Electronics Electrical and Electronic Resins
from AGC Chemicals Americas, Inc.
Fluon ® PFA EA-2000, is an Perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates... [See More]
- Industry: Electronics
- Chemical System: PFA
- Form / Shape: Pellets
- Tensile (Break): 5221
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Ohmite Manufacturing Co.
Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]
- Industry: Electronics; Electric Power
- Chemical System: Flexible Graphite Material
- Form / Shape: Sheet or Film
- Features: Thermally Conductive
from Cri-Tech, Inc.
Cri-plastMP ™ PFA Electrically Conductive Compounds are formulated to meet your static dissipative/conductive, ATEX requirements in multiple applications. Specific grades can be processed by injection, extrusion, transfer molding, and compression molding. Superior static dissipative compounds... [See More]
- Industry: Electronics; Electric Power
- Tensile (Break): 493125
- Features: Anti-static, ESD; Electrically Conductive
- Elongation: 280.0
from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Industry: Electronics; Electric Power
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Impregnating Resin (optional feature)
- Chemical System: Alkyd
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from ThreeBond International, Inc.
Electrically Conductive Resins. These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are electro-conductive resins made up of synthetic resin and a conductive... [See More]
- Industry: Electronics
- Cure / Technology: Anaerobic
- Chemical System: Silicone
- Composition: Filled
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a fast curing, fast flowing liquid epoxy resin designed for capillary flow filling chip size packages, is to improve the process speed in production and design its rheological design, let it penetrate 25µm clearance, minimize induced stress, improve temperature cycling performance, with... [See More]
- Industry: Electronics
- Cure / Technology: Heat Curing
- Chemical System: Epoxy
- Viscosity: 3500 to 7000
from CHT USA Inc.
CHT's AS1821 is is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is one in a range of Acetone cure products which are solvent free. It exhibits excellent primerless adhesion to many substrates and cures rapidly at room temperature when in... [See More]
- Industry: Electronics
- Cure / Technology: Acetone
- Chemical System: Silicone
- Composition: Single Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Industry: Electronics; Electric Power
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Shenzhen DeepMaterial Technologies Co., Ltd
Used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is usually used from -53°C to 204°C. [See More]
- Industry: Electronics
- Use Temperature: -63 to 399
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
- Elongation: 15.0
from CHT USA Inc.
AS5702 is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is one in a range of Alkoxy cure products which are solvent free. It exhibits excellent primerless adhesion to many substrates and cures at room temperature when in contact with... [See More]
- Industry: Electronics
- Cure / Technology: Alkoxy
- Chemical System: Silicone
- Composition: Single Component
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Industry: Electronics; Electric Power
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]
- Industry: Electronics
- Chemical System: Graphite
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Features: Thermally Conductive
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is... [See More]
- Industry: Electronics
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Composition: Two Component
from CHT USA Inc.
CHT ’s AS1802 is a 1-part, gray, non-corrosive, neutral cure, thermally conductive, RTV silicone adhesive sealant. It is one in a range of CHT ’s acetone cure products which are all solvent-free. It features a fast skin over time at 4 minutes. AS1802 is designed with excellent primerless... [See More]
- Industry: Electronics
- Cure / Technology: Acetone
- Chemical System: Silicone
- Composition: Single Component
from Graphene Laboratories, Inc.
G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]
- Industry: Electronics; Electric Power
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]
- Industry: Electronics
- Chemical System: Graphite, Copper, Acrylic
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Features: Thermally Conductive
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shenzhen DeepMaterial Technologies Co., Ltd
Easy to repair, fast curing, high elongation, low hardness. [See More]
- Industry: Electronics
- Cure / Technology: Reactive or Moisture Cured; Thermoplastic / Hot Melt
- Use: Encapsulant or Conformal Coating
- Use Temperature: -40 to 176
from CHT USA Inc.
CHT ’s AS1803 is a white, non-corrosive, neutral cure 1-part RTV silicone adhesive sealant. This product will not corrode copper or its alloys and is designed for use with electronic components. It is part of CHT's range of Acetone cure products which are all solvent free. It features a fast... [See More]
- Industry: Electronics
- Cure / Technology: Acetone
- Chemical System: Silicone
- Composition: Single Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Industry: Electronics; Electric Power
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Industry: Electronics
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Master Bond, Inc.
Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Chemical System: Epoxy
- Form / Shape: Liquid; Powder
- Cure / Technology: Thermoset
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a conformal coating designed to provide strong protection from moisture and harsh chemicals. Compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]
- Industry: Electronics
- Chemical System: Acrylic
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
from CHT USA Inc.
CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]
- Industry: Electronics
- Cure / Technology: Alkoxy
- Chemical System: Silicone
- Composition: Single Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Industry: Electronics; Electric Power
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Master Bond, Inc.
One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Chemical System: UV Curing
from CHT USA Inc.
CHT's QSil 12 is a 2-part, condensation cure, transparent, low viscosity, liquid silicone elastomer which cures at room temperature. QSil 12 is primarily intended for electronic and lighting potting applications. This material is typically mixed at a ratio of 100:5. Once mixed, the material is... [See More]
- Industry: Electronics
- Cure / Technology: Condensation
- Use: Encapsulant, Potting Compound
- Composition: Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Industry: Electronics; Electric Power
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Industry: Electronics
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Master Bond, Inc.
Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Composition: Single Component; Unfilled
from CHT USA Inc.
CHT ’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also flame... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Form / Shape: Gel
- Cure / Technology: Addition
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Industry: Electronics; Electric Power
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Form / Shape: Grease, Paste
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from CHT USA Inc.
CHT's TufGel 330 is a 2-part, clear, tough, moderately cross-linked silicone gel. It has good room temperature cure adhesion to many substrates. TufGel 330 is used to provide protection from vibration and thermal or mechanical shock and will also provide excellent moisture protection. [See More]
- Industry: Electronics
- Cure / Technology: Addition
- Form / Shape: Gel
- Composition: Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Industry: Electronics; Electric Power
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from CHT USA Inc.
CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The chemical composition... [See More]
- Industry: Electronics
- Cure / Technology: Addition
- Use: Encapsulant, Potting Compound
- Composition: Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Industry: Electronics; Electric Power
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Features: Thermally Conductive; UL Rating
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy; Polyphenylene Sulfide
from CHT USA Inc.
CHT's QGEl 311UV is a 2-part, platinum cure, special purpose silicone gel. It is designed with convenient 1:1 mix ratio, and low viscosity for easy dispensing. QGel 311UV is soft, but resilient and is amoderately cross-linked silicone polymer. QGel 311UV is clear but contains a UV tracer for easy QC... [See More]
- Industry: Electronics
- Cure / Technology: Addition
- Form / Shape: Gel
- Composition: Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Industry: Electronics; Electric Power
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]
- Industry: Electronics
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating
- Cure / Technology: Thermoset
from CHT USA Inc.
CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]
- Industry: Electronics
- Cure / Technology: Addition
- Use: Encapsulant, Potting Compound
- Composition: Two Component
from Graphene Laboratories, Inc.
Our G6E-TSHV ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Industry: Electronics; Electric Power
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Bluestar Silicones USA Corp.
One-Component , Black, Light Opaque, Addition Cure, Electronic Protective coating Silicone Compound. Properties. Viscosity 35000. Hardness Sha 45. Description. Bluesil V-205 is a one component, black, addition cure silicone rubber compound. It is designed as a protective coating for electronic... [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: Silicone
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Use: Encapsulant, Potting Compound
- Features: Thermally Conductive
from Materion Corporation
Thermotech TE ™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant,... [See More]
- Industry: Electronics
- Features: Electrically Conductive
- Composition: Two Component
from Monocrystal, Inc.
AGH – series. Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition variations: AGH-A-60 – 60%... [See More]
- Industry: Electronics
- Features: Electrically Conductive
- Form / Shape: Grease, Paste
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Industry: Electronics; Electric Power
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Nordson EFD
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]
- Industry: Semiconductors, IC's; Electronics
- Chemical System: Synthetic Based
- Form / Shape: Grease, Paste
- Cure / Technology: Air Setting / Film Drying
from Sanchem, Inc.
is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]
- Industry: Electronics; Electric Power
- Form / Shape: Gel
- Use: Impregnating Resin
- Cure / Technology: Non-Drying
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Features: Thermally Conductive
from Electro-Lite Corporation
ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Epoxy
from Hapco, Inc.
Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Techsil Limited
Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Features: Electrically Conductive; Thermally Conductive
from Sherwin-Williams Protective & Marine Coatings
General Polymers TRAFFICOTE #105 SD provides a high build (minimum 1/16 ”) protective surfacing. By utilizing a high solids, low viscosity binder resin this TRAFFICOTE #105 SD system provides a fluid, self-leveling mixture that is easily spread with a v-notched trowel or v-notched squeegee... [See More]
- Industry: Electronics
- Use Temperature: 50 to 90
- Cure / Technology: Air Setting / Film Drying
- Tensile (Break): 2500
from Acoustical Solutions, Inc.
FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]
- Industry: Electronics
- Form / Shape: Grease, Paste
- Use: Gap Filler, Foam in Place Gasket
- Composition: Single Component
from Henkel Corporation - Electronics
ABLEBOND 8008NC is a non-conductive snap cure adhesive utilizing wafer backside coating technology. [See More]
- Industry: Electronics
- Thermal Conductivity: 0.5000
from Metalor Technologies USA Corporation
Electrically and thermally conductive adhesives for microelectronic applications. Working in partnership with valued customers, we have carried out extensive development programmes to customize silver flakes and powders to suit many electronic applications. We are acknowledged as a leading supplier... [See More]
- Industry: Electronics
- Features: Electrically Conductive
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Industry: Photonics; Electronics
- Form / Shape: Grease, Paste
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Silicone
from ND Industries, Inc.
Cyanoacrylates (also known as superglues) are single-part clear instant adhesives that rapidly polymerize at room temperature and develop strength extremely fast (fixture 0 to 60 seconds). They are initiated by moisture on the parts surface or by accelerators. Uses: Circuit board wires. Ceramic,... [See More]
- Industry: Electronics
- Chemical System: Acrylic
- Form / Shape: Liquid
- Cure / Technology: Air Setting / Film Drying
from Sheldahl Flexible Technologies - a Flex company
We have core strength in vacuum deposition via sputtering ad thermal evaporation. Our materials are used for numerous applications, including passive thermal control for satellites and launch vehicles, thermal insulation for F1 racing cars and fire suits, and robust materials for audio and medical... [See More]
- Industry: Electronics
- Features: Flame Retardant; Thermal Insulation
from Phelps Industrial Products
Phelps Style 9815 is 100% RTV (room temperature vulcanizing) silicone that can be used anywhere a high temperature sealant/adhesive is required. This high temp silicone sealant builds a formed-in-place gasket at operating temperatures up to 310 °C. Phelps Style 9815 high temperature silicone... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Form / Shape: Gel
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Chemence Inc.
Krylex KB014 is a low viscosity, surface insensitive cyanoacrylate instant adhesive. It provides excellent adhesion to plastics, metals and elastomers as well as acidic surfaces such as wood, leather and paper. Krylex KB014 provides high strength bonds within seconds and achieves full cure within 24... [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Chemical System: Cyanoacrylate
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. Electrically conductive. Long work life. Bonds difficult to wet surfaces [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Industry: Electronics; Electric Power
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Silicone
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Industry: Electronics
- Form / Shape: Gel
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Hapco, Inc.
Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Techsil Limited
MG Chemicals 419c Acrylic Conformal Coating is an IPC-CC-830B and UL 94-VO certified, fast drying, one part coating product which provides an excellent finish. It is easy to use and does not require any special or costly equipment's to apply. Ideal for high moisture environments and protects... [See More]
- Industry: Electronics
- Use: Encapsulant or Conformal Coating
from Acoustical Solutions, Inc.
SSP Firestop Putty is perfect for metallic conduits, telephone, data or electrical power cable penetrations. A variety of sleeved and non-sleeved applications have been tested and proven providing the ultimate in installation versatility. Non-hardening and reusable, SSP Firestop Putty addresses the... [See More]
- Industry: Electronics
- Form / Shape: Grease, Paste
- Use: Gap Filler, Foam in Place Gasket
- Composition: Single Component
from Henkel Corporation - Electronics
Your benefits. Thermal impedance 0.52 °C-in ²/W (@50 psi). High bond strength to a variety of surfaces. Double-sided, pressure sensitive adhesive tape. High performance, thermally conductive acrylic adhesive. Can be used instead of heat-cure adhesive, screw mounting or clip mounting. [See More]
- Industry: Electronics
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Polyurethane
from ND Industries, Inc.
Vibra-Tite light cure adhesives are single-part, photo-initiated acrylates that cure on demand when exposed to UV-light. Almost instant cure. Some cure with very low intensity. Flexible or rigid products available. High optical clarity & non-yellowing. Bonds a wide range of substrates [See More]
- Industry: Electronics; Electric Power
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Cure / Technology: UV or Radiation Cured
from Chemence Inc.
Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound
- Chemical System: Cyanoacrylate
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive. High thermal conductivity. Solvent-free formulation. Low viscosity [See More]
- Industry: Electronics
- Form / Shape: Paste
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Industry: Electronics
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: Grease, Paste
- Composition: Two Component
from Hapco, Inc.
Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Techsil Limited
MG Chemicals 419c Acrylic Conformal Coating is an IPC-CC-830B and UL 94-VO certified, fast drying, one part coating product which provides an excellent finish. It is easy to use and does not require any special or costly equipment's to apply. Ideal for high moisture environments and protects... [See More]
- Industry: Electronics
- Use: Encapsulant or Conformal Coating
from Henkel Corporation - Electronics
Bergquist Bond-Ply 400 is an un-reinforced, thermally conductive, pressure sensitive adhesive tape. The tape is supplied with protective topside tabs and a carrier liner. Bond-Ply 400 is designed to attain high bond strength to a variety of “low energy ” surfaces, including many... [See More]
- Industry: Electronics
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset; UV or Radiation Cured
from Chemence Inc.
KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure at room... [See More]
- Industry: Electronics
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Silicone
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications. Electrically conductive. Thermally conductive. Good dispensing characteristics. Hydrophobic [See More]
- Industry: Electronics
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- CTE: 34
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Polyurethane
from Aremco Products, Inc.
Aremco offers an impressive selection of high performance epoxies for specialty bonding and potting applications to 600 °F. These products can be applied to a myriad of substrates, offering exceptional chemical, electrical and mechanical properties. [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: Epoxy
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Techsil Limited
MG Chemicals 419D Premium Acrylic Conformal Coating is an IPC-CC-830B and UL 94-VO certified, fast drying, one part coating product which is easy to use. It serves to protect electric circuits against moisture, dirt, dust, thermal shocks and scratches whilst also insulating against high-voltage... [See More]
- Industry: Electronics
- Use: Encapsulant or Conformal Coating
from Henkel Corporation - Electronics
Bond-Ply ® 800 is a thermally conductive, electrically isolation double-sided tape. Bond-Ply ® 800 is utilized in lighting applications that require thermal transfer and electric isolation. High bond strengths obtained at ambient temperature lead to significant processing cost savings in... [See More]
- Industry: Electronics
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Industry: Electronics
- Form / Shape: Grease, Paste
- Use: Encapsulant, Potting Compound
- Chemical System: Silicone
from Hapco, Inc.
High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Techsil Limited
MG Chemicals 4223 Urethane Conformal Coating offers a highly chemical-resistant finish that meets UL standards for indoor conformal coatings. This PU protects electric circuits against corrosive chemicals, moisture, dirt, dust, thermal shocks and scratches, alongside is also insulates against... [See More]
- Industry: Electronics
- Chemical System: Polyurethane
- Use: Encapsulant or Conformal Coating
from Henkel Corporation - Electronics
Bond-Ply LMS 500P is a thermally conductive laminate with a polyimide film substrate.The product consists of a high performance thermally conductive low modulus silicone compound coated both sides of a polyimide film, and double lined with protective films.The low modulus silicone design effectively... [See More]
- Industry: Electronics
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
- Chemical System: Epoxy
from Hapco, Inc.
Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Techsil Limited
MG Chemicals 4226 Super Corona Dope is a highly insulating coating with excellent arc and corona resistance. This low viscosity, one part varnish is ready to use and adheres well to many substrates. This products insulates transformers, coils, motor windings, and various electronic generator parts... [See More]
- Industry: Electronics
- Use: Impregnating Resin
from Henkel Corporation - Electronics
Bond-Ply ® LMS-HD is a thermally conductive heat curable laminate material. The product consists of a high performance thermally conductive low modulus silicone compound coated on a cured core, and double lined with protective films. The low modulus silicone design effectively absorbs mechanical... [See More]
- Industry: Electronics
from Protavic America, Inc.
PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
- Chemical System: Polyurethane
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Techsil Limited
MG Chemicals 4226 Super Corona Dope is a highly insulating coating with excellent arc and corona resistance. This low viscosity, one part varnish is ready to use and adheres well to many substrates. This products insulates transformers, coils, motor windings, and various electronic generator parts... [See More]
- Industry: Electronics
- Use: Impregnating Resin
from Henkel Corporation - Electronics
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Composition: Single Component
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]
- Industry: Electronics
- Chemical System: Polyurethane
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Techsil Limited
MG Chemicals 422B is a silicone modified conformal coating which is a clear and flexible coating, ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Use: Encapsulant or Conformal Coating
from Henkel Corporation - Electronics
Gap Filler 1000 is a thermally conductive, liquid gap filling material. It is supplied as a two-component, room or elevated temperature curing system. The material is formulated to provide a balance of cured material properties highlighted by low modulus and good compression set (memory). The result... [See More]
- Industry: Electronics
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. Hapflex ™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex ™ 700/800 products exhibit high tensile strength, high tear strength, and excellent elongation. All Hapflex... [See More]
- Industry: Electronics
- Chemical System: Polyurethane
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Techsil Limited
MG Chemicals 422B Silicone Conformal Coating is a clear and flexible aerosol coating that is ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Use: Encapsulant or Conformal Coating
from Henkel Corporation - Electronics
Gap Filler 1000SR is a two-part, thermally conductive, liquid gap filling material that features superior slump resistance. The mixed system will cure at room temperature and can be accelerated with the addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness... [See More]
- Industry: Electronics
from Techsil Limited
MG Chemicals 422B is a silicone modified conformal coating which is a clear and flexible coating, ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Use: Encapsulant or Conformal Coating
from Henkel Corporation - Electronics
Gap Filler 1100SF is the thermal solution for silicone-sensitive applications. The material is supplied as a two-part component curing at room or elevated temperatures. The material exhibits low modulus properties then cures to a soft, flexible elastomer, helping reduce thermal cycling stresses... [See More]
- Industry: Electronics
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Features: Electrically Conductive; Thermally Conductive
from Henkel Corporation - Electronics
GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]
- Industry: Electronics
- Form / Shape: Pad
- Use: Gap Filler, Foam in Place Gasket
- Features: Thermally Conductive