Silicone Electrical and Electronic Resins
from RS Components, Ltd.
MG Silicone Conformal coating 340g [See More]
- Chemical System: Silicone; Silicone
- Form / Shape: Bottle
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Dongguan Sheen Electronic Technology Co., Ltd.
Designed as battery pack thermal runaway protection(thermal propagation) material, SF-C is a fiberglass or PET carrier ceramifiable (ceramifying) silicone rubber composite sheet. Like ordinary rubber, silicone rubber and thermoplastic elastomer, it has not only good insulation and elasticity, but... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Sheet or Film
from CHT USA Inc.
CHT's AS1821 is is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is one in a range of Acetone cure products which are solvent free. It exhibits excellent primerless adhesion to many substrates and cures rapidly at room temperature when in... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Cure / Technology: Acetone
- Composition: Single Component
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Chemical System: Silicone
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Addition Cure
from MacDermid Alpha Electronics Solutions
Heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components. Product Overview. HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and reliable thermal coupling of electrical and electronic components, or... [See More]
- Chemical System: Silicone
- Industry: Semiconductors, IC's; Electronics
- Form / Shape: Grease, Paste
- Features: Thermally Conductive
from Hernon Manufacturing, Inc.
Silastomer ® 333 is a high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 333 can be... [See More]
- Chemical System: Silicone
- Industry: Electronics; Electric Power
- Form / Shape: SILASTOMER 333, CLEAR, 300 ML CARTRIDGE
- Composition: Single Component
from RS Components, Ltd.
ELECTROFUGE VARNISH 200-ND 5 L [See More]
- Chemical System: Silicone; Silicone
- Industry: Electronics
- Form / Shape: Can
- Dielectric Strength: 2032
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m ·K. ◆ Soft and elastic after curing, maintaining the required thickness and providing... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Gel
- Features: Thermally Conductive
from CHT USA Inc.
AS5702 is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is one in a range of Alkoxy cure products which are solvent free. It exhibits excellent primerless adhesion to many substrates and cures at room temperature when in contact with... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Cure / Technology: Alkoxy
- Composition: Single Component
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset; Addition Cure
from Hernon Manufacturing, Inc.
Silastomer ® 334 is a high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 334 can be... [See More]
- Chemical System: Silicone
- Industry: Electronics; Electric Power
- Form / Shape: 300 ml cartridge (10:2 ratio)
- Composition: Single Component
from RS Components, Ltd.
ELECTROFUGE VARNISH 200-ND 650 ML [See More]
- Chemical System: Silicone; Silicone
- Industry: Electronics
- Form / Shape: Liquid; Aerosol
- Dielectric Strength: 2032
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m ·K. ◆ High bonding performance. ◆ Good stability, long-term high... [See More]
- Chemical System: Silicone
- Features: Thermally Conductive
- Industry: Electronics
- Use Temperature: -58 to 392
from CHT USA Inc.
CHT ’s AS1803 is a white, non-corrosive, neutral cure 1-part RTV silicone adhesive sealant. This product will not corrode copper or its alloys and is designed for use with electronic components. It is part of CHT's range of Acetone cure products which are all solvent free. It features a fast... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Cure / Technology: Acetone
- Composition: Single Component
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Chemical System: Silicone
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Hernon Manufacturing, Inc.
Silastomer ® 336 is a high performance, single component, acetoxy, ready to use silicone. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 336 can be... [See More]
- Chemical System: Silicone
- Industry: Electronics; Electric Power
- Form / Shape: 40 lbs
- Composition: Single Component
from RS Components, Ltd.
Non-corrosive silicone sealant,Wht 310ml [See More]
- Chemical System: Silicone
- Industry: Semiconductors, IC's
- Form / Shape: Cartridge
- Use Temperature: -40 to 302
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Chemical System: Silicone
- Features: Thermally Conductive
- Industry: Electronics
- Use Temperature: -58 to 392
from CHT USA Inc.
CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Cure / Technology: Alkoxy
- Composition: Single Component
from Master Bond, Inc.
Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Hernon Manufacturing, Inc.
Silastomer ® 343 is a black, high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Designed to provide excellent oil resistance and can be used as a... [See More]
- Chemical System: Silicone
- Industry: Electronics; Electric Power
- Form / Shape: 12 ml
- Composition: Single Component
from RS Components, Ltd.
Non-corrosive silicone sealant,Wht 100gm [See More]
- Chemical System: Silicone
- Industry: Semiconductors, IC's
- Form / Shape: Tube
- Use Temperature: -40 to 302
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Chemical System: Silicone
- Features: Thermally Conductive
- Industry: Electronics
- Use Temperature: -58 to 392
from CHT USA Inc.
CHT ’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also flame... [See More]
- Chemical System: Silicone
- Cure / Technology: Addition
- Form / Shape: Gel
- Industry: Electronics
from Master Bond, Inc.
Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. [See More]
- Chemical System: Silicone
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Use: Encapsulant, Potting Compound
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Hernon Manufacturing, Inc.
Supertacker ® 351 is a single component, high performance elastomeric adhesive that exhibits exceptional bonding characteristics to a broad range of materials including metals, glass, plastic composites, rubber, leather, wood and vinyl. Supertacker ® 351 provides a tough, waterproof bond... [See More]
- Chemical System: Acrylic; Silicone; Vinyl
- Composition: Single Component
- Industry: Electronics; Electric Power
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Pad
- Features: Thermally Conductive
from Master Bond, Inc.
MasterSil 930 is an acetoxy type fluorosilicone for bonding, sealing and coating. Its most prominent feature is excellent chemical resistance, particularly to fuels, oils and solvents when compared to more standard silicones. Some of the chemicals that this product can withstand better than... [See More]
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
from Hernon Manufacturing, Inc.
Supertacker ® 353 is a single component, high performance elastomeric adhesive that exhibits exceptional bonding characteristics to a broad range of materials including metals, glass, plastic composites, rubber, leather, wood and vinyl. Supertacker ® 353 provides a tough, waterproof bond... [See More]
- Chemical System: Acrylic; Silicone; Vinyl
- Industry: Electronics; Electric Power
- Form / Shape: 20 gm
- Composition: Single Component
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m ·K. ◆ High softness and compressibility, providing low assembly stress, ideal for... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Gel
- Features: Thermally Conductive
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Chemical System: Silicone
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Hernon Manufacturing, Inc.
Supertacker ® 357 is a single component, high performance elastomeric adhesive that exhibits exceptional bonding characteristics to a broad range of materials including metals, glass, plastic composites, rubber, leather, wood and vinyl. Supertacker ® 357 provides a tough, waterproof bond... [See More]
- Chemical System: Acrylic; Silicone; Vinyl
- Industry: Electronics; Electric Power
- Form / Shape: 300 ml cartridge (10:2 ratio)
- Composition: Single Component
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m ·K. ◆ High softness and compressibility, providing low assembly stress, ideal for... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Gel
- Features: Thermally Conductive
from Master Bond, Inc.
MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which enhance... [See More]
- Chemical System: Silicone
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Hernon Manufacturing, Inc.
Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide... [See More]
- Chemical System: Silicone
- Industry: Electronics; Electric Power
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Features: Thermally Conductive
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Pad
- Features: Thermally Conductive
from Master Bond, Inc.
MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU •in/ft ² •hr • °F [1.01-1.30 W/(m •K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics... [See More]
- Chemical System: Silicone
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Pad
- Features: Thermally Conductive
from Master Bond, Inc.
Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature resistance. It cures... [See More]
- Chemical System: Silicone
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
- Use: Die Bonding Adhesives
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Chemical System: Silicone
- Features: Thermally Conductive
- Industry: Electronics
from Master Bond, Inc.
MasterSil 912Med is a single component silicone with a paste viscosity for bonding, sealing and coating medical devices. This non-corrosive, neutral cure compound complies with USP Class VI and ISO 10993-5 specifications. It resists many kinds of sterilization including gamma and other types of... [See More]
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AE Series one-component Silicone-free Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Free from siloxane and the risk of silicone oil bleed. ◆ Good thermal conductivity, available in options ranging from 1.0 to 3.0 W/m ·K. ◆... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Gel
- Features: Thermally Conductive
from Master Bond, Inc.
Low viscosity MasterSil 152 is a two component, optically clear silicone system that cures when exposed to air at room temperature. It has outstanding electrical insulation properties, making it ideal for potting and encapsulation applications. Additionally it features a long working life and has a... [See More]
- Chemical System: Silicone
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Pad
- Features: Thermally Conductive
from Master Bond, Inc.
Master Bond MasterSil 153AO is an addition cured two part silicone with a high tensile lap shear strength, thermal conductivity and electrical insulation. [See More]
- Chemical System: Silicone
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Pad
- Features: Thermally Conductive
from Master Bond, Inc.
Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]
- Chemical System: Silicone
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Pad
- Features: Thermally Conductive
from Master Bond, Inc.
MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace, electronic,... [See More]
- Chemical System: Silicone
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Use: Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Shenzhen DeepMaterial Technologies Co., Ltd
Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a... [See More]
- Chemical System: Epoxy; Silicone
- Industry: Semiconductors, IC's
- Cure / Technology: Heat curing
- Features: Electrically Conductive
from Techsil Limited
MG Chemicals 422B is a silicone modified conformal coating which is a clear and flexible coating, ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Use: Encapsulant or Conformal Coating
from Henkel Corporation - Electronics
Loctite ® Liquid Optically Clear Adhesives (LOCAs) for cover lens bonding, touch panel sensor assembly and direct bonding applications in touch panel and display devices including mobile phones, tablets, monitors, televisions and outdoor signage. [See More]
- Chemical System: Silicone
- Industry: Electronics
- Cure / Technology: UV or Radiation Cured
- Elongation: 100.0
from Bluestar Silicones USA Corp.
One-Component , Black, Light Opaque, Addition Cure, Electronic Protective coating Silicone Compound. Properties. Viscosity 35000. Hardness Sha 45. Description. Bluesil V-205 is a one component, black, addition cure silicone rubber compound. It is designed as a protective coating for electronic... [See More]
- Chemical System: Silicone
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Chemence Inc.
KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure at room... [See More]
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Industry: Electronics
from Epoxies Etc...
50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. [See More]
- Chemical System: Silicone
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Chemical System: Silicone
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Use: Encapsulant, Potting Compound
- Features: Thermally Conductive
from Aremco Products, Inc.
Hi-temp, prevents dusting of fibrous insulation materials [See More]
- Chemical System: Silicone
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from ThreeBond International, Inc.
Electrically Conductive Resins. These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are electro-conductive resins made up of synthetic resin and a conductive... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Cure / Technology: Anaerobic
- Composition: Filled
from Phelps Industrial Products
Phelps Style 9815 is 100% RTV (room temperature vulcanizing) silicone that can be used anywhere a high temperature sealant/adhesive is required. This high temp silicone sealant builds a formed-in-place gasket at operating temperatures up to 310 °C. Phelps Style 9815 high temperature silicone... [See More]
- Chemical System: Silicone
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: Gel
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Shenzhen DeepMaterial Technologies Co., Ltd
Used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is usually used from -53°C to 204°C. [See More]
- Chemical System: Silicone
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Techsil Limited
MG Chemicals 422B Silicone Conformal Coating is a clear and flexible aerosol coating that is ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Use: Encapsulant or Conformal Coating
from Epoxies Etc...
20-1615 is a two component, room temperature curing silicone rubber compound. This silicone system is clear, odorless, and low in viscosity. 20-1615 is an excellent choice for potting electronic assemblies that require shock and vibration resistance. It also protects assemblies from moisture, ozone,... [See More]
- Chemical System: Silicone
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Chemical System: Silicone
- Form / Shape: Gel
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Chemical System: Silicone
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Techsil Limited
MG Chemicals 422B is a silicone modified conformal coating which is a clear and flexible coating, ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Use: Encapsulant or Conformal Coating
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Techsil Limited
Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primerless adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for electronics that need EMI... [See More]
- Chemical System: Silicone
- Features: Electrically Conductive
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Techsil Limited
RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep section without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Use: Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Techsil Limited
RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Use: Encapsulant, Potting Compound
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Use: Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Techsil Limited
RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep section without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Use: Encapsulant, Potting Compound
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Use: Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Techsil Limited
Momentive RTV160 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Chemical System: Silicone
- Use Temperature: -60 to 204
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Techsil Limited
Momentive RTV162 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Chemical System: Silicone
- Use Temperature: -60 to 204
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Techsil Limited
Momentive RTV162 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Chemical System: Silicone
- Use Temperature: -60 to 204
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Techsil Limited
Momentive RTV162 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Chemical System: Silicone
- Use Temperature: -60 to 204
- Industry: Electronics
from Shiu Li Technology Co., Ltd
Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Techsil Limited
Momentive RTV167 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Chemical System: Silicone
- Use Temperature: -60 to 204
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY T-work 8000 is a high performance thermally conductive interface pad. T-work 8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work 8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Techsil Limited
Momentive RTV167 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Chemical System: Silicone
- Use Temperature: -60 to 204
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY T-work 9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work 9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Techsil Limited
Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Use: Encapsulant, Potting Compound
- Use Temperature: -54 to 260
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Use: Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Techsil Limited
Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Use: Encapsulant, Potting Compound
- Use Temperature: -54 to 260