplier: Accuris
Description: Resin based reactive compounds used for electrical insulation - Part 3: Specifications for individual materials - Sheet 2: Quartz filled epoxy resinous compounds
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Supplier: Transcat, Inc.
Description: Loop Power Supply can power a transmitter under test Measure up to 30 V DC Large graphic style LCD with backlight can be configured to display up to 3 inputs simultaneously (i.e. pressure 1, pressure 2, and RTD or any combination of inputs) Ideal for gas flow calibration
- Process, Environmental, Thermodynamic Properties: Pressure / Vacuum
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Supplier: Transcat, Inc.
Description: Loop Power Supply can power a transmitter under test Measure up to 30 V DC Large graphic style LCD with backlight can be configured to display up to 3 inputs simultaneously (i.e. pressure 1, pressure 2, and RTD or any combination of inputs) Ideal for gas flow calibration
- Process, Environmental, Thermodynamic Properties: Pressure / Vacuum
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Supplier: Transcat, Inc.
Description: Loop Power Supply can power a transmitter under test Measure up to 30 V DC Large graphic style LCD with backlight can be configured to display up to 3 inputs simultaneously (i.e. pressure 1, pressure 2, and RTD or any combination of inputs) Ideal for gas flow calibration
- Process, Environmental, Thermodynamic Properties: Pressure / Vacuum
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Supplier: O-Z/Gedney
Description: HOT DIP GALVANIZED MALLEABLE/DUCTILE IRON MATERIAL 3-3/8 INCH EXPOSED WIRE, RUBBER/PLASTIC INSULATED CABLE USED ON (1) 2.28 INCH/(2) 1.21 INCH/(3) 1.16 INCH/(4) 0.97 INCH WIRE SIZE CSA APPROVAL 4-3/8 INCH DIAMETER 3 INCH CONDUIT SIZE WITH NEOPRENE RING SEAL
- Conduit Size: 4.38 inch
- Material: Galvanized Steel
- Type: Other
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Supplier: Wacker Chemical Corp.
Description: Silicone Rubber Compound ELASTOSIL® C1526 A BLK VX is a 60 durometer, oil resistant material. This material can be used in a variety of applications including ones where properties similar to those specified in Ford WSE-M2D399-A3 are relevant. Special features Good tear
- Chemical / Polymer System Type: Silicone
- Elongation: 377 %
- Industry: Industrial
- Material Type / Grade: Elastomer / Rubber
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Supplier: O-Z/Gedney
Description: HOT DIP GALVANIZED MALLEABLE/DUCTILE IRON MATERIAL 3-3/8 INCH EXPOSED WIRE, RUBBER/PLASTIC INSULATED CABLE USED ON (1) 2.65 INCH/(2) 1.4 INCH/(3) 1.34 INCH/(4) 1.12 INCH WIRE SIZE CSA APPROVAL 5 INCH DIAMETER 3-1/2 INCH CONDUIT SIZE WITH NEOPRENE RING SEAL ZINC
- Conduit Size: 5 inch
- Material: Galvanized Steel
- Type: Other
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Supplier: O-Z/Gedney
Description: ZINC PLATED STEEL MATERIAL 3-3/8 INCH EXPOSED WIRE, RUBBER/PLASTIC INSULATED CABLE USED ON (1) 3 INCH/(2) 1.58 INCH/(3) 1.52 INCH/(4) 1.27 INCH WIRE SIZE CSA APPROVAL 5-1/2 INCH DIAMETER 4 INCH CONDUIT SIZE HRE MODEL
- Conduit Size: 5.5 inch
- Material: Steel
- Type: Other
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Supplier: O-Z/Gedney
Description: HOT DIP GALVANIZED MALLEABLE/DUCTILE IRON MATERIAL 3-3/8 INCH EXPOSED WIRE, RUBBER/PLASTIC INSULATED CABLE USED ON 2.28 INCH WIRE SIZE CSA APPROVAL 4-3/8 INCH DIAMETER 3 INCH CONDUIT SIZE WITH CANVAS BAKELITE CLAMPING DEVICE ZINC PLATED LOCKNUT HPE MODEL
- Conduit Size: 4.38 inch
- Material: Galvanized Steel
- Type: Other
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Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Featuring a silver filler, EP3HTS-LO is electrically conductive with a low volume resistivity of less than 0.001 ohm-cm. It also has a thermal conductivity of 12-15 BTU•in/(ft²•hr•°F) [1.73-2.16 W/(m·K)]. EP3HTS is dimensionally stable and bonds well to metals (read more)
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QSil-553 2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to (read more)
Browse Conductive Compounds Datasheets for CHT USA Inc. -
and controls. Our culture is one of continuous improvement. The leader for 39 years in formulating and mixing high performance elastomers. Compounding Equipment Qty (2) - 76 Liter, 3D Banbury Internal Mixers (Computer Controlled) Qty (1) - 20 Liter, 1D (read more)
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Cri-Tech, Inc. manufactures custom resins and compounds to match your specifications. Formulation Development, Custom Rubber and Plastic Compounding, Color development & Specialty Toll Manufacturing. Cri-Tech 5,200 m2 state of the art facility has over 3,600 MTs of internal and twin (read more)
Browse Resins and Compounds Datasheets for Cri-Tech, Inc. -
components. Once cured the materials deliver a thermal conductivity of 2.3 and 3.0 W/m°K respectively. Learn More (read more)
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1. Good dispersibility and strong stability; 2. Excellent suspension; 3. Wide (read more)
Browse Abrasive Compounds and Abrasive Slurries Datasheets for Beijing Grish Hitech Co., Ltd. -
Key properties of this B staged epoxy are that it passes the twelve second vertical burn per AITM 2.0002B and Section 7.1.2 of ABD0031, Issue F, and toxic gas emmission per AITM 3.0005, Issue 2 in the flaming mode and Section 7.4 of ABD0031, Issue F. Product Advantages (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
the material cures in place and will not run or slump. The compound requires a relatively low heat cure of 85°C for 2-3 hours, is thermally conductive and electrically non-conductive. “Supreme 3DM-85 is designed for heat sensitive components that cannot withstand high temperatures (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
thermally conductive while exhibiting extremely low stress on delicate board components. Once cured the materials deliver a thermal conductivity of 2.3 and 3.0 W/m°K respectively. LG Series materials are available in cartridges, pails and drums allowing them to be applied (read more)
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High-throughput data mined prediction of inorganic compounds and computational discovery of new lithium-ion battery cathode materials
Voltage computations (vs lithium metal) for the Li3 M( CO3 )(PO4 ) (M=Mn, Fe, Co, Ni) compounds predict only the Fe ( Fe2 + /Fe3+ : 3 V), Mn (Mn2+ /Mn3+ : 3.3V; Mn3+ /Mn4+ : 4.1V ) and Co (Co2+ /Co3+ : 4.1V) based compounds…
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Defect‐Controlled Formation of Triclinic Na 2 CoP 2 O 7 for 4 V Sodium‐Ion Batteries
…strongly favor the 2 + oxidation state.[16,18] On the other hand, in the iron-based rose compound , excess Fe2 + and oxidized Fe3+ states … both the 2 + and 3 + oxidation state.[10c–e] Based … phase also contains both Co3 + cations (8% of the…
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Preparation of barium hexaferrite from mixtures of ferric oxide and barium nitrate or barium oxides and from mixtures produced by nonceramic methods
The as-precipitated system, consisting of FeCO 3, Fe2 { CO3 ) a, and BaCO 3 , is subjected to both the oxidizing action of atmospheric oxygen and to hydrolysis … FeO(OH), Fe(OH) 3, FeCO~, BaCO 3, and other intermediate and complex compounds .
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Current Challenges for Modeling Enzyme Active Sites by Biomimetic Synthetic Diiron Complexes
Structures of complexes (from left to right): [Fe2(µ-O)(µ- CO3 )BPG2DEV], [NaFe(PIC2DET)(µ-O2CTrp) 3 ], [ Fe2 (µ-O2CArTol)3- (Et2BCQEBEt)]+, [Fe2(µ-OTf)2(PIC2DET)2]2+, and comparison of the M–M distances in these compounds .
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Alphabetical Index of Substances
FeF3 HTB lt Fe3(Fe,Si)2O4(OH)5 2H Fe(H2O)2[BP2O8]∙H2O Fe2 (HPO3) 3 Fe3N ε Fe(NO)3Cl … 41ZrSe2 G22 GIC (graphite intercalation compound ) GaInS3 IIb Ga2.7Ir9B5 … 15(HPO4)1.30( CO3 )1.55(OH)2…
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Aphabetical Index of Substances
…EuPtP α E9H Fe1.7Al4Si Fe2Ga2S5 2H Fe2-xGe β Fe2 -xGe η Fe3Ge2Sb Fe3Ge2 … G71 GIC (graphite intercalation compound ) GIC (graphite intercalation compound … 0.3∙0.7H2O K2Ca( CO3 )2 K6.5Ca0.75Nb14Si4O47 … K0.5CoO2 K2Co2(SeO3) 3 K5CuAs2 KFe11O17 K1.55Fe10…
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Ga spinels and Ga spinels with substitutions
Compound CoFe2-xGaxO4 CoMnGaO4 CuCr2-2xGa2xO4 CuFe2-2xGa2xO4 Cu1-xFe2-2xLi0.5xGa2.5xO4 Cu0.5Fe1.25Li0.25GaO4 CuMnGaO4 Fe2 +Fe23-+xGaxO4 Li0.5Ga2 … Cation distribution Ga3+[Mn2+ Co3 +]O4 Fe0.43Ga0.535Cu0 … 60L 74BKK 2) 68LT 3 ) 73LTL 76LL 60L 72MBVV…
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Rechargeable Batteries
The Fe-( Fe2 + /Fe3+ : 3 V),. .... Mn-(Mn2+ /Mn3+ : 3.2 V and Mn3+ /Mn4+ : 4.1 V), and Co-(Co2+ / Co3 + : 4.1 V) based compounds are predicted to be electrochemically active in a voltage range suitable for today’s electrolytes.
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Marine Ecological Processes
On a geological time scale, phosphate in seawater is in equilibrium with phosphate minerals such as francolite (Ca10 [PO4 CO3 ]6 Fe2 ) or hydroxy-. .... apatite (Ca5 OH[PO4 ] 3 ), but for ecological purposes these phosphate com- pounds can be considered almost insoluble.
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General Chemistry/Print version - Wikibooks, open books for an open world
Set up an algebraic expression while considering just the iron ion and the carbonate ion: Fe2 ( CO3 ) 3 2x 3(-2) 2x - 6 = 0 2x = 6 x = 3. .... Each iron ion in the compound has an oxidation state of +3.