Specialty / Other Electrical and Electronic Resins

Fluon® Perfluoro Adhesive -- EA-2000
from AGC Chemicals Americas, Inc.

Fluon ® PFA EA-2000, is an Perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates... [See More]

  • Chemical System: PFA
  • Industry: Electronics
  • Form / Shape: Pellets
  • Tensile (Break): 5221
Biocompatible, Nanosilica Filled LED Curable Adhesive -- LED405Med
from Master Bond, Inc.

Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets ISO 10993-5 for cytotoxicity and resists sterilization. It can cure up to 1/8 think and has low shrinkage upon cure. It also features... [See More]

  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Cure / Technology: Thermoset; LED Cure
  • Composition: Single Component; Filled
ELAN-Cast® -- Y-363A Resin / Y-363B Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Chemical System: Natural Oil Base
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
4.0 x 5.0 Micron Foil -- NanoFoil®
from Indium Corporation

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

  • Chemical System: Metal
  • Industry: Semiconductors, IC's
  • Form / Shape: Sheet or Film
  • Features: Thermally Conductive
Fluorinated Conformal Coating Agent -- SURECO™ CC Series
from AGC Chemicals Americas, Inc.

SURECO ™ CC series are surface treatment agents containing a fluorinated polymer compound. By forming a thin layer on a variety of surfaces, it provides excellent water & oil repellency, anti-corrosion, moisture protection and waterproofing. It can be used as a conformal coating for PCB... [See More]

  • Chemical System: Fluorinated Polymer
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Cure / Technology: Air Setting / Film Drying
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Chemical System: UV Curing
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Cure / Technology: UV or Radiation Cured; Dual Curing
Bundle Kit 40 Microns x .5 Inch Squares -- NanoFoil®
from Indium Corporation

Thickness of NanoFoil ®: 40 microns. Size of NanoFoil ®: .5 inch squares. Qty Per Bundle: 100 each. NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in... [See More]

  • Chemical System: Metal
  • Industry: Semiconductors, IC's
  • Form / Shape: Sheet or Film
  • Features: Thermally Conductive
One component primer/adhesive for polyolefins, passes ISO 10993-5 test -- X21Med
from Master Bond, Inc.

Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]

  • Chemical System: Polyolefin
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Liquid; Primer
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
Engineered Solder Materials -- Indalloy® Alloys Liquid at Room Temperature
from Indium Corporation

Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]

  • Chemical System: Metal
  • Industry: Semiconductors, IC's
  • Form / Shape: Liquid
  • Features: Thermally Conductive
One Component, Higher Viscosity Uv Curable System For Bonding, Sealing And Coating -- UV10TK40M
from Master Bond, Inc.

Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]

  • Chemical System: UV curable
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset; UV or Radiation Cured; UV curing system
Indium Thermal Interface Materials (TIM)
from Indium Corporation

Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered as a... [See More]

  • Chemical System: Metal
  • Industry: Semiconductors, IC's
  • Form / Shape: Sheet or Film
  • Features: Thermally Conductive
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset; UV or Radiation Cured
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Adjustable Flexibility Epoxy -- 10-3055
from Epoxies Etc...

10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can be adjusted from rigid to flexible. [See More]

  • Chemical System: Epoxy; Adjustable Flexibility Epoxy
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Aremco-Seal™ -- 613
from Aremco Products, Inc.

Glass coating for producing hermetic seals [See More]

  • Chemical System: Glass
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Air Setting / Film Drying
Thermal Compound -- TC70
from Nordson EFD

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

  • Chemical System: Synthetic Based
  • Cure / Technology: Air Setting / Film Drying
  • Form / Shape: Grease, Paste
  • Industry: Semiconductors, IC's; Electronics
Ablestik ABLELUX LA-1UV -- 8799473631233
from Henkel Corporation - Electronics

Single component, photocurable adhesive is designed for bonding camera module assemblies. [See More]

  • Chemical System: Hybrid Chemistry
  • Industry: Electronics
  • Cure / Technology: UV or Radiation Cured
  • Composition: Single Component
Conductive Hybrid Adhesive -- ACH-20120
from Protavic America, Inc.

The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]

  • Chemical System: Hybrid
  • Form / Shape: Gel
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset
Elastomeric potting & encapsulating compound -- 20-2125
from Epoxies Etc...

20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2125 will cushion and protect sensitive electronic... [See More]

  • Chemical System: Polyol, Isocyanate
  • Form / Shape: Grease, Paste
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing
TECHNOMELT AS 8998
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Chemical System: Polyolefin
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoplastic / Hot Melt
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Electronics; Electric Power
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Chemical System: Polyolefin
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoplastic / Hot Melt