Optical Grade / Material Electrical and Electronic Resins
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Features: High Dielectric; Optical; Thermally Conductive
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from MacDermid Alpha Electronics Solutions
A single-component epoxy system ideal for bonding heat-sensitive devices and designed for camera module applications. Product Overview. A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal for applications in camera modules and other... [See More]
- Features: Optical; Thermally Conductive
- Composition: Single Component
- Industry: Semiconductors, IC's; Electronics
- Use Temperature: 176
from CHT USA Inc.
CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The chemical composition... [See More]
- Features: High Dielectric; Optical
- Cure / Technology: Addition
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Master Bond, Inc.
Master Bond LED405Med is a one part, nano filled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets ISO 10993-5 for cytotoxicity and resists sterilization. It can cure up to 1/8 think and has low shrinkage upon cure. It also features... [See More]
- Features: High Dielectric; Optical; Thermally Conductive; ISO 10993-5 for Cytotoxicity
- Cure / Technology: Thermoset; LED Cure
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]
- Features: High Dielectric; Optical
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/ °C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. It has outstanding dimensional stability and will bond well to a wide variety of substrates, including... [See More]
- Features: High Dielectric; Optical; Thermal Insulation; NASA Low Outgassing
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Master Bond, Inc.
For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K •m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as thin as... [See More]
- Features: High Dielectric; Optical; Thermally Conductive; NASA Low Outgassing
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Chemical System: Epoxy
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Features: High Dielectric; Optical; Thermally Conductive
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Silicone
from Master Bond, Inc.
Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]
- Features: High Dielectric; Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Features: High Dielectric; Optical; Thermally Conductive; NASA Low Outgassing
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Features: High Dielectric; Optical; Thermally Conductive; NASA Low Outgassing
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Features: High Dielectric; Optical; Thermally Conductive
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: UV curable
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Features: High Dielectric; Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Cure / Technology: Thermoset; UV or Radiation Cured
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Features: Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Features: High Dielectric; Optical; Thermally Conductive; NASA Low Outgassing
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]
- Features: High Dielectric; Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. [See More]
- Features: High Dielectric; Optical; Thermally Conductive; Cryogenically serviceable
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket (optional feature)
- Chemical System: Epoxy
from Master Bond, Inc.
Key Features. Free flowing viscosity. High temperature resistance. Exceptionally long open time. Passes NASA low outgassing. Product Description. Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a... [See More]
- Features: High Dielectric; Optical; Thermally Conductive
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Optically clear EP29LPHE is a two component epoxy that has notable toughness along with high elongation, which imparts good impact and shock resistance. It bonds well to a wide variety of substrates including metals, ceramics, glass, optical fibers, graphite and many rubbers and plastics. Its... [See More]
- Features: High Dielectric; Optical; Thermally Conductive
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Features: Optical
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Chemical System: Epoxy
from Novagard Solutions
Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]
- Features: High Dielectric; Optical; UL Rating
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Features: Flame Retardant; Optical
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Silicone
from Electro-Lite Corporation
ELC-4481 optically transparent acrylic with a refractive index of 1.48 is an excellent material for use in fiber optics, lenses tacking and laser applications. Available in 300cps -- 5000cps -- 20,000cps [See More]
- Features: Optical
- Chemical System: Acrylic; Polyurethane
- Form / Shape: Liquid
- Cure / Technology: UV or Radiation Cured
from Epoxies Etc...
20-3302 is a two component, ultra clear epoxy system. It provides excellent optical transmission along with outstanding adhesion and electrical properties. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This... [See More]
- Features: Optical
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound
- Chemical System: Epoxy
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: High Dielectric; Optical; Thermally Conductive; UL Rating; UV resistant
- Form / Shape: Pellets
- Use: Encapsulant, Potting Compound
- Chemical System: Polyamide
from Epoxies Etc...
40-3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. 40-3900 is also well known for its' wide operating temperature... [See More]
- Features: Electrically Conductive; Optical
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Epoxy