Electrical and Electronic Resins Specifications

Help with Electrical and Electronic Resins specifications:

Material Type

	Use
	Your choices are...
	Die Bonding Adhesive / Compound		Adhesive resins or compounds are used for joining electrical or electronic components such as die bonding compounds. They require clean surfaces that are compatible with the adhesive.
	Conformal Coating		Encapsulating or conformal coatings are compounds that are used to seal or cover an element or circuit from mechanical and environmental ingress. Typically, the encapsulant layers are less than 100 mils thick.
	Encapsulant / Potting Compound		Encapsulates and potting compounds are resins used to encapsulate circuit boards or semiconductor devices, fill a container of electronic devices, or infiltrate electrical coils to provide environmental protection and electrical insulation. Ceramic cement-based potting compounds are available for high-temperature applications.
	Glob Top / Daub		Glob top or daub-type compounds are used to insulate semiconductor dies or other electronic components on a printed circuit board (PCB) or other device without encapsulating the entire assembly.
	Gap Filling Compound		Gap filling or under fill compounds are used to fill gaps or spaces between two surfaces that are to be bonded or sealed. Flexible sheet materials, as well as sealants or form-in-place (FIP) compounds (liquid and viscous materials) are used to fill gaps between seams or on surfaces to contain fluids, prevent leaks, and prevent infiltration of unwanted material.
	Impregnating Resin		Impregnating resins are designed for applications that require a low-viscosity resin or varnish for coil impregnation or Litz wire coating. The resin may infiltrate the coil or electrical device through capillary action, trickle application, or with vacuum assistance.
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Form / Shape

	Form
	Your choices are...
	Film / Sheet		Material is supplied as a sheet or film. Sheets have a thickness between 0.006" and 0.250" and a minimum width of 24" (609.6 mm). Typically, sheets are formed to precise thicknesses and/or width requirements.
	Gel		Material is supplied as a polymer, elastomer, adhesive, sealant, or resin in the form of a high-to-moderate viscosity "solid" gel or liquid gel. Gel adhesives are more run-resistant during their application. Elastomer gel materials are used in cushioning, and in bumper or shock absorption applications.
	Grease / Paste		Greases and pastes have a high enough viscosity to seal joints, openings, or fittings without migration or leakage from the gap. Vacuum sealants have low vapor pressures to prevent out gassing into the system. Greases do not cure or polymerize under normal end-use conditions. Pastes may cure or set depending on the composition.
	Liquid		The adhesive, sealant, or resin is in the form of a low-viscosity liquid, generally free-flowing if not contained.
	Pad		The adhesive or sealant comes in soft, conformable pads.
	Pellets / Solid Form		The resin is in the form of pellets or coarse granules.
	Powder		The adhesive is supplied in the form of a finely ground particulate. Novolac phenolic resins are often provided in a powder form.
	Specialty / Other		Other specialty, proprietary, or unlisted material forms.
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Material System

	Chemical / Polymer System Type
	Your choices are...
	Acrylic / Polyacrylate		Acrylics feature excellent environmental resistance and fast-setting times. Acrylic polymers are produced from acrylic acids via a catalytic reaction.
	Cyanoacrylate		Cyanoacrylates are one-part acrylate adhesives that cure instantly on-contact with mated surfaces through a reaction with surface moisture. Cyanoacrylates are often called super-glues. They have high strength and provide excellent adhesion to a wide variety of substrates, especially plastics. Potential disadvantages include poor shock or impact resistance (brittleness), and poor gap-filling abilities. Cyanoacrylates that are modified with rubber or elastomers have overcome some of these problems.
	Epoxy (EP)		Epoxy resins (EP) exhibit high strength and low shrinkage during curing. Epoxies are known for their toughness and resistance to chemical and environmental damage. Most epoxies are two-part resins cured at room temperature. Some thermally cured or thermoset one-part epoxies are also available. Depending on the formulation, epoxy resins are used as casting resins, potting agents, resin binders or laminating resins in fiberglass or composite construction. They are also used as encapsulates, electrical conductors in microelectronic packaging, and adhesives in structural bonding applications.
	Phenolics / Formaldehyde Resins (Melamine, Furan, etc.)		Phenolic and formaldehyde resins are thermosetting molding compounds and adhesives that provide strong bonds and good resistance to high temperatures. Phenolic or phenol formaldehyde, urea formaldehyde, furan, and melamine resins are all part of this category. Generally, the most durable phenolic resin adhesives are made from chemicals of the phenol group and formaldehyde. Phenolic resins come in liquid, powder, and film form. Special phenolic resins are available that harden at moderate temperatures when mixed with suitable accelerators. Phenol-formaldehyde, resorcinol-formaldehyde, resol, and novalac resins are types of phenolic resins. Urea resin adhesives are made from urea, formaldehyde, and catalysts or hardeners. Urea formaldehyde resins can harden rapidly at moderate temperatures, but generally do not have the properties of phenolic resins. Melamine resins are made through a reaction of dicyandiamide with formaldehyde. Most of the resins in this group have excellent dielectric properties.  Furan formaldehyde (FF) resins are made by the polymerization or poly-condensation of furfural, furfural alcohol, or other compounds containing a furan ring, or by the reaction of these furan compounds with other compounds (not over 50%). Fire-retardant furans are used in hand lay-up, spray-up, and filament winding operations. Furans are commonly used in foundry binders, grinding wheels, refractories, and other high-temperature applications. Furan resins and chemicals are also used in fiberglass composites, hybrid resins combined with epoxy or phenolics, and in corrosion-resistant cements.
	Polyamide		Polyamides are used to produce strong hot-melt adhesives with higher strength than either polyethylene or other hot-melt adhesives. Nylon is a well-known example of a polyamide engineering resin that is also used to mold plastic parts.
	Polyethylene (PE)		Polyethylene (PE) is used as a hot-melt adhesive.
	Polyester (PET)		Polyester (PET) is used as a hot-melt adhesive.
	Polyester / Vinyl Ester		Thermosetting resins or plastics are based on the polyester (alkyd) or vinyl ester system. These materials should not be confused with thermoplastic polyesters or PET resins.
	Polypropylene (PP)		Polypropylene (PP) is commonly used in hot-melt adhesive systems. PP is a polymer based on polypropylene chemical bonds.
	Polysulfide		Polymer resins or compounds are based on polysulfide or polyphenylene sulfide (PPS) chemical systems.
	Polyurethane (PU, PUR)		Polyurethane (PUR) resins provide excellent flexibility, impact resistance, and durability. Polyurethanes are formed through the reaction of an isocyanate component with polyols or other active hydroxyl group compounds. PUR resins require a catalyst, heat, or air evaporation to initiate and complete curing.
	Silicone		Plastic compounds, elastomer resins, or polymers are based on the silicone chemical system. Silicones are produced through the hydrolysis and polymerization of silanes and siloxanes.
	Vinyl (PVC)		Polymers are based on the vinyl chemical system. Examples include polyvinyl chloride (PVC), polyvinylidene chloride (PVDF), polyvinyl vinyl acetate (PVA), and polyvinyl alcohol (PVOH).
	Specialty / Other		Other specialty, proprietary, or unlisted resins, chemical systems or compound or polymer types.
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	Cure Type / Technology
	Your choices are...
	Air Setting / Film Drying		Air setting or film drying materials form a bond or "harden" by evaporating water or an organic solvent. Inorganic binders or cements are sometimes air setting. Refractory-type products may develop strong bonds after firing. Many pastes and gum adhesives are film-drying.
	Anaerobic		Anaerobic adhesives cure in the absence of air or oxygen.
	Contact / Pressure Sensitive (PSA)		Pressure sensitive adhesives (PSA) adhere to most surfaces with very slight pressure and retain their tackiness. PSAs are available in solvent and latex or water-based forms. Pressure sensitive adhesives are often based on non-crosslinked rubber adhesives, acrylics or polyurethanes. They form viscoelastic bonds that are aggressively and permanently tacky, and adhere without the need of more than finger or hand pressure.
	Reactive / Moisture Cured		Reactive resins are single-component adhesives that are applied in the same way as hot-melt adhesives. The resins react with moisture to crosslink and polymerize, thus resulting in a cured material. Polyurethane reactives (PUR) are examples of this type of technology. Certain silicones and cyanoacrylates also use a reaction with moisture or water to cure the adhesive or sealant.
	Room Temp. Cure / Vulcanizing		Room temperature curing or vulcanizing products are polymer resins or compounds that either cure or vulcanize at room temperature. Vulcanization is a thermosetting reaction involving the use of heat and/or pressure in conjunction with a vulcanizing agent. It results in greatly increased strength, stability, and elasticity in rubber-like materials. The vulcanizing agent is a crosslinking compound or catalyst. Silicones use moisture, acetic acid, and other compounds as curing or vulcanizing agents.
	Thermoplastic / Hot Melt		Thermoplastics can be repeatedly softened by heat and then hardened, or set by cooling, which allows parts to be injection-molded or thermoformed and scrap to be reprocessed. Thermoplastic or hot melt adhesives can be repeatedly softened by heat and then hardened, or set by cooling, which allows parts to be removed or repositioned during assembly. Most hot melt adhesives are solvent-free thermoplastics that melt or drop in viscosity above 180°F, and then rapidly set upon cooling. They are used in a variety of manufacturing processes, including bookbinding, woodworking, construction, product assembly, and box and carton heat sealing.  Hot melt adhesive technology stemmed from the previous use of molten wax for bonding. Thermoplastic systems were introduced to satisfy performance needs. Typically, a pure hot melt system will not have the heat resistance of two-part, catalyst, or thermoset adhesives. Hybrid hot melt systems are available that exhibit a degree of reactive curing.  Polyethylenes, polyamides and ethylene-vinyl acetates are common types of hot melt adhesives. Heat activated adhesives become sticky or tacky when warmed, and are used in contact or PSA-type applications.
	Thermosetting / Crosslinking		Thermoset plastics and thermoset resins are crosslinked polymeric resins that are cured using heat or heat and pressure. Cured thermoset resins generally have higher resistance to heat than thermoplastics, but cannot be melted down and reprocessed. Thermoset adhesives are crosslinked polymeric resins cured using heat or heat and pressure. Cured thermoset resins do not melt and flow when heated, but they may soften. Phenolic, melamine, and urea formaldehyde resins are thermosetting adhesives that offer strong bonds and good resistance to high temperatures.  Vulcanization is a thermosetting reaction involving the use of heat and/or pressure in conjunction with a vulcanizing agent, resulting in greatly increased strength, stability and elasticity in rubber-like materials. RTV silicone rubbers are room temperature vulcanizing materials. The vulcanizing agent is a crosslinking compound or catalyst. Sulfur is the traditional vulcanizing agent used with natural rubber. Silicones use moisture, acetic acid and other compounds as curing agents.
	UV / Radiation Cured (also EB, Light)		UV or radiation cured adhesives use ultraviolet light, visible light, or electron beam (EB) irradiation to initiate curing, which forms a permanent bond without heating or excessive heat generation. One disadvantage of UV curing adhesives is the requirement that one substrate is UV transparent. Some UV resin systems employ a secondary curing mechanism to complete curing of adhesive regions shielded from the UV light. EB curable adhesives use electron beam radiation to cure or initiate curing.  The electron beam can penetrate through material that is opaque to UV light.
	Specialty / Other		Other unlisted, specialty, proprietary technologies or cure types.
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Industry

	Industry:
	Your choices are...
	Optoelectronics / Photonics		Products are designed for optoelectronics or photonics applications. Examples include cements for bonding simple lenses into compound structures.
	Semiconductors / IC Packaging		Products are designed or are suitable for semiconductor or semiconductor packaging applications.
	Electronics		Products are designed for use in electronics applications. For example, they can be used in potting or encapsulating compounds, conductive adhesives, and dielectric sealants.
	Electrical Power / HV		Products are resins, compounds, and plastic composites that are suitable for electrical power or high voltage (HV) applications such as generator or motor assemblies, coil or transformer manufacturing, and switch or circuit breaker insulation.
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Features

	Composition
	Your choices are...
	Single Component System		Single component adhesives or sealant systems consist of one resin that hardens by reaction with surface moisture, a surface applied activator-primer, or through the application of heat.
	Two Component System		Two or multi-component adhesive or sealant systems consist of two or more resins or a resin and a hardener, crosslinker, activator, or catalyst that, when combined, react and cure into a polymerized compound or bond. Two component systems are mixed and then applied.
	Unfilled		Raw materials or unfilled resins do not contain any additional modifiers such as fillers, colorants, dispersants, plasticizers, wetting agents, levelers, or defoamers. These products are used as starting components or raw materials for the production of finished plastic resins, elastomers, adhesives, sealants, coatings, or other polymer-based products.
	Filled		Filled compounds consist of adhesives with additional modifiers such as pigments or chopped fiber reinforcements. Typically, filled compounds are ready-to-use.
	Solvent Based (Volatile Organic)		Solvent-based adhesive resins use a volatile organic solvent (VOC) to thin or alter viscosity. Typically, solvent-based adhesive resins result in greater environmental or regulatory control problems. Solvents can also present a fire hazard or a risk of explosion, depending on the plant or job site.
	Water Based / Latex Dispersion		Water-based or water-borne adhesive resins are water soluble or water emulsion-based resin systems that typically do not contain any VOC solvents. Water-based adhesive resins usually present fewer environmental or regulatory control problems.
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	Features
	Your choices are...
	Anti-static / ESD Control		Anti-static materials have relatively high electrical conductivity or low electrical resistivity. They are used in electronic, anti-static, or electrostatic discharge (ESD) applications.
	Electrical Insulation / Dielectric Material		Dielectric compounds and electrical insulation materials form a barrier or isolator between electrical or electronic components. The voltage potential between the conductor and conductive components influence material selection, based on the dielectric strength to reduce shorting. Dielectric constant and loss tangent are important parameters in minimizing crosstalk between insulated circuit paths.
	Electrically Conductive Compound (Adhesive, Grease)		Resins or compounds with a high degree of electrical conductivity (low resistivity) are used in applications such as anti-static or ESD control, EMI/RFI shielding, thick-film metallization, and device and board-level electrical interconnection.
	EMI / RFI Shielding Material		Polymers or elastomers are designed to provide shielding from electromagnetic interference (EMI) or radio frequency interference (RFI). Typically, these compounds have a high degree of electrical conductivity.
	Flame Retardant (e.g. UL 94 Rated)		The material is flame retardant in accordance with industry standards from Underwriters Laboratories, Inc. (UL), Flame Class 94, or other ISO standards. Flame-retardant materials are designed to reduce the spread of flame or resist ignition when exposed to high temperatures. They also insulate the substrate and delay damage to it.
	Optical Grade / Material		Polymers or elastomers are designed for optical or photonics applications. Examples include transparent polycarbonate or acrylic lens materials.
	Thermal Insulation / Heat Insulating		Thermally insulating resins, plastics, compounds and encapsulates provide a thermal barrier between components and a hot or cold source.
	Thermal Compound / Interface (Thermally Conductive)		Materials are designed to form a thermally conductive layer on the substrate, between components, or within a finished electronic product. Thermally conductive resins, thermoplastics, encapsulates, potting compounds, tapes, pads, adhesives and greases are often used between a heat-generating electrical device and a heat sink to improve heat dissipation.
	UL Approved		The material is approved to or recognized under one or more requirements of Underwriters Laboratories, Inc. (UL).
	Specialty / Other		Other unlisted, specialized and proprietary polymers, resins, monomers, or intermediates. These materials are based on unique chemical or polymer systems, use novel curing technologies, or have properties tailored to specific applications.
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Thermal Properties

	Use Temperature		Use temperature is the range of temperatures a product can be exposed to without the degradation of structural or other required end-use properties.
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	Thermal Conductivity		Thermal conductivity is the linear heat transfer per unit area through a material for a given applied temperature gradient. Heat flux (h) = [thermal conductivity (k) ] x [temperature gradient (Δ T)]
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	Coeff. of Thermal Expansion (CTE)		Coefficient of linear expansion (CFE) is the amount of linear expansion or shrinkage that occurs in a material with a change in temperature.
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Mechanical Properties

	Tensile Strength (Break)		Tensile strength at break is the maximum amount of stress required to break the material under tension-loading test conditions, or to cause failure. Typically, tensile tests are performed according to test procedure standards such as ASTM D-638 or ISO 527-1, ASTM D-1708, ASTM D-2289 (plastics at high strain rates), and ASTM D-882 (thin plastic sheets), as well as other OEM proprietary standards.
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	Elongation		Elongation is the amount of deformation as a percentage that occurs during a tensile test or other mechanical test.
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Electrical & Optical Properties

	Dielectric Strength		Dielectric strength is the maximum voltage field that the material can withstand before electrical breakdown occurs.
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	Dielectric Constant (Relative Permittivity)		The dielectric constant is the relative permittivity of a material compared to a vacuum or free space.  As an equation, it is expressed as k = εr = ε / εo= where ε is the absolute permittivity of the material and εo is the absolute permittivity of a vacuum 8.85 x 10-12 F/m.
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	Index of Refraction		The index of refraction is a measure of the speed of light in a material.
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	Transmission		This is the amount of light transmitted through a material.
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Processing & Physical Properties

	Viscosity		Viscosity is a measurement of a fluid's resistance to flow. Water is lower in viscosity than motor oil or honey. Oil is lower in viscosity than tar or molasses. Depending on the application method, viscosity determines how well a resin fills the cavities or voids in a mold.
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	Water Absorption		The amount of water absorbed by the material.
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