Reactive / Moisture Cured Electrical and Electronic Resins

Light Cure Cyanoacrylate Instant Adhesive -- KU3064
from Chemence Inc.

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

  • Cure / Technology: Anaerobic; Reactive or Moisture Cured; UV or Radiation Cured
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Cyanoacrylate
Flexible, Electrically Conductive Two Component Epoxy -- EP79FL
from Master Bond, Inc.

EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity of <0.005 ohm-cm. As a silver coated nickel filled system, it is much more cost effective than... [See More]

  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
ELAN-Cast® -- P 300 S RTC
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Impregnating Resin (optional feature)
  • Chemical System: Alkyd
High Temperature Resistant, One Component Epoxy Adhesive -- EP17HT-100
from Master Bond, Inc.

Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220 °F. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates. It is... [See More]

  • Cure / Technology: Reactive or Moisture Cured; Thermoset
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
High Viscosity, Rapid Curing Cyanoacrylate Adhesive -- MB297
from Master Bond, Inc.

Master Bond MB297 is a high strength, rapid curing, ethyl cyanoacrylate adhesive with a viscosity of 2,200-2,400 cps at room temperature. It offers reliable, cost effective bonding at room temperature with no mixing. Only contact pressure is required after application of the adhesive. Depending upon... [See More]

  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
  • Chemical System: Cyanoacrylate
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Low Viscosity, One Part Non-Toxic Cyanoacrylate -- MB250NT
from Master Bond, Inc.

Low viscosity MB250NT is a single component ethyl cyanoacrylate that cures exceptionally fast at room temperature. This high strength, non-toxic system meets ISO 10993-5 standard for cytotoxicity. It is often used in high speed production of disposable medical devices and also has first rate... [See More]

  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Impregnating Resin
  • Chemical System: Cyanoacrylate
Medical Grade, Rapid Curing, Ethyl Cyanoacrylate -- MB297Med
from Master Bond, Inc.

Master Bond MB297Med cyanoacrylate adhesive is a high strength, rapid curing, one component system which offers ultra-fast bonding at room temperature with no mixing or heating required. Only contact pressure is needed after application of the adhesive. MB297Med generally bonds from within a few... [See More]

  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
  • Chemical System: Cyanoacrylate
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Electronics; Electric Power
No Mix, Thermally Conductive Epoxy Adhesive -- EP3RR-80
from Master Bond, Inc.

Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch... [See More]

  • Cure / Technology: Reactive or Moisture Cured; Thermoset
  • Chemical System: Epoxy
  • Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Non-Drip, Thermal Conductive One Component Silicone -- MasterSil 705TC
from Master Bond, Inc.

Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature resistance. It cures... [See More]

  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
  • Chemical System: Silicone
  • Use: Die Bonding Adhesives
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Non-Yellowing, Abrasion Resistant UV Curable Adhesive -- UV15X-6NM-2
from Master Bond, Inc.

UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]

  • Cure / Technology: Reactive or Moisture Cured; Thermoset; UV or Radiation Cured
  • Form / Shape: Grease, Paste
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Polyurethane
LOCTITE 3874 -- 8799552241665
from Henkel Corporation - Electronics

LOCTITE 3874 is a fast-curing, high-conductivity for bonding heat-generated devices to thermal spreader without glass beads. [See More]

  • Cure / Technology: Reactive or Moisture Cured
  • Features: Thermally Conductive
  • Industry: Electronics
  • Thermal Conductivity: 1.25
Silicon Rubber -- RTV 100-101
from Novagard Solutions

Single component, moisture cured silicone rubber, strong durable sealant [See More]

  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Industry: Electronics
Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics -- ELASTOSIL® N199
from Wacker Chemical Corp.

ELASTOSIL ® N199 is a non-slump RTV-1 silicone sealant that cures at room temperature on contact with moisture in the air. Special features. ready-to-use, one-part system. non-slump. translucent. medium hardness. high flexibility. Excellent adhesion. Application. general-purpose adhesive for the... [See More]

  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Industry: Electronics
Heat Curing Electronic Coating Silicone Compound -- Bluesil™ V-207
from Bluestar Silicones USA Corp.

Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]

  • Cure / Technology: Reactive or Moisture Cured; Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone