EMI / RFI Shielding Material Electrical and Electronic Resins

Graphite-Filled, High Temperature Epoxy -- EPO-TEK® 377H
from Epoxy Technology

EPO-TEK ® 377H is a high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical / OEM / fiber optics. It is an electrically conductive version of EPO-TEK ® 377. [See More]

  • Features: Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Fast Curing High Glass Transition Temperature Epoxy -- EP65HT-1
from Master Bond, Inc.

Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT-1 has... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Fast Curing, High Temperature Resistant Epoxy -- EP65HT
from Master Bond, Inc.

Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT has an... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Fast Curing, Thermal Cycling Resistant Epoxy Adhesive -- EP51M
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Flexibilized Epoxy System -- Supreme 10HTFL
from Master Bond, Inc.

Master Bond Polymer System Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to +350 °F making it suitable for cryogenic applications. Supreme 10HTFL features highly desirable... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Flexible, Electrically Conductive Two Component Epoxy -- EP79FL
from Master Bond, Inc.

EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity of <0.005 ohm-cm. As a silver coated nickel filled system, it is much more cost effective than... [See More]

  • Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy; Polyurethane
Graphite Filled, Electrically Conductive Epoxy -- EP75-1
from Master Bond, Inc.

Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by weight. It... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Heat Curing. Snap Cure Epoxy Supreme -- Supreme 10HTF-1
from Master Bond, Inc.

Master Bond Polymer System Supreme 10HTF-1 is a one-part/no-mix system featuring a unique combination of properties including high shear and peel strength, exceptionally wide service temperature range and very rapid "snap cures". The recommended cure for optimum bond strength is 2 minutes at 375-400... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Highly Flexible Two Part Epoxy -- EP21TDC-7
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Liquid; Optional Premixed and Frozen
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy; Polyurethane
Low Exotherm, Two Component Epoxy -- EP29LP
from Master Bond, Inc.

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Low Viscosity Heat Resistant Epoxy System -- EP34CA
from Master Bond, Inc.

Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various hardeners, EP34CA produces a low viscosity 100% reactive system which is particularly... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Epoxy
Medical Grade, Silver Conductive Epoxy Compound -- EP21TDCSMed
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy; Polyurethane
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Room Temperature Curing, Two Component Epoxy System -- EP34
from Master Bond, Inc.

Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio (part A/part B: 100/70). [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Two Component, Fast Curing Epoxy Adhesive -- EP65
from Master Bond, Inc.

Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes, shorter lives at higher... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Two Component, Silver Coated, Nickel Filled Epoxy -- EP79
from Master Bond, Inc.

Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]

  • Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications -- EP21TDCN-LO
from Master Bond, Inc.

Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]

  • Features: Electrically Conductive; EMI/RFI Shielding; Thermally Conductive; NASA Low Outgassing
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8660S
from Henkel Corporation - Electronics

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]

  • Features: Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Industry: Electronics