Electronics Electrical and Electronic Resins

Cyanoacrylate Instant Adhesive -- KB014
from Chemence Inc.

Krylex KB014 is a low viscosity, surface insensitive cyanoacrylate instant adhesive. It provides excellent adhesion to plastics, metals and elastomers as well as acidic surfaces such as wood, leather and paper. Krylex KB014 provides high strength bonds within seconds and achieves full cure within 24... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Chemical System: Cyanoacrylate
ELAN-Cast® -- P 300 S RTC
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Impregnating Resin (optional feature)
  • Chemical System: Alkyd
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000
from Epoxy Technology

EPO-TEK ® EK1000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy... [See More]

  • Industry: Semiconductors, IC's; Electronics
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Capillary Underfill -- ALPHA® HiTech™ CU11-3127
from MacDermid Alpha Electronics Solutions

ALPHA ® HiTech ™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA ® HiTech ™ CU11-3127 protects the solder joints from mechanical stresses such as drop... [See More]

  • Industry: Semiconductors, IC's; Electronics
  • Composition: Single Component
  • Chemical System: Epoxy
  • CTE: 16 to 111
Fluon® Perfluoro Adhesive -- EA-2000
from AGC Chemicals Americas, Inc.

Fluon ® PFA EA-2000, is an Perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates... [See More]

  • Industry: Electronics
  • Chemical System: PFA
  • Form / Shape: Pellets
  • Tensile (Break): 5221
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
Elecolit® 6603 Thermally Conductive Epoxy 30gm -- PNEL00008
from Techsil Limited

Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
Electrically Conductive Compounds -- Cri-plastMP™ PFA
from Cri-Tech, Inc.

Cri-plastMP ™ PFA Electrically Conductive Compounds are formulated to meet your static dissipative/conductive, ATEX requirements in multiple applications. Specific grades can be processed by injection, extrusion, transfer molding, and compression molding. Superior static dissipative compounds... [See More]

  • Industry: Electronics; Electric Power
  • Tensile (Break): 493125
  • Features: Anti-static, ESD; Electrically Conductive
  • Elongation: 280.0
Light Cure Cyanoacrylate Instant Adhesive -- KU3064
from Chemence Inc.

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Cyanoacrylate
UV Epoxy -- EPO-TEK® OG133-8
from Epoxy Technology

EPO-TEK ® OG133-8 is an UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK ®... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics
  • Form / Shape: Grease, Paste
  • Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: Epoxy
Fluorinated Conformal Coating Agent -- SURECO™ CC Series
from AGC Chemicals Americas, Inc.

SURECO ™ CC series are surface treatment agents containing a fluorinated polymer compound. By forming a thin layer on a variety of surfaces, it provides excellent water & oil repellency, anti-corrosion, moisture protection and waterproofing. It can be used as a conformal coating for PCB... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Chemical System: Fluorinated Polymer
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
MG Chemicals 419c Acrylic Conformal Coating 1lt -- MGCC00007
from Techsil Limited

MG Chemicals 419c Acrylic Conformal Coating is an IPC-CC-830B and UL 94-VO certified, fast drying, one part coating product which provides an excellent finish. It is easy to use and does not require any special or costly equipment's to apply. Ideal for high moisture environments and protects... [See More]

  • Industry: Electronics
  • Use: Encapsulant or Conformal Coating
Two Component Thermally Conductive Silicone - High Viscosity -- KSC1202
from Chemence Inc.

KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure at room... [See More]

  • Industry: Electronics
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Silicone
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
MG Chemicals 419c Conformal Coating Aerosol 340gm -- MGCC00006
from Techsil Limited

MG Chemicals 419c Acrylic Conformal Coating is an IPC-CC-830B and UL 94-VO certified, fast drying, one part coating product which provides an excellent finish. It is easy to use and does not require any special or costly equipment's to apply. Ideal for high moisture environments and protects... [See More]

  • Industry: Electronics
  • Use: Encapsulant or Conformal Coating
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black
from Master Bond, Inc.

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
MG Chemicals 419D Premium Conformal Coating 1lt -- MGCC00008
from Techsil Limited

MG Chemicals 419D Premium Acrylic Conformal Coating is an IPC-CC-830B and UL 94-VO certified, fast drying, one part coating product which is easy to use. It serves to protect electric circuits against moisture, dirt, dust, thermal shocks and scratches whilst also insulating against high-voltage... [See More]

  • Industry: Electronics
  • Use: Encapsulant or Conformal Coating
Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126
from Master Bond, Inc.

Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Chemical System: Epoxy
  • Form / Shape: Liquid; Powder
  • Cure / Technology: Thermoset
MG Chemicals 4223 Urethane Conformal Coating 55ml -- MGCC00009
from Techsil Limited

MG Chemicals 4223 Urethane Conformal Coating offers a highly chemical-resistant finish that meets UL standards for indoor conformal coatings. This PU protects electric circuits against corrosive chemicals, moisture, dirt, dust, thermal shocks and scratches, alongside is also insulates against... [See More]

  • Industry: Electronics
  • Chemical System: Polyurethane
  • Use: Encapsulant or Conformal Coating
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: UV Curing
MG Chemicals 4226 Corona Dope Insulating Varnish -- MGEN00004
from Techsil Limited

MG Chemicals 4226 Super Corona Dope is a highly insulating coating with excellent arc and corona resistance. This low viscosity, one part varnish is ready to use and adheres well to many substrates. This products insulates transformers, coils, motor windings, and various electronic generator parts... [See More]

  • Industry: Electronics
  • Use: Impregnating Resin
Elastomer Based, One Component Adhesive and Primer -- X21
from Master Bond, Inc.

Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Composition: Single Component; Unfilled
MG Chemicals 4226 Super Corona Dope Varnish 1 Ltr -- MGCC00019
from Techsil Limited

MG Chemicals 4226 Super Corona Dope is a highly insulating coating with excellent arc and corona resistance. This low viscosity, one part varnish is ready to use and adheres well to many substrates. This products insulates transformers, coils, motor windings, and various electronic generator parts... [See More]

  • Industry: Electronics
  • Use: Impregnating Resin
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Grease, Paste
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
MG Chemicals 422B Silicone Conformal Coating 1lt -- MGCC00015
from Techsil Limited

MG Chemicals 422B is a silicone modified conformal coating which is a clear and flexible coating, ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Use: Encapsulant or Conformal Coating
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
MG Chemicals 422B Silicone Conformal Coating 340gm -- MGCC00013
from Techsil Limited

MG Chemicals 422B Silicone Conformal Coating is a clear and flexible aerosol coating that is ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Use: Encapsulant or Conformal Coating
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy; Polyphenylene Sulfide
MG Chemicals 422B Silicone Conformal Coating 55ml -- MGCC00018
from Techsil Limited

MG Chemicals 422B is a silicone modified conformal coating which is a clear and flexible coating, ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Use: Encapsulant or Conformal Coating
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP
from Master Bond, Inc.

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset
MG Chemicals 8331 Silver Conductive Epoxy 115gm -- MGEP00007
from Techsil Limited

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
MG Chemicals Black Encapsulating/Potting Epoxy Kit -- MGEP00009
from Techsil Limited

MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely resistant to... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Use: Encapsulant, Potting Compound
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
MG Chemicals Chemical Resistant High Temp Epoxy -- MGEP00011
from Techsil Limited

MG Chemicals 832HT is a high temperature epoxy designed for encapsulating and potting electronics in high temperature environments. It is also an ideal encapsulant for very chemically aggressive environments and applications where extreme physical strength is required. It protects against static... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
ABLEBOND 8008NC -- 8802604974081
from Henkel Corporation - Electronics

ABLEBOND 8008NC is a non-conductive snap cure adhesive utilizing wafer backside coating technology. [See More]

  • Industry: Electronics
  • Thermal Conductivity: 0.5000
Firestop Putty Pad -- PuttyPad
from Acoustical Solutions, Inc.

FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]

  • Industry: Electronics
  • Form / Shape: Grease, Paste
  • Use: Gap Filler, Foam in Place Gasket
  • Composition: Single Component
Die Attach Adhesives
from Metalor Technologies USA Corporation

Electrically and thermally conductive adhesives for microelectronic applications. Working in partnership with valued customers, we have carried out extensive development programmes to customize silver flakes and powders to suit many electronic applications. We are acknowledged as a leading supplier... [See More]

  • Industry: Electronics
  • Features: Electrically Conductive
High Temperature Silicone Sealant -- 9815
from Phelps Industrial Products

Phelps Style 9815 is 100% RTV (room temperature vulcanizing) silicone that can be used anywhere a high temperature sealant/adhesive is required. This high temp silicone sealant builds a formed-in-place gasket at operating temperatures up to 310 °C. Phelps Style 9815 high temperature silicone... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Form / Shape: Gel
  • Cure / Technology: Room Temperature Vulcanizing or Curing
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Industry: Electronics; Electric Power
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
?utomotive Pastes
from Monocrystal, Inc.

AGH – series. Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition variations: AGH-A-60 – 60%... [See More]

  • Industry: Electronics
  • Features: Electrically Conductive
  • Form / Shape: Grease, Paste
Cyanoacrylates -- Vibra-Tite®
from ND Industries, Inc.

Cyanoacrylates (also known as superglues) are single-part clear instant adhesives that rapidly polymerize at room temperature and develop strength extremely fast (fixture 0 to 60 seconds). They are initiated by moisture on the parts surface or by accelerators. Uses: Circuit board wires. Ceramic,... [See More]

  • Industry: Electronics
  • Chemical System: Acrylic
  • Form / Shape: Liquid
  • Cure / Technology: Air Setting / Film Drying
Engineered Materials -- Thermotech TE
from Materion Corporation

Thermotech TE ™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant,... [See More]

  • Industry: Electronics
  • Features: Electrically Conductive
  • Composition: Two Component  
2 Ton®Clear Epoxy -- 14310 [14310 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Composition: Two Component  ; Unfilled
HEAT SINK COMPOUND, WHT SYRINGE 1OZ -- 00Z1552 [10-8132 from GC Electronics]
from Newark, An Avnet Company

HEAT SINK COMPOUND, WHT SYRINGE 1OZ; Sealant Applications:Electronics; Color:White; Dispensing Method:Syringe; Volume:1fl.oz. (US) [See More]

  • Industry: Electronics
Self-Leveling Static Dissipative -- TRAFFICOTE™ #105 SD
from Sherwin-Williams Protective & Marine Coatings

General Polymers TRAFFICOTE #105 SD provides a high build (minimum 1/16 ”) protective surfacing. By utilizing a high solids, low viscosity binder resin this TRAFFICOTE #105 SD system provides a fluid, self-leveling mixture that is easily spread with a v-notched trowel or v-notched squeegee... [See More]

  • Industry: Electronics
  • Use Temperature: 50 to 90
  • Cure / Technology: Air Setting / Film Drying
  • Tensile (Break): 2500
NO-OX-ID "A-Special" Electrical Contact Grease
from Sanchem, Inc.

is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]

  • Industry: Electronics; Electric Power
  • Form / Shape: Gel
  • Use: Impregnating Resin
  • Cure / Technology: Non-Drying
Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset
  • Form / Shape: Grease, Paste
  • Composition: Single Component; Unfilled
Thermal Compound -- TC70
from Nordson EFD

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

  • Industry: Semiconductors, IC's; Electronics
  • Chemical System: Synthetic Based
  • Form / Shape: Grease, Paste
  • Cure / Technology: Air Setting / Film Drying
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone
Flowable, One-component Silicone Sealant -- CENUSIL® RT 760 CN A/B
from Wacker Chemical Corp.

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Use: Encapsulant, Potting Compound
  • Features: Thermally Conductive
Electronic Protective Coating Silicone Compound -- Bluesil™ V-205
from Bluestar Silicones USA Corp.

One-Component , Black, Light Opaque, Addition Cure, Electronic Protective coating Silicone Compound. Properties. Viscosity 35000. Hardness Sha 45. Description. Bluesil V-205 is a one component, black, addition cure silicone rubber compound. It is designed as a protective coating for electronic... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Chemical System: Silicone
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
Aremco-Seal -- 613
from Aremco Products, Inc.

Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Features: Thermally Conductive
Bond-Ply 100 -- 8806385156097
from Henkel Corporation - Electronics

Your benefits. Thermal impedance 0.52 °C-in ²/W (@50 psi). High bond strength to a variety of surfaces. Double-sided, pressure sensitive adhesive tape. High performance, thermally conductive acrylic adhesive. Can be used instead of heat-cure adhesive, screw mounting or clip mounting. [See More]

  • Industry: Electronics
Firestop Putty Tube -- SSP100
from Acoustical Solutions, Inc.

SSP Firestop Putty is perfect for metallic conduits, telephone, data or electrical power cable penetrations. A variety of sleeved and non-sleeved applications have been tested and proven providing the ultimate in installation versatility. Non-hardening and reusable, SSP Firestop Putty addresses the... [See More]

  • Industry: Electronics
  • Form / Shape: Grease, Paste
  • Use: Gap Filler, Foam in Place Gasket
  • Composition: Single Component
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Industry: Electronics
  • Form / Shape: Gel
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
Light Cure Adhesives -- Vibra-Tite®
from ND Industries, Inc.

Vibra-Tite light cure adhesives are single-part, photo-initiated acrylates that cure on demand when exposed to UV-light. Almost instant cure. Some cure with very low intensity. Flexible or rigid products available. High optical clarity & non-yellowing. Bonds a wide range of substrates [See More]

  • Industry: Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: UV or Radiation Cured
734 Flowable Sealant -- 734CL300ML CRT [734CL300ML CRT from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

10.1 oz Cartridge; Clear; One Part RTV Liquid; Cures At Room Temperature; Not For Use on Vertical Or Overhead Surfaces [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Cure By Acetic Acid
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Polyurethane
Silicone Elastomer Gel Encapsulant And Potting Compound -- SilGel® 612 A/B
from Wacker Chemical Corp.

WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]

  • Industry: Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Silicone
Di-Pak™ E-4500 Elastomeric Eletrical Insulating Compound -- E-4540
from Hapco, Inc.

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Bond-Ply 400 -- 8806385123329
from Henkel Corporation - Electronics

Bergquist Bond-Ply 400 is an un-reinforced, thermally conductive, pressure sensitive adhesive tape. The tape is supplied with protective topside tabs and a carrier liner. Bond-Ply 400 is designed to attain high bond strength to a variety of “low energy ” surfaces, including many... [See More]

  • Industry: Electronics
Electrically Conductive Epoxy -- 40-3905
from Epoxies Etc...

40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
734 Flowable Sealant -- 734CL90ML TUBE [734CL90ML TUBE from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

3 oz Tube; Clear; One Part RTV Liquid; Cures At Room Temperature; Not For Use on Vertical Or Overhead Surfaces [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Cure By Acetic Acid
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset; UV or Radiation Cured
Di-Pak™ E-4600 Elastomeric Eletrical Insulating Compound -- E-4650
from Hapco, Inc.

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
Ceramabond -- 890
from Aremco Products, Inc.

Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]

  • Industry: Electronics
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Form / Shape: Grease, Paste
  • Composition: Two Component  
Bond-Ply 800 -- 8806385057793
from Henkel Corporation - Electronics

Bond-Ply ® 800 is a thermally conductive, electrically isolation double-sided tape. Bond-Ply ® 800 is utilized in lighting applications that require thermal transfer and electric isolation. High bond strengths obtained at ambient temperature lead to significant processing cost savings in... [See More]

  • Industry: Electronics
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Polyurethane
738 Electrical Sealant -- 738WH300ML CRT [738WH300ML CRT from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

10.1 oz Cartridge; White; Use for Bonding & Sealing; Can Be Used in Corrosion-Sensitive Electrical & Electronic Equipment [See More]

  • Industry: Electronics; Electric Power
  • Composition: Two Component  
  • Cure / Technology: Cure By Methanol
  • Features: UL Rating
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
High Performance Epoxies -- 2330
from Aremco Products, Inc.

Aremco offers an impressive selection of high performance epoxies for specialty bonding and potting applications to 600 °F. These products can be applied to a myriad of substrates, offering exceptional chemical, electrical and mechanical properties. [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Chemical System: Epoxy
Bond-Ply LMS 500P -- 8806385025025
from Henkel Corporation - Electronics

Bond-Ply LMS 500P is a thermally conductive laminate with a polyimide film substrate.The product consists of a high performance thermally conductive low modulus silicone compound coated both sides of a polyimide film, and double lined with protective films.The low modulus silicone design effectively... [See More]

  • Industry: Electronics
748 Non-Corrosive Sealant -- 748 300ML CRT [748 300ML CRT from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

10.1 oz Cartridge; Use to Seal Electrical Applications, Food Processing & Transportation Applications; Adheres to Most Metals, Plastics, Masonry & Other Surfaces [See More]

  • Industry: Electronics
  • Composition: Two Component  
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Cure By Methanol
  • Use Temperature: -65 to 300
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4888
from Hapco, Inc.

High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
Sil-Bond™ -- 905
from Aremco Products, Inc.

Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]

  • Industry: Electronics
  • Form / Shape: Grease, Paste
  • Use: Encapsulant, Potting Compound
  • Chemical System: Silicone
Bond-Ply LMS-HD -- 8806384992257
from Henkel Corporation - Electronics

Bond-Ply ® LMS-HD is a thermally conductive heat curable laminate material. The product consists of a high performance thermally conductive low modulus silicone compound coated on a cured core, and double lined with protective films. The low modulus silicone design effectively absorbs mechanical... [See More]

  • Industry: Electronics
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Chemical System: Polyurethane
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4901-2
from Hapco, Inc.

Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8660S
from Henkel Corporation - Electronics

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Composition: Single Component
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4200
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
Gap Filler 1000 (Two Part) -- 8806384041985
from Henkel Corporation - Electronics

Gap Filler 1000 is a thermally conductive, liquid gap filling material. It is supplied as a two-component, room or elevated temperature curing system. The material is formulated to provide a balance of cured material properties highlighted by low modulus and good compression set (memory). The result... [See More]

  • Industry: Electronics
Hapflex™ 1000 Series High Performance Hybrid Elastomeric Polymer Alloy -- 1021
from Hapco, Inc.

HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]

  • Industry: Electronics
  • Chemical System: Polyurethane
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing
Gap Filler 1000SR (Two-Part) -- 8806384074753
from Henkel Corporation - Electronics

Gap Filler 1000SR is a two-part, thermally conductive, liquid gap filling material that features superior slump resistance. The mixed system will cure at room temperature and can be accelerated with the addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness... [See More]

  • Industry: Electronics
Hapflex™ 700 Series High Performance Hybrid Elastomeric Polymer Alloy -- 765
from Hapco, Inc.

HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. Hapflex ™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex ™ 700/800 products exhibit high tensile strength, high tear strength, and excellent elongation. All Hapflex... [See More]

  • Industry: Electronics
  • Chemical System: Polyurethane
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing
Gap Filler 1100 SF (Two Part) -- 8806383943681
from Henkel Corporation - Electronics

Gap Filler 1100SF is the thermal solution for silicone-sensitive applications. The material is supplied as a two-part component curing at room or elevated temperatures. The material exhibits low modulus properties then cures to a soft, flexible elastomer, helping reduce thermal cycling stresses... [See More]

  • Industry: Electronics
Gap Filler 1500 (Two-Part) -- 8806383910913
from Henkel Corporation - Electronics

Gap Filler 1500 is a two-part, high performance, thermally conductive liquid gap filling material, which features superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing. The mixed system will cure at room temperature and can be... [See More]

  • Industry: Electronics
Gap Filler 1500LV -- 8806383812609
from Henkel Corporation - Electronics

Gap Filler 1500LV is a two-part, high performance, thermally conductive, liquid gap filling material. This material offers the high temperature resistance and low modulus of a silicone material with significantly lower levels of silicone outgassing for use in silicone sensitive applications. The... [See More]

  • Industry: Electronics
Thermal Interface Material -- GAP PAD HC 5.0
from Henkel Corporation - Electronics

GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]

  • Industry: Electronics
  • Form / Shape: Pad
  • Use: Gap Filler, Foam in Place Gasket
  • Features: Thermally Conductive