Glob Top / Daub Electrical and Electronic Resins
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Chemical System: UV Curing
- Form / Shape: Liquid
- Cure / Technology: UV or Radiation Cured; Dual Curing
from Master Bond, Inc.
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling. [See More]
- Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset; UV or Radiation Cured
- Chemical System: Epoxy; UV curing
- Industry: Semiconductors, IC's; Photonics; Electronics
from Master Bond, Inc.
Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220 °F. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates. It is... [See More]
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Reactive or Moisture Cured; Thermoset
from Master Bond, Inc.
Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch... [See More]
- Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
- Cure / Technology: Reactive or Moisture Cured; Thermoset
- Chemical System: Epoxy
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System UV15X-2GT is a new, easily processable, one component, UV curable glob top, featuring exceptional durability and chemical resistance. UV15X-2GT is a thixotropic paste that handles well when encapsulating selected components and chips on circuit boards. The cured UV15X-2GT... [See More]
- Use: Die Bonding Adhesives; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity and electrical insulation values, this system offers superior protection to electronic components. [See More]
- Use: Die Bonding Adhesives; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Master Bond, Inc.
Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound dimensional stability. Its inherent toughness allows it to withstand the most intense types of... [See More]
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Henkel Corporation - Electronics
HYSOL EO1086 is a one-component heat cure encapsulant designed for use in Chip on Board applications requiring excellent handling properties. [See More]
- Use: Glob Top, Daub, Doming or Overfill
- Industry: Electronics
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Use: Die Bonding Adhesives; Glob Top, Daub, Doming or Overfill
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Novagard Solutions
Non-corrosive, single component alkoxy cure silicone sealant/adhesive [See More]
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset