Electrically Conductive Compound (Adhesive, Grease) Electrical and Electronic Resins
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from MacDermid Alpha Electronics Solutions
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements. Product Overview. ATROX conductive die attach products provide a comprehensive solution with a reduced total cost of ownership, ushering in a new era... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Industry: Semiconductors, IC's; Electronics
- Use: Die Bonding Adhesives
- Thermal Conductivity: 5
from Cri-Tech, Inc.
Cri-plastMP ™ PFA Electrically Conductive Compounds are formulated to meet your static dissipative/conductive, ATEX requirements in multiple applications. Specific grades can be processed by injection, extrusion, transfer molding, and compression molding. Superior static dissipative compounds... [See More]
- Features: Anti-static, ESD; Electrically Conductive
- Tensile (Break): 493125
- Industry: Electronics; Electric Power
- Elongation: 280.0
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Features: Electrically Conductive; Thermally Conductive; NASA Low Outgassing
- Form / Shape: Grease, Paste
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Features: Electrically Conductive; Thermally Conductive
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy; Polyphenylene Sulfide
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes, shorter lives at higher... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]
- Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Thermally Conductive; NASA Low Outgassing
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Features: Electrically Conductive
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Metalor Technologies USA Corporation
Electrically and thermally conductive adhesives for microelectronic applications. Working in partnership with valued customers, we have carried out extensive development programmes to customize silver flakes and powders to suit many electronic applications. We are acknowledged as a leading supplier... [See More]
- Features: Electrically Conductive
- Industry: Electronics
from Monocrystal, Inc.
AGH – series. Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition variations: AGH-A-60 – 60%... [See More]
- Features: Electrically Conductive
- Industry: Electronics
- Form / Shape: Grease, Paste
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications. Electrically conductive. Thermally conductive. Good dispensing characteristics. Hydrophobic [See More]
- Features: Electrically Conductive
- Industry: Electronics
- Cure / Technology: Thermoset
- CTE: 34
from Sanchem, Inc.
is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]
- Features: Electrically Conductive
- Form / Shape: Gel
- Use: Impregnating Resin
- Cure / Technology: Non-Drying
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Silver-Carbon Filled (Non-Magnetic), Resistant to Temperature Variations, Impact / Shock Resistant, Corrosion Resistant
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Henkel Corporation - Electronics
ABLESTIK ABLEBOND 958-8C is an electrically conductive epoxy designed for solder replacement in microelectronic interconnect applications. It may be used with thick film metalizations or traditional printed circuit board surfaces. [See More]
- Features: Electrically Conductive
- Industry: Electronics
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Features: High Dielectric; Electrically Conductive; Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: Grease, Paste
- Industry: Electronics
from Wacker Chemical Corp.
SEMICOSIL ® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features. Low volume resistivity. Thixotropic paste. Solvated. Excellent adhesion to many substrates. Application. SEMICOSIL ® 979 EC is an electrically conductive adhesive for... [See More]
- Features: Electrically Conductive
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
from Materion Corporation
Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]
- Features: Electrically Conductive
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Industry: Electronics
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Silicone
from Shenzhen DeepMaterial Technologies Co., Ltd
Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a... [See More]
- Features: Electrically Conductive
- Cure / Technology: Heat curing
- Chemical System: Epoxy; Silicone
- Industry: Semiconductors, IC's
from ThreeBond International, Inc.
Electrically Conductive Resins. These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are electro-conductive resins made up of synthetic resin and a conductive... [See More]
- Features: Electrically Conductive
- Cure / Technology: Anaerobic
- Chemical System: Silicone
- Industry: Electronics
from Techsil Limited
Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Silver-Carbon Filled (Non-Magnetic), Resistant to Temperature Variations, Impact / Shock Resistant, Corrosion Resistant
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Henkel Corporation - Electronics
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Features: Electrically Conductive
- Chemical System: Silicone
- Form / Shape: Gel
- Cure / Technology: Thermoset
from Materion Corporation
Thermotech TE ™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant,... [See More]
- Features: Electrically Conductive
- Composition: Two Component
- Industry: Electronics
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Features: Electrically Conductive; Thermal Insulation
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset; UV or Radiation Cured
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]
- Features: Electrically Conductive
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Henkel Corporation - Electronics
Liqui-Bond SA 2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond SA 2000 is supplied as a one-part liquid component, in either tube or mid-sized container form. Liqui-Bond SA 2000 features excellent low and high-temperature... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Carbon Filled (Non-Metallic & Non-Magnetic), Resistant to Temperature Variations, Impact / Shock Resistant, Corrosion Resistant
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Henkel Corporation - Electronics
Liqui-Bond ® SA 3505 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a two-part material and requires no refrigeration. The mixed material cures at elevated temperatures. As cured, Liqui-Bond ® SA 3505 provides a strong bonding, form-in-place... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Techsil Limited
MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Silver-Carbon Filled (Non-Magnetic), Resistant to Temperature Variations, Impact / Shock Resistant, Corrosion Resistant
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Henkel Corporation - Electronics
Liqui-Bond ® EA 1805 is a two-component, epoxy based, liquid-dispensable adhesive. Liqui-Bond ® EA 1805 has a thermal conductivity of 1.8 W/mK. Liqui-Bond ® EA 1805 will be supplied in a two-component format, and refrigeration is not required. Liqui-Bond ® EA 1805 has a high bond... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Silver-Graphene Filled (Non-Magnetic), Resistant to Temperature Variations, Graphene Loaded (Improves Cracking Resistance)
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Henkel Corporation - Electronics
Liqui-Bond SA 1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy screenability. Liqui-Bond SA 1000 features a high thermal performance and maintains it ’s structure even in severe environment applications. Liqui-Bond SA 1000 features excellent low... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Carbon Filled (Non-Metallic & Non-Magnetic), Resistant to Temperature Variations, Impact / Shock Resistant, Corrosion Resistant
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Henkel Corporation - Electronics
Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer. The adhesive is supplied as a one-part liquid component, offered in a tube or mid-size container. Liqui-Bond SA 1800 features a combination of high thermal conductivity with a low viscosity... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Henkel Corporation - Electronics
Liqui-Form ® 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. Liqui-Form ® 2000 is a highly conformable shear-thinning material which... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Techsil Limited
Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primerless adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for electronics that need EMI... [See More]
- Features: Electrically Conductive
- Industry: Electronics
- Chemical System: Silicone
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Silver-Carbon Filled (Non-Magnetic), Resistant to Temperature Variations, Impact/Shock Resistant, Corrosion Resistant
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Henkel Corporation - Electronics
Poly-Pad 1000 is a fiberglass-based insulator coated with a filled polyester resin. The mterial offers superior thermal resistance for high performance applications. Polyester-based, thermally conductive insulators from Bergquist provide a complete family of materials for silicone-sensitive... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Techsil Limited
Elecolit ® 323 is a silver filled two part epoxy adhesive specially developed for bonding open chip components. This semiconducting grade has passed the autoclave test (1000h) and is suitable for use on semi conductors, it has no effect on bond wire adhesion. It can cured at either room... [See More]
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Higher Glass Transition & Operating Temperature, Silver-Graphene Filled (Non-Magnetic), Graphene Loaded, Wide Temperature Operation
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Henkel Corporation - Electronics
Poly-Pad 400 is a fiberglass-reinforced insulator coated with a filled polyester resin. Poly-Pad 400 is economical and designed for most standard applications. Polyester-based, thermally conductive insulators from Bergquist provide a complete family of materials for silicone-sensitive applications. [See More]
- Features: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Techsil Limited
Elecolit ® 3653 is a 1 component silver filled, solvent-free conductive epoxy adhesive used in applications which are subject to vibrations or quick temperature fluctuations. This unique product can be cured thermally in a very short period of time and cures to a 60 - 75 Shore D material. Silver... [See More]
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
Our G6E-TSHV ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Features: Electrically Conductive; High Viscosity, High Thermal Conductivity, Strong Electrical Resistance, Graphene Loaded
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Henkel Corporation - Electronics
Poly-Pad K-10 is a composite of film coated with a polyester resin. The material offers superior thermal performance for your most critical applications with a thermal resistance of 0.2 °C-in2/W as well as excellent dielectric strength. Polyeste- based, thermally conductive insulators from... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Techsil Limited
Elecolit ® 414 is a single component silver-filled, electrically conductive coating substance that hardens into a flexible, chemical resistant, expandable, non-deformable and friction resistant film. Grey in colour, Elecolit ® 414 has a viscosity of 20,000 to 25,000 mPas and when used with... [See More]
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Carbon Filled (Non-Metallic / Non-Magnetic), Low Density, Corrosion Resistant
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Henkel Corporation - Electronics
Poly-Pad K-4 is a composite of film coated with a polyester resin. The material is an economical insulator and the film carrier provides excellent dielectric and physical strength. Polyester-based, thermally conductive insulators from Bergquist provide a complete family of material for... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Graphene Loaded (Improves Cracking Resistance), Wide Temperature Operation (Cracking Resistant)
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset