Specialty / Other Electrical and Electronic Resins
from RS Components, Ltd.
Protective conformal coating 400ml [See More]
- Chemical System: Acrylic; Acrylic Resin
- Form / Shape: Liquid; Aerosol
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from ELANTAS North America LLC
The smart meter market, encompassing electric, water, and gas sectors, is pivotal in shaping a sustainable and connected future. As these meters become integral to our utilities, they face multifaceted challenges. From fluctuating environmental conditions to potential electronic interference, the... [See More]
- Chemical System: Urethane-Alkyd
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Master Bond, Inc.
Master Bond LED405Med is a one part, nano filled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets ISO 10993-5 for cytotoxicity and resists sterilization. It can cure up to 1/8 think and has low shrinkage upon cure. It also features... [See More]
- Chemical System:
- Cure / Technology: Thermoset; LED Cure
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from AGC Chemicals Americas, Inc.
Fluon ® PFA EA-2000, is an Perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates... [See More]
- Chemical System: PFA
- Industry: Electronics
- Form / Shape: Pellets
- Tensile (Break): 5221
from Dymax
Conformal Coating with Secondary Moisture Cure. Dual-cure 9481-E-PZ conformal coating is chemically resistant and free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO) and PIP 3:1. It is a UV/Visible light- and moisture-cure material that contains no added solvents. It is formulated to ensure... [See More]
- Chemical System: Acrylated Urethane
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
from RS Components, Ltd.
MG Silicone Conformal coating 340g [See More]
- Chemical System: Silicone; Silicone
- Form / Shape: Bottle
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Master Bond, Inc.
Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. It is able to partially cure or fixture up to 6 mm deep or in cross sections under LED light at the right intensity. [See More]
- Chemical System: LED curing
- Industry: Semiconductors, IC's; Photonics; Electronics
- Cure / Technology: Thermoset; LED cures with LED light source
- Composition: Single Component; Unfilled
from Dymax
High-Performance Conformal Coating with Secondary Moisture Cure. Dual-cure 9483-Z conformal coating is free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO). It cures tack-free upon exposure to UV/Visible light and then with ambient moisture over time, on PCBs where shadow areas are present. The... [See More]
- Chemical System: Acrylated Urethane
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
from RS Components, Ltd.
ESD Safe Coating Paint for Plastics [See More]
- Chemical System: Acrylic; Acrylic
- Form / Shape: Can
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Chemical System: UV Curing
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Cure / Technology: UV or Radiation Cured; Dual Curing
from RS Components, Ltd.
Ambersil Acrylic Conformal Coating 400ml [See More]
- Chemical System: Acrylic; Acrylic Resin
- Form / Shape: Liquid; Aerosol
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Master Bond, Inc.
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling. [See More]
- Chemical System: Epoxy; UV curing
- Cure / Technology: Thermoset; UV or Radiation Cured
- Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics
from RS Components, Ltd.
MG prem acrylic conformal coating 419D [See More]
- Chemical System: Acrylic; Acrylic
- Form / Shape: Tin
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Chemical System: Polyolefin
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid; Primer
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from RS Components, Ltd.
MG Chemicals thinner 2 4352 - 1L [See More]
- Chemical System: Acrylic; Epoxy; Thermoplastic Polyester (PET, PBT, etc.); Acrylic, Alkyd, Cellulose Acetate Butyrate, Epoxy, Nitrocellulose, Polyester Resin
- Form / Shape: Tin
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Chemical System: UV curable
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Cure / Technology: Thermoset; UV or Radiation Cured; UV curing system
from Shiu Li Technology Co., Ltd
LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]
- Chemical System: Graphite
- Industry: Electronics
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Features: Thermally Conductive
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Chemical System:
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset; UV or Radiation Cured
from Aremco Products, Inc.
Glass coating for producing hermetic seals [See More]
- Chemical System: Glass
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Air Setting / Film Drying
from Epoxies Etc...
10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can be adjusted from rigid to flexible. [See More]
- Chemical System: Epoxy; Adjustable Flexibility Epoxy
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Indium Corporation
NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]
- Chemical System: Metal
- Industry: Semiconductors, IC's
- Form / Shape: Sheet or Film
- Features: Thermally Conductive
from Henkel Corporation - Electronics
Single component, photocurable adhesive is designed for bonding camera module assemblies. [See More]
- Chemical System: Hybrid Chemistry
- Industry: Electronics
- Cure / Technology: UV or Radiation Cured
- Composition: Single Component
from Nordson EFD
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]
- Chemical System: Synthetic Based
- Cure / Technology: Air Setting / Film Drying
- Form / Shape: Grease, Paste
- Industry: Semiconductors, IC's; Electronics
from Ohmite Manufacturing Co.
Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]
- Chemical System: Flexible Graphite Material
- Industry: Electronics; Electric Power
- Form / Shape: Sheet or Film
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]
- Chemical System: Graphite, Copper, Acrylic
- Industry: Electronics
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Features: Thermally Conductive
from Protavic America, Inc.
The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]
- Chemical System: Hybrid
- Form / Shape: Gel
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
from Epoxies Etc...
20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2125 will cushion and protect sensitive electronic... [See More]
- Chemical System: Polyol, Isocyanate
- Form / Shape: Grease, Paste
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Indium Corporation
Thickness of NanoFoil ®: 40 microns. Size of NanoFoil ®: .5 inch squares. Qty Per Bundle: 100 each. NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in... [See More]
- Chemical System: Metal
- Industry: Semiconductors, IC's
- Form / Shape: Sheet or Film
- Features: Thermally Conductive
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Chemical System: Polyolefin
- Form / Shape: Pellets
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoplastic / Hot Melt
from Shiu Li Technology Co., Ltd
LiPOLY Non-Silicone Thermal Compound N700A/B is made of non-silicon resin material and none low-molecular-weight siloxane. N700A/B helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]
- Chemical System: Non-Silicone
- Industry: Electronics
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Chemical System:
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Indium Corporation
Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]
- Chemical System: Metal
- Industry: Semiconductors, IC's
- Form / Shape: Liquid
- Features: Thermally Conductive
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Chemical System: Polyolefin
- Form / Shape: Pellets
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoplastic / Hot Melt
from Shiu Li Technology Co., Ltd
Non-Silicone Thermal Compound N700C is made of non-silicon resin material and none low-molecular-weight siloxane. N700C helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is 5.0W/m*K. [See More]
- Chemical System: Non-Silicone
- Industry: Electronics
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: Thermally Conductive
from Indium Corporation
Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered as a... [See More]
- Chemical System: Metal
- Industry: Semiconductors, IC's
- Form / Shape: Sheet or Film
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]
- Chemical System: Non-Silicone
- Industry: Electronics
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: Thermally Conductive
from Indium Corporation
Several very low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are finding increased use in various applications as a replacement for toxic mercury, which has a high vapor pressure at room temperature. These alloys have reduced toxicity and lower... [See More]
- Chemical System: Metal
- Industry: Semiconductors, IC's
- Form / Shape: Liquid
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
Non-Silicone Thermal Compound N800C-s is made of non-silicon resin material. No low molecular siloxane volatilization and low total volatile gas, no electrical contact & pollution problems. N800C-s can have low thermal resistance and high thermal conductivity. [See More]
- Chemical System: Non-Silicone
- Industry: Electronics; Electric Power
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: Thermally Conductive
from Indium Corporation
Indium Corporation ’s Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in electronic devices. Thermal conductance for high power devices – with densities in excess of 1000 watts. End-of-life performance at the thermal interface – to avoid failures... [See More]
- Chemical System: Metal
- Industry: Semiconductors, IC's
- Form / Shape: Sheet or Film
- Features: Thermally Conductive