Gel Electrical and Electronic Resins

Cyanoacrylate Instant Adhesive -- KB094
from Chemence Inc.

Krylex KB094 is a gel viscosity cyanoacrylate instant adhesive with good adhesion to plastics, metals and elastomers. It provides high strength bonds within seconds of assembly and achieves full cure within 24 hours of assembly. Krylex KB094 is a good general purpose instant adhesive used in... [See More]

  • Form / Shape: Gel
  • Chemical System: Cyanoacrylate
  • Use: Die Bonding Adhesives
  • Cure / Technology: Reactive or Moisture Cured (optional feature)
Two Component, Thermally Conductive Urethane Modified Epoxy Gel-Like System -- Super Gel 9AO
from Master Bond, Inc.

Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super Gel 9... [See More]

  • Form / Shape: Gel; Liquid
  • Chemical System: Epoxy; Polyurethane; Silicone
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Repenetrable 2 Part RTV Silicone Gel -- KSC12028
from Chemence Inc.

KSC12028 is a silicone RTV gel developed for electronic applications requiring a re-penetrable self-sealing, silicone gel product. KSC12028 is a two part, solvent free, 1:1 mix ratio silicone that when mixed cures in 12 hours at room temperature. Alternatively, KSC12028 can be cured in approximately... [See More]

  • Form / Shape: Gel
  • Chemical System: Silicone
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Industry: Electronics
Castable, Addition-curing, Two-component Silicone Rubber -- ELASTOSIL® RT646 A/B
from Wacker Chemical Corp.

ELASTOSIL ® RT 646 A/B is a castable, additioncuring, two-component silicone rubber which vulcanizes at room temperature. Special features. high hardness and good mechanical properties. good chemical resistance. good resistance to casting resins. excellent reversion resistance. fast and... [See More]

  • Form / Shape: Gel
  • Chemical System: Silicone
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
NO-OX-ID "A-Special" Electrical Contact Grease
from Sanchem, Inc.

is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]

  • Form / Shape: Gel
  • Cure / Technology: Non-Drying
  • Use: Impregnating Resin
  • Industry: Electronics; Electric Power
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Form / Shape: Gel
  • Chemical System: Epoxy
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
High Temperature Silicone Sealant -- 9815
from Phelps Industrial Products

Phelps Style 9815 is 100% RTV (room temperature vulcanizing) silicone that can be used anywhere a high temperature sealant/adhesive is required. This high temp silicone sealant builds a formed-in-place gasket at operating temperatures up to 310 °C. Phelps Style 9815 high temperature silicone... [See More]

  • Form / Shape: Gel
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Industry: Electronics
Conductive Hybrid Adhesive -- ACH-20120
from Protavic America, Inc.

The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]

  • Form / Shape: Gel
  • Chemical System: Hybrid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset
Thermally Conductive Silicone Rubber Compound -- ELASTOSIL® RT 743 LV-K A/B
from Wacker Chemical Corp.

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

  • Form / Shape: Gel
  • Cure / Technology: Thermoset
  • Chemical System: Silicone
  • Industry: Electronics
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Form / Shape: Gel
  • Chemical System: Polyurethane
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Form / Shape: Gel
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
One component epoxy adhesive -- 10-3785
from Epoxies Etc...

10-3785 is a one component (no mixing necessary) epoxy adhesive. This product maintains exceptionally strong structural bonds over a wide temperature range (-55 °C to 150 °C). A unique and popular feature of the 10-3785 is its ’ ability to cure at temperatures as low as 93 °C (200... [See More]

  • Form / Shape: Gel
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset
Fast Flow, Fast Cure Epoxy Adhesive -- ANE-10931
from Protavic America, Inc.

Epoxy system commonly used as an underfill material. This material is designed to survive extreme heat and can be used on various sized BGA devices. It can be used for STB underfill protection applications. [See More]

  • Form / Shape: Gel
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Form / Shape: Gel
  • Chemical System: Silicone
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Cure / Technology: Thermoset