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Description: The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K. ? Soft and elastic after curing, maintaining the required thickness and providing shock absorption. ?
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 7.5
- Features: Thermal Compound / Interface (Thermally Conductive)
- Form: Gel
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Description: CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ? Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ? Available in various thicknesses from 0.3 to 12.0 mm. ? Features natural tackiness for easy application and rework. ? High
- Dielectric Strength: 0.0025 kV/in
- Elongation: 10 %
- Features: Thermal Compound / Interface (Thermally Conductive)
- Form: Pad
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi. ? Minimum interface thickness can reach as
- Features: Thermal Compound / Interface (Thermally Conductive)
- Form: Grease / Paste
- Industry: Electronics
- Thermal Conductivity: 1 W/m-K
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi. ? Minimum interface thickness can reach as
- Features: Thermal Compound / Interface (Thermally Conductive)
- Form: Grease / Paste
- Industry: Electronics
- Thermal Conductivity: 4 W/m-K
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 11.11 to 62.22 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 5.19
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 8.89 to 37.78 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 4.9
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 16.67 to 42.22 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 3.39
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 22.22 to 106 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 4.97
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Supplier: Hernon Manufacturing, Inc.
Description: Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap.
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Features: Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics, Electrical Power / HV
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2850KT Blue, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for high voltage components and replacing heat sinks. It contains a filler that is gritty. It offers a low coefficient of thermal expansion,
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 345 to 356 kV/in
- Electrical / Electronics Applications: Electrical Power / HV (Coils, Motors)
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Supplier: Protavic America, Inc.
Description: Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm°K thermal performance with supporting laser flash data. Room temperature cure.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrical Insulation / Dielectric Material, Thermal Compound / Interface (Thermally Conductive)
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Supplier: Chemence Inc.
Description: KSC2040 is a thermally conductive silicone RTV adhesive rubber developed for heat sink applications. KSC2040 is a 1-part silicone that when applied to the substrate enables adhesion to parts and heat transfer of the bonded assembly within minutes. When cured, the elastomer
- Chemical / Polymer System Type: Silicone
- Composition: Single Component System
- Form: Grease / Paste
- Industry: Electronics
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Supplier: Chemence Inc.
Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed
- Chemical / Polymer System Type: Silicone
- Composition: Single Component System
- Form: Grease / Paste
- Industry: Electronics
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Supplier: Chemence Inc.
Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when
- Chemical / Polymer System Type: Silicone
- Composition: Single Component System
- Form: Grease / Paste
- Industry: Electronics
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Supplier: Hernon Manufacturing, Inc.
Description: Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator® 745, through a special shimming property, insulates the component electrically while allowing thermal
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Features: Thermal Compound / Interface (Thermally Conductive)
- Form: Specialty / Other
- Industry: Electronics, Electrical Power / HV
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Supplier: Nordson EFD
Description: Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a
- Chemical / Polymer System Type: Specialty / Other
- Composition: Single Component System, Unfilled
- Cure Type / Technology: Air Setting / Film Drying
- Features: Thermal Compound / Interface (Thermally Conductive)
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Supplier: Techsil Limited
Description: PCB's to substrates and for use as a thermal adhesive between electronic components and heat sinks. Product Benefits Easy to use, one-component material Thermally conductive Flame retardant Non-corrosive to most metals Low volatility
- Chemical / Polymer System Type: Silicone
- Features: Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Supplier: Techsil Limited
Description: mechanical shocks; and provides the low resistivity needed for many operating conditions. Primarily used a cold solder, 8330 allows for quick cold soldering repairs and is effective at bonding heat sinks to other components and PCBs. It also provides excellent EMI/RFI shielding and is
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Supplier: Techsil Limited
Description: repairs and is effective at bonding heat sinks to other components and PCB's. 8331 also provides excellent EMI/RFI shielding and is very effective at filling seams between metal plates. Product Benefits Electrical resistivity: 0.007 O·cm Thermal conductivity: 0
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Supplier: Techsil Limited
Description: repairs and is effective at bonding heat sinks to other components and PCB's. 8331 also provides excellent EMI/RFI shielding and is very effective at filling seams between metal plates. Product Benefits Electrical resistivity: 0.007 O·cm Thermal conductivity: 0
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Supplier: Epoxies Etc...
Description: 50-1220 is a one component thermal grease. This heavy filled Heat Sink Compound promotes high thermal conductivity, low bleed, and high temperature stability.
- Chemical / Polymer System Type: Silicone
- Dielectric Constant: 5
- Dielectric Strength: 210 kV/in
- Electrical Resistivity: 2.00E15 ohm-cm
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Supplier: Henkel Corporation - Electronics
Description: Hi-Flow 300G consists of a thermally conductive 55°C phase change compound coated on a fiberglass web. Hi-Flow 300G is designed as a thermal interface material between a computer processor and a heat sink. Above the phase change temperature, Hi-Flow 300G wets-out the thermal interface
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: heat sinks or a metal chassis. Your benefits Thermal conductivity: 0.8 W/m-K Enhanced puncture, shear, and tear resistance Easy material handling Electrically isolating Applications Telecommunications
- Features: Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: Loctite 383 Output is a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components, while the controlled strength permits field
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Industry: Electronics
- Thermal Conductivity: 0.6000 W/m-K
- Viscosity: 500000 cP
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Supplier: Henkel Corporation - Electronics
Description: ABLESTIK ABLEFILM ECF563 unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in bonding microwave substrates into packages.
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Form: Film / Sheet
- Industry: Electronics
- Thermal Conductivity: 1 W/m-K
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Supplier: Epoxies Etc...
Description: 50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates prior to wave soldering. It may also be used in heat sink applications.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Single Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Thermal Compound / Interface (Thermally Conductive)
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped
- Chemical / Polymer System Type: Silicone
- Dielectric Strength: 381 kV/in
- Features: Thermal Compound / Interface (Thermally Conductive), UL Approved
- Form: Film / Sheet, Pad, Specialty / Other
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Supplier: Wacker Chemical Corp.
Description: flowable almost constant properties between -40 °C and +180 °C primerless adhesion Application versatile interface material for heat sink applications for the electronics industry thermally conductive adhesive material applicable as thin interface layer between PCB and metal housings
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System
- Cure Type / Technology: Thermosetting / Crosslinking
- Elongation: 90 %
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Supplier: RS Components, Ltd.
Description: Two part, metal oxide loaded, thermal bonding system. Can be used to bond heat sinks assemblies in piggy back arrangements, assembly of complex heat sink and as a bonding medium in surface mounting assemblies. Excellent electrical insulation properties. Solvent free
- Features: Thermal / Heat Conductive
- Thermal Conductivity: 1.1 W/m-K
- Use Temperature: -40 to 248 F
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Supplier: Wacker Chemical Corp.
Description: /mK Two-part, RT curing Constant properties from –50 °C to +180 °C Low stress, soft and tacky D4-D8 < 350ppm Low abrasive Application Interface material for heat sink applications for the electronics industry
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Dielectric Strength: 203 kV/in
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Supplier: Wacker Chemical Corp.
Description: Pure white, soft consistency, heat sink paste with marked thermal conductivity. Electrically insulating. Application WACKER® SILICONE PASTE P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat transfer
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 3.5
- Dielectric Strength: 254 kV/in
- Features: Electrical Insulation / Dielectric Material, Thermal Compound / Interface (Thermally Conductive)
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Supplier: MacDermid Alpha Electronics Solutions
Description: components, or between any surfaces where thermal conductivity or heat dissipation is important. It is ideal for application on the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers, semiconductors, thermostats, power resistors, and
- Chemical / Polymer System Type: Silicone
- Features: Thermal Compound / Interface (Thermally Conductive)
- Form: Grease / Paste
- Industry: Semiconductors / IC Packaging, Electronics
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Supplier: Master Bond, Inc.
Description: For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 7.22 to 8.33 µin/in-F
- Composition: Two Component System, Filled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Graphene Laboratories, Inc.
Description: Conductivity (2.9 W/m·K): Our adhesive ensures efficient heat transfer from the heat-generating component to the heat sink or other thermal management components. It helps in dissipating heat quickly, preventing thermal issues like overheating and performance
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Filled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Features: Electrically Conductive Compound (Adhesive, Grease), Specialty / Other
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Supplier: Hi-Tech Seals, Inc.
Description: conductive acrylics. Dissipator® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement.
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Coeff. of Thermal Expansion (CTE): 3.94E-4 µin/in-F
- Cure Type / Technology: Reactive / Moisture Cured, Two Component System
- Dielectric Constant (Relative Permittivity): 12.34 to 14.92
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flowability before curing and outstanding elasticity and durability after curing. In today’s compact robotic designs, traditional cooling methods—such as air cooling or heat sinks—are no longer sufficient to manage heat inside enclosed structures. Thermal potting adhesives, when applied (read more)
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pattern influence heat generation and dissipation. Additionally, the type of wire insulation materials affects the motor’s capacity to manage heat. High-quality insulation can withstand higher temperatures and humidity, preventing thermal degradation of the windings. In some flat motors, resin or (read more)
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Detection of Joule heating before dielectric breakdown in polyethylene films
Thermographs of conduction current at 23.4'C in polyethylene film with epoxy resin heat sink .
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Fabrication of high-power AlInGaP-based red light emitting diodes with novel package by electroplating
Thus it is very effective in heat dissipation that the LEDs chip directly contacted the copper heat sink without resin , resulting in higher operation current and luminous intensity.
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High Thermal Dissipation of Ultra High Power Light-Emitting Diodes by Copper Electroplating
Thus they are very effective in heat dissipation that the RGB LEDs chip directly contacted the copper heat sinks without resins , resulting in higher operation currents and luminous intensities.
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Ultra High Power Light-Emitting Diodes with Electroplating Technology
injection current for the novel package (a) red (b) green (c) chip directly contacted the copper heat sinks without resins , .
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Temperature Dependence of Soil Water Potential
6) epoxy resin encapsulating heat sink .
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Preliminary study of radioactive waste disposal in the vadose zone
… Dalton (1667) for in ri(u measnremcnl of soil water potential show ing Teflon insert (1), copper heat sink (2), chro- mel-Cviiftantan thermocouple (3). copper lead wires (4), acrylic tubing (6), onoiy resin encapsu lating heat sinks (6), and ceramic bulb …
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Design method for high reliable flip chip BGA package
Because various materials, including silicon dies, solder balls, organic substrates, underfill resins , heat sinks made of metal, etc., are used in these packages, coefficient of thermal expansion (CTE) mismatch among these materials may damage the packages or cause them to fail.
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III-Nitride Based Light Emitting Diodes and Applications
Although there are lots of issues needed to be addressed in white LEDs, such as chip processing, light extraction efficiency, heat sink structures, resin materials, re- liability, life test, and etc., this chapter focuses on phosphors materials and their applications in white …
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Laser Drilling of Copper Foils for Electronics Applications
The presence of this resin “overhang” suggests that either the copper is acting as a heat sink preventing the resin in immediate contact with this layer from reaching a high enough temperature to be removed [15], or alternatively, molten/evaporated resin has re …
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Reliability and degradation mechanism of AlGaN/GaN HEMTs for next generation mobile communication systems
Packaging: Device sawn and attached with epoxy resin to Copper heat sink .