Die Bonding Adhesive / Compound Electrical and Electronic Resins

Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000
from Epoxy Technology

EPO-TEK ® EK1000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy... [See More]

  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Cure / Technology: Thermoset
Cyanoacrylate Instant Adhesive -- KB014
from Chemence Inc.

Krylex KB014 is a low viscosity, surface insensitive cyanoacrylate instant adhesive. It provides excellent adhesion to plastics, metals and elastomers as well as acidic surfaces such as wood, leather and paper. Krylex KB014 provides high strength bonds within seconds and achieves full cure within 24... [See More]

  • Use: Die Bonding Adhesives
  • Chemical System: Cyanoacrylate
  • Form / Shape: Liquid
  • Cure / Technology: Reactive or Moisture Cured (optional feature)
Electrically and Highly Thermally Conductive Die Attach Adhesive -- ALPHA® ATROX® HT900-1
from MacDermid Alpha Electronics Solutions

ATROX ® HT900-1 is a thermosetting conductive die attach adhesive designed for LED packages. The unique chemistry of the ATROX ® HT900-1 allows the material to be cured at lower temperatures compared to standard die attach adhesives, while maintaining its material properties. ATROX ®... [See More]

  • Use: Die Bonding Adhesives
  • Industry: Semiconductors, IC's; Electronics
  • Cure / Technology: Thermoset; Cured by Thermal Processing in Standard IR, Full Convection, Conduction or Vapor Phase Oven Equipment
  • Features: Electrically Conductive
UV Epoxy -- EPO-TEK® OG198-54
from Epoxy Technology

EPO-TEK ® OG198-54 is a low viscosity, high Tg, UV curable epoxy. Active alignment of optics, securing fibers into V-grooves and fiber pigtails are a few of its common applications. It can also be used for hybrid and semiconductor device assembly. It is a "dual" cure chemistry, performance will... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Light Cure Cyanoacrylate Instant Adhesive -- KU3064
from Chemence Inc.

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Cyanoacrylate
  • Form / Shape: Liquid
  • Cure / Technology: Anaerobic; Reactive or Moisture Cured; UV or Radiation Cured
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy; Polyphenylene Sulfide
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Polyurethane Hot Melt -- KHB8636
from Chemence Inc.

Krylex KHB8636 is a one component reactive polyurethane hot melt. It is solid at room temperature. It is a poly-battery assembly adhesive. After being applied warm the product will cool to allow immediate handling. Upon further exposure to ambient humidity Krylex KHB8636 will achieve high strength... [See More]

  • Use: Die Bonding Adhesives
  • Chemical System: Polyurethane
  • Form / Shape: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Two Component Thermally Conductive Silicone - High Viscosity -- KSC1202
from Chemence Inc.

KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure at room... [See More]

  • Use: Die Bonding Adhesives
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Industry: Electronics
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Cure / Technology: Thermoset
High Temperature Resistant Epoxy Compound -- EP45HT
from Master Bond, Inc.

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Semiconductors, IC's; Electronics; Electric Power
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Impregnating Resin
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste; Powder
  • Cure / Technology: Thermoset
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Cure / Technology: Thermoset
Low Exotherm, Two Component Epoxy -- EP29LP
from Master Bond, Inc.

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Low Viscosity, Fast Curing, Two Component Epoxy -- EP38
from Master Bond, Inc.

Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
One component, high temperature resistant epoxy system for bonding and sealing -- EP17HTDA-1
from Master Bond, Inc.

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
One Component, Storage Stable Epoxy -- EP19HT
from Master Bond, Inc.

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Room Temperature Curing, Two Component Epoxy System -- EP34
from Master Bond, Inc.

Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio (part A/part B: 100/70). [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Cure / Technology: Thermoset
Thermally Conductive, Dimensionally Stable Epoxy -- EP121AO
from Master Bond, Inc.

Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Thermally Stable Electrically Insulating Epoxy -- EP121CL
from Master Bond, Inc.

Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Two Component, Fast Curing Epoxy Adhesive -- EP65
from Master Bond, Inc.

Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes, shorter lives at higher... [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Two Component, Silver Coated, Nickel Filled Epoxy -- EP79
from Master Bond, Inc.

Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Two Component, Thermal Shock And Heat Resistant Epoxy System -- EP121
from Master Bond, Inc.

Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical... [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Electronics
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: UV or Radiation Cured
Adjustable Flexibility Epoxy -- 10-3055
from Epoxies Etc...

10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can be adjusted from rigid to flexible. [See More]

  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy; Adjustable Flexibility Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Light Cure Adhesives -- Vibra-Tite®
from ND Industries, Inc.

Vibra-Tite light cure adhesives are single-part, photo-initiated acrylates that cure on demand when exposed to UV-light. Almost instant cure. Some cure with very low intensity. Flexible or rigid products available. High optical clarity & non-yellowing. Bonds a wide range of substrates [See More]

  • Use: Die Bonding Adhesives
  • Cure / Technology: UV or Radiation Cured
  • Form / Shape: Liquid
  • Industry: Electronics; Electric Power
Non-slump, Low Modulus Silicone, Soft Sealing Adhesive -- SEMICOSIL® 811
from Wacker Chemical Corp.

If you prefer short curing times andfast adhesion built-up with minimumenergy input, SEMICOSIL ® 811 is the product of choice. The highly specialized silicone adhesive sealant provides state of the art technology for efficient and ecofriendly processing. [See More]

  • Use: Die Bonding Adhesives
  • Chemical System: Silicone
  • Form / Shape: Gel
  • Cure / Technology: Thermoset; UV or Radiation Cured
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset; UV or Radiation Cured
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Elastomer Modified Epoxy -- 20-3236
from Epoxies Etc...

20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio. [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Electrically Conductive Epoxy -- 40-3905
from Epoxies Etc...

40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]

  • Use: Die Bonding Adhesives
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset; Option of one or two component
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Polyurethane
  • Form / Shape: Liquid
  • Cure / Technology: UV or Radiation Cured
Epoxy Potting/Sealant -- PNE-47207
from Protavic America, Inc.

PNE-47207 ™ is an adhesive/sealant and potting compound. PNE-47207 ™ is designed to provide air free potting and casting of electronic devices. PNE-47207 ™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Chemical System: Polyurethane
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Electronics; Electric Power