Gel Electrical and Electronic Resins
from CHT USA Inc.
CHT ’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also flame... [See More]
- Form / Shape: Gel
- Cure / Technology: Addition
- Chemical System: Silicone
- Industry: Electronics
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m ·K. ◆ Soft and elastic after curing, maintaining the required thickness and providing... [See More]
- Form / Shape: Gel
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive
from CHT USA Inc.
CHT's TufGel 330 is a 2-part, clear, tough, moderately cross-linked silicone gel. It has good room temperature cure adhesion to many substrates. TufGel 330 is used to provide protection from vibration and thermal or mechanical shock and will also provide excellent moisture protection. [See More]
- Form / Shape: Gel
- Industry: Electronics
- Cure / Technology: Addition
- Composition: Two Component
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m ·K. ◆ High softness and compressibility, providing low assembly stress, ideal for... [See More]
- Form / Shape: Gel
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive
from CHT USA Inc.
CHT's QGEl 311UV is a 2-part, platinum cure, special purpose silicone gel. It is designed with convenient 1:1 mix ratio, and low viscosity for easy dispensing. QGel 311UV is soft, but resilient and is amoderately cross-linked silicone polymer. QGel 311UV is clear but contains a UV tracer for easy QC... [See More]
- Form / Shape: Gel
- Industry: Electronics
- Cure / Technology: Addition
- Composition: Two Component
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m ·K. ◆ High softness and compressibility, providing low assembly stress, ideal for... [See More]
- Form / Shape: Gel
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AE Series one-component Silicone-free Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Free from siloxane and the risk of silicone oil bleed. ◆ Good thermal conductivity, available in options ranging from 1.0 to 3.0 W/m ·K. ◆... [See More]
- Form / Shape: Gel
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive
from Dongguan Sheen Electronic Technology Co., Ltd.
SY300 is a new type of heat insulation pad, which is a film-like nano-insulation material. Aerogel is the world's lightest and most thermally insulating solid with a pore size of about 20 nm, which is less than the free path of air (70 nm). The air molecules in the pores lose their ability to flow... [See More]
- Form / Shape: Gel
- Features: Thermally Conductive
- Industry: Electronics
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SY300 Series Aerogel Thermal Insulation Film are renowned for their distinctive characteristics, which include: ◆ Superior thermal insulation performance. ◆ Lightweight and thin profile, saves space with thin design. ◆ High temperature stability, maintains performance... [See More]
- Form / Shape: Gel
- Features: Thermally Conductive
- Industry: Electronics
- Use Temperature: -40 to 266
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Form / Shape: Gel
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY's NL-putty series is a silicone free, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of... [See More]
- Form / Shape: Gel; Liquid; Syringe/Cartridge/Pale
- Chemical System: Silicone Free
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics; Electric Power
from Wacker Chemical Corp.
ELASTOSIL ® RT 646 A/B is a castable, additioncuring, two-component silicone rubber which vulcanizes at room temperature. Special features. high hardness and good mechanical properties. good chemical resistance. good resistance to casting resins. excellent reversion resistance. fast and... [See More]
- Form / Shape: Gel
- Chemical System: Silicone
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Phelps Industrial Products
Phelps Style 9815 is 100% RTV (room temperature vulcanizing) silicone that can be used anywhere a high temperature sealant/adhesive is required. This high temp silicone sealant builds a formed-in-place gasket at operating temperatures up to 310 °C. Phelps Style 9815 high temperature silicone... [See More]
- Form / Shape: Gel
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Industry: Electronics
from Chemence Inc.
Krylex KB094 is a gel viscosity cyanoacrylate instant adhesive with good adhesion to plastics, metals and elastomers. It provides high strength bonds within seconds of assembly and achieves full cure within 24 hours of assembly. Krylex KB094 is a good general purpose instant adhesive used in... [See More]
- Form / Shape: Gel
- Chemical System: Cyanoacrylate
- Use: Die Bonding Adhesives
- Cure / Technology: Reactive or Moisture Cured (optional feature)
from Sanchem, Inc.
is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]
- Form / Shape: Gel
- Cure / Technology: Non-Drying
- Use: Impregnating Resin
- Industry: Electronics; Electric Power
from Protavic America, Inc.
The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]
- Form / Shape: Gel
- Chemical System: Hybrid
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
from Epoxies Etc...
The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]
- Form / Shape: Gel
- Chemical System: Polyurethane
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY ’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It... [See More]
- Form / Shape: Gel; Grease, Paste
- Chemical System: Silicone
- Use: Die Bonding Adhesives
- Cure / Technology: Room Temperature Vulcanizing or Curing (optional feature); High Heat
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Form / Shape: Gel
- Cure / Technology: Thermoset
- Chemical System: Silicone
- Industry: Electronics
from Chemence Inc.
KSC12028 is a silicone RTV gel developed for electronic applications requiring a re-penetrable self-sealing, silicone gel product. KSC12028 is a two part, solvent free, 1:1 mix ratio silicone that when mixed cures in 12 hours at room temperature. Alternatively, KSC12028 can be cured in approximately... [See More]
- Form / Shape: Gel
- Chemical System: Silicone
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound
- Industry: Electronics
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Form / Shape: Gel
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Epoxies Etc...
10-3785 is a one component (no mixing necessary) epoxy adhesive. This product maintains exceptionally strong structural bonds over a wide temperature range (-55 °C to 150 °C). A unique and popular feature of the 10-3785 is its ’ ability to cure at temperatures as low as 93 °C (200... [See More]
- Form / Shape: Gel
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
from Protavic America, Inc.
Epoxy system commonly used as an underfill material. This material is designed to survive extreme heat and can be used on various sized BGA devices. It can be used for STB underfill protection applications. [See More]
- Form / Shape: Gel
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Form / Shape: Gel
- Chemical System: Silicone
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Cure / Technology: Thermoset