Reactive / Moisture Cured Electrical and Electronic Resins
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Impregnating Resin (optional feature)
- Chemical System: Alkyd
from MacDermid Alpha Electronics Solutions
A low-viscosity, single-part conformal coating that cures within seconds of exposure to the correct dose of UV light. Product Overview. UVCL UV cure conformal coating is a single-part solution that cures in seconds when exposed to the correct dose of UV light. It is specifically designed to provide... [See More]
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
- Industry: Semiconductors, IC's; Electronics
- Use: Encapsulant or Conformal Coating
- Composition: Single Component
from Master Bond, Inc.
EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity of <0.005 ohm-cm. As a silver coated nickel filled system, it is much more cost effective than... [See More]
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Dymax
Conformal Coating with Secondary Moisture Cure. Dual-cure 9481-E-PZ conformal coating is chemically resistant and free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO) and PIP 3:1. It is a UV/Visible light- and moisture-cure material that contains no added solvents. It is formulated to ensure... [See More]
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: Acrylated Urethane
from Master Bond, Inc.
Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220 °F. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates. It is... [See More]
- Cure / Technology: Reactive or Moisture Cured; Thermoset
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Dymax
High-Performance Conformal Coating with Secondary Moisture Cure. Dual-cure 9483-Z conformal coating is free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO). It cures tack-free upon exposure to UV/Visible light and then with ambient moisture over time, on PCBs where shadow areas are present. The... [See More]
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: Acrylated Urethane
from Master Bond, Inc.
Master Bond MB297 is a high strength, rapid curing, ethyl cyanoacrylate adhesive with a viscosity of 2,200-2,400 cps at room temperature. It offers reliable, cost effective bonding at room temperature with no mixing. Only contact pressure is required after application of the adhesive. Depending upon... [See More]
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
- Chemical System: Cyanoacrylate
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Master Bond, Inc.
Low viscosity MB250NT is a single component ethyl cyanoacrylate that cures exceptionally fast at room temperature. This high strength, non-toxic system meets ISO 10993-5 standard for cytotoxicity. It is often used in high speed production of disposable medical devices and also has first rate... [See More]
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Impregnating Resin
- Chemical System: Cyanoacrylate
from Master Bond, Inc.
Master Bond MB297Med cyanoacrylate adhesive is a high strength, rapid curing, one component system which offers ultra-fast bonding at room temperature with no mixing or heating required. Only contact pressure is needed after application of the adhesive. MB297Med generally bonds from within a few... [See More]
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
- Chemical System: Cyanoacrylate
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Master Bond, Inc.
Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch... [See More]
- Cure / Technology: Reactive or Moisture Cured; Thermoset
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Chemence Inc.
Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]
- Cure / Technology: Anaerobic; Reactive or Moisture Cured; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound
- Chemical System: Cyanoacrylate
from Novagard Solutions
Non-corrosive, single component silicone sealant, self-leveling liquid [See More]
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Henkel Corporation - Electronics
LOCTITE 3874 is a fast-curing, high-conductivity for bonding heat-generated devices to thermal spreader without glass beads. [See More]
- Cure / Technology: Reactive or Moisture Cured
- Features: Thermally Conductive
- Industry: Electronics
- Thermal Conductivity: 1.25
from Bluestar Silicones USA Corp.
Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]
- Cure / Technology: Reactive or Moisture Cured; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Silicone
from Wacker Chemical Corp.
ELASTOSIL ® N199 is a non-slump RTV-1 silicone sealant that cures at room temperature on contact with moisture in the air. Special features. ready-to-use, one-part system. non-slump. translucent. medium hardness. high flexibility. Excellent adhesion. Application. general-purpose adhesive for the... [See More]
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Industry: Electronics
from Shenzhen DeepMaterial Technologies Co., Ltd
Used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is usually used from -53°C to 204°C. [See More]
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
- Use Temperature: -63 to 399
- Industry: Electronics
- Elongation: 15.0
from Shenzhen DeepMaterial Technologies Co., Ltd
Easy to repair, fast curing, high elongation, low hardness. [See More]
- Cure / Technology: Reactive or Moisture Cured; Thermoplastic / Hot Melt
- Industry: Electronics
- Use: Encapsulant or Conformal Coating
- Use Temperature: -40 to 176
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a conformal coating designed to provide strong protection from moisture and harsh chemicals. Compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
- Chemical System: Acrylic
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Industry: Electronics
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is... [See More]
- Cure / Technology: Reactive or Moisture Cured
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating
- Industry: Electronics