Thermal Compound / Interface (Thermally Conductive) Electrical and Electronic Resins

LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Silicone

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

• Features: High Dielectric; Optical; Thermally Conductive
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

CHT ’s AS1802 Black is a 1-part, non-corrosive, neutral cure, thermally conductive, black RTV silicone adhesive sealant. It is one in a range of CHT ’s acetone cure products which are all solvent-free. It features a fast skin over time at 4 minutes. AS1802 Black is designed with... [See More]

• Features: Flame Retardant; Thermally Conductive; UL Rating
• Cure / Technology: Acetone

• Chemical System: Silicone
• Industry: Electronics

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

• Features: High Dielectric; Thermally Conductive; UL Rating
• Form / Shape: Liquid

• Use: Impregnating Resin
• Chemical System: Alkyd

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

• Features: Thermally Conductive
• Chemical System: Metal

• Form / Shape: Sheet or Film
• Industry: Semiconductors, IC's

Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]

• Features: Thermally Conductive
• Chemical System: Flexible Graphite Material

• Form / Shape: Sheet or Film
• Industry: Electronics; Electric Power

Product Description. ER2188 General purpose epoxy potting compound is a two part epoxy resin for general use within the electronics industry. It ’s a good all round resin offering a cost effective solution for a wide range of applications where protection is required. ER2188 is flame retardant... [See More]

• Features: Flame Retardant; Thermally Conductive
• Chemical System: Epoxy

• Use: Encapsulant, Potting Compound
• Cure / Technology: Thermoset

LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Silicone

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

• Features: High Dielectric; Flame Retardant; Thermally Conductive; Airbus standards
• Form / Shape: Liquid

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

CHT ’s AS1802 is a 1-part, gray, non-corrosive, neutral cure, thermally conductive, RTV silicone adhesive sealant. It is one in a range of CHT ’s acetone cure products which are all solvent-free. It features a fast skin over time at 4 minutes. AS1802 is designed with excellent primerless... [See More]

• Features: Thermally Conductive
• Cure / Technology: Acetone

• Chemical System: Silicone
• Industry: Electronics

Thickness of NanoFoil ®: 40 microns. Size of NanoFoil ®: .5 inch squares. Qty Per Bundle: 100 each. NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in... [See More]

• Features: Thermally Conductive
• Chemical System: Metal

• Form / Shape: Sheet or Film
• Industry: Semiconductors, IC's

Product Description. UR5608 hard polyurethane potting compound is a tough resin ideal for applications where thermal shock or temperature cycling is present. It ’s a good all round resin with good thermal conductivity and is flame retardant meeting UL94 V-0. These characteristics make it... [See More]

• Features: Flame Retardant; Thermally Conductive
• Chemical System: Polyurethane

• Use: Encapsulant, Potting Compound; Impregnating Resin
• Industry: Electronics

LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]

• Features: Thermally Conductive
• Chemical System: Graphite

• Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
• Industry: Electronics

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

• Features: High Dielectric; Thermally Conductive; USP Class VI
• Chemical System: Epoxy

• Form / Shape: Grease, Paste
• Cure / Technology: Thermoset

CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]

• Features: Flame Retardant; Thermally Conductive; UL Rating
• Cure / Technology: Alkoxy

• Chemical System: Silicone
• Industry: Electronics

Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]

• Features: Thermally Conductive
• Chemical System: Metal

• Form / Shape: Liquid
• Industry: Semiconductors, IC's

Product Description. SC4010 is a very low viscosity silicone potting and encapsulation compound for the protection of electronic components. Please note: This product has been developed for a specific territory and may not be available locally to you. Please contact your local sales manager for more... [See More]

• Features: Thermally Conductive
• Cure / Technology: Air Setting / Film Drying

• Chemical System: Silicone
• Industry: Electronics

LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]

• Features: Thermally Conductive
• Chemical System: Graphite, Copper, Acrylic

• Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
• Industry: Electronics

Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]

• Features: High Dielectric; Thermally Conductive
• Chemical System: Epoxy

• Form / Shape: Liquid; Powder
• Cure / Technology: Thermoset

CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]

• Features: Flame Retardant; Thermally Conductive; UL Rating
• Cure / Technology: Addition

• Use: Encapsulant, Potting Compound
• Industry: Electronics

Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered as a... [See More]

• Features: Thermally Conductive
• Chemical System: Metal

• Form / Shape: Sheet or Film
• Industry: Semiconductors, IC's

Product Description. HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. They... [See More]

• Features: Thermally Conductive
• Use Temperature: -58 to 266

• Industry: Electronics
• Thermal Conductivity: 0.9000

LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]

• Features: Thermally Conductive; UL Rating
• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts

• Use: Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

• Features: High Dielectric; Thermally Conductive; NASA Low Outgassing
• Form / Shape: Liquid

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
• Chemical System: UV Curing

CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]

• Features: Flame Retardant; Thermally Conductive; UL Rating
• Industry: Electronics

• Cure / Technology: Addition
• Composition: Two Component  

Several very low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are finding increased use in various applications as a replacement for toxic mercury, which has a high vapor pressure at room temperature. These alloys have reduced toxicity and lower... [See More]

• Features: Thermally Conductive
• Chemical System: Metal

• Form / Shape: Liquid
• Industry: Semiconductors, IC's

Product Description. ER6007 is a two-part modified silicone potting compound / encapsulating resin designed for the protection of electronic devices or components. It has been formulated as a soft silicone resin allowing it to be easily repairable while offering the same levels of protection you... [See More]

• Features: Thermally Conductive
• Chemical System: Epoxy; Silicone

• Use: Encapsulant, Potting Compound
• Industry: Electronics

LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Silicone

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

• Features: Electrically Conductive; Thermally Conductive; NASA Low Outgassing
• Form / Shape: Grease, Paste

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]

• Features: Flame Retardant; Thermally Conductive; UL Rating
• Cure / Technology: Addition

• Use: Encapsulant, Potting Compound
• Industry: Electronics

Indium Corporation ’s Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in electronic devices. Thermal conductance for high power devices – with densities in excess of 1000 watts. End-of-life performance at the thermal interface – to avoid failures... [See More]

• Features: Thermally Conductive
• Chemical System: Metal

• Form / Shape: Sheet or Film
• Industry: Semiconductors, IC's

Product Description. TCOR RTV Thermally Conductive Oxime is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture. The product offers a high degree of thermal conductivity and is suitable for use over a very wide temperature range, making it ideal for a... [See More]

• Features: Thermally Conductive
• Chemical System: Silicone

• Use: Gap Filler, Foam in Place Gasket
• Cure / Technology: Reactive or Moisture Cured

LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]

• Features: Thermally Conductive; UL Rating
• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts

• Use: Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

• Features: High Dielectric; Thermally Conductive; NASA Low Outgassing
• Form / Shape: Liquid

• Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

• Features: Thermally Conductive
• Chemical System: Metal

• Form / Shape: Sheet or Film
• Industry: Semiconductors, IC's

Product Description. HTS Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive interface material which will operate over a wide temperature range. Electrolube Heat Transfer Compound is recommended where the... [See More]

• Features: Thermally Conductive
• Chemical System: Silicone

• Use: Gap Filler, Foam in Place Gasket
• Industry: Electronics

LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Silicone

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

• Features: Electrically Conductive; Thermally Conductive
• Form / Shape: Liquid

• Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy; Polyphenylene Sulfide

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

• Features: Thermally Conductive
• Chemical System: Metal

• Form / Shape: Sheet or Film
• Industry: Semiconductors, IC's

Product Description. UR5044 flame retardant polyurethane resin is a UL94 approved two part system has been developed for potting and encapsulation of electronics. Once cured it has a dark blue finish and is soft enough that it can be dug out if required for rework and repair. Its flexibility and its... [See More]

• Features: Flame Retardant; Thermally Conductive
• Industry: Electronics

• Chemical System: Polyurethane
• Composition: Two Component  

LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Silicone

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

• Features: High Dielectric; Thermally Conductive
• Chemical System: Epoxy

• Use: Encapsulant or Conformal Coating
• Cure / Technology: Thermoset

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

• Features: Thermally Conductive
• Chemical System: Metal

• Form / Shape: Sheet or Film
• Industry: Semiconductors, IC's

Product Description. ER2183 Thermally conductive epoxy potting compound is an epoxy resin which meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission. It is a low viscosity alternative to ER2220 system which is ideal for potting and... [See More]

• Features: Flame Retardant; Thermally Conductive
• Chemical System: Epoxy

• Use: Encapsulant, Potting Compound
• Cure / Technology: Thermoset

LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Silicone

• Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
• Industry: Electronics

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

• Features: High Dielectric; Flame Retardant; Thermally Conductive; Airbus Standards
• Form / Shape: Liquid

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

• Features: Thermally Conductive
• Chemical System: Metal

• Form / Shape: Sheet or Film
• Industry: Semiconductors, IC's

Product Description. ER2221 thermally conductive epoxy potting compound has been formulated as high temperature resistant and thermally conductive encapsulation resin which retains excellent characteristics throughout thermal cycling. ER2221 exhibits excellent thermal resistance up to an operating... [See More]

• Features: Thermally Conductive
• Chemical System: Epoxy

• Use: Encapsulant, Potting Compound
• Cure / Technology: Thermoset

Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]

• Features: Thermally Conductive; UL Rating
• Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts

• Use: Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

• Features: High Dielectric; Thermally Conductive; ISO 10993-5
• Form / Shape: Liquid

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]

• Features: Thermally Conductive
• Cure / Technology: Solder

• Form / Shape: Sheet or Film; Ribbon
• Industry: Semiconductors, IC's

Product Description. UR5097 thermally conductive polyurethane potting compound exhibits excellent thermal conductivity making it ideal for applications where heat dissipation is required. The cured resin is resistant to a wide or cycling temperature range making it an ideal choice for applications... [See More]

• Features: Flame Retardant; Thermally Conductive
• Chemical System: Polyurethane

• Use: Encapsulant, Potting Compound
• Industry: Electronics

LiPOLY T-work 8000 is a high performance thermally conductive interface pad. T-work 8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work 8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an... [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Silicone

• Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
• Industry: Electronics

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

• Features: High Dielectric; Optical; Thermally Conductive
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound
• Chemical System: Silicone

LiPOLY T-work 9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work 9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Silicone

• Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
• Industry: Electronics

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

• Features: High Dielectric; Thermally Conductive
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

LiPOLY Non-Silicone Thermal Compound N700A/B is made of non-silicon resin material and none low-molecular-weight siloxane. N700A/B helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Non-Silicone

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

• Features: High Dielectric; Optical; Thermally Conductive; NASA Low Outgassing
• Form / Shape: Liquid

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

Non-Silicone Thermal Compound N700C is made of non-silicon resin material and none low-molecular-weight siloxane. N700C helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is 5.0W/m*K. [See More]

• Features: Thermally Conductive
• Chemical System: Non-Silicone

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

• Features: High Dielectric; Thermally Conductive
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]

• Features: Thermally Conductive
• Chemical System: Non-Silicone

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

• Features: High Dielectric; Optical; Thermally Conductive; NASA Low Outgassing
• Form / Shape: Liquid

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot. [See More]

• Features: Thermally Conductive
• Chemical System: Non-Silicone

• Form / Shape: Syringe/Cartridge/Pale
• Industry: Electronics

EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]

• Features: High Dielectric; Thermally Conductive; NASA low outgassing
• Form / Shape: Liquid

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar... [See More]

• Features: Thermally Conductive
• Form / Shape: Syringe/Cartridge

• Use: Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]

• Features: High Dielectric; Thermally Conductive
• Form / Shape: Liquid

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

LiPOLY ’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It... [See More]

• Features: Thermally Conductive
• Form / Shape: Gel; Grease, Paste

• Use: Die Bonding Adhesives
• Chemical System: Silicone

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

• Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
• Form / Shape: Grease, Paste

• Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

LiPOLY ’s PK223 is a material designed for gap filling. The thermal conductivity is 2.0W/m*K. The hardness is Shore 00/30 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

• Features: Thermally Conductive; UL Rating
• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts

• Use: Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU •in/ft2 •hr • °F [1.44-1.73 W/m •K] while maintaining excellent electrical insulation properties. It is well suited for bonding dissimilar substrates and performs well when subjected to thermal... [See More]

• Features: High Dielectric; Thermally Conductive
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

• Form / Shape: Grease, Paste
• Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power

LiPOLY ’s PK404 is a material designed for gap filling. The thermal conductivity is 4.0W/m*K. The hardness is Shore 00/40 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

• Features: Thermally Conductive; UL Rating
• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts

• Use: Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]

• Features: High Dielectric; Thermally Conductive; ISO 10993-5
• Chemical System: Polyolefin

• Form / Shape: Liquid; Primer
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]

• Features: Thermally Conductive
• Form / Shape: Liquid

• Use: Encapsulant or Conformal Coating
• Industry: Electronics

Gap Pad ® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance. The conformable and elastic nature of Gap Pad ® 1000HD allows excellent... [See More]

• Features: Thermally Conductive

• Industry: Electronics

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

• Features: Electrically Conductive; Thermally Conductive
• Form / Shape: Liquid

• Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
• Chemical System: Silicone

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

• Features: Thermally Conductive
• Chemical System: Silicone

• Form / Shape: Grease, Paste
• Industry: Semiconductors, IC's; Electronics; Electric Power

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

• Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound
• Cure / Technology: Thermoset

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

• Features: Thermally Conductive
• Chemical System: Synthetic Based

• Form / Shape: Grease, Paste
• Cure / Technology: Air Setting / Film Drying

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

• Features: Thermally Conductive
• Chemical System: Silicone

• Use: Encapsulant, Potting Compound
• Industry: Electronics

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

• Features: Flame Retardant; Thermally Conductive; UL Rating
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound
• Chemical System: Epoxy

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

• Features: High Dielectric; Optical; Thermally Conductive
• Form / Shape: Grease, Paste

• Use: Encapsulant, Potting Compound
• Chemical System: Epoxy

Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]

• Features: Electrically Conductive; Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

High fired strength, dense ceramics [See More]

• Features: High Dielectric; Thermally Conductive
• Form / Shape: Liquid

• Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
• Cure / Technology: Thermoset

The new Gap Pad 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensative applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad 1000SF is reinforced for easy material handling and... [See More]

• Features: Thermally Conductive

• Industry: Electronics

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

• Features: Electrically Conductive; Thermally Conductive
• Form / Shape: Grease, Paste

• Use: Die Bonding Adhesives
• Chemical System: Epoxy

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

• Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound
• Cure / Technology: Thermoset

ELASTOSIL ® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. [See More]

• Features: Thermally Conductive
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound
• Chemical System: Silicone

20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

• Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound
• Chemical System: Polyurethane

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

• Features: Electrically Conductive; Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]

• Features: High Dielectric; Electrically Conductive; Thermally Conductive
• Cure / Technology: Room Temperature Vulcanizing or Curing

• Form / Shape: Grease, Paste
• Industry: Electronics

Gap Pad ® 1450 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a permanent liner, which facilitates rework and improves puncture resistance and handling characteristics. The un-lined side of Gap Pad ® 1450 maintains a conformable, yet... [See More]

• Features: Thermally Conductive

• Industry: Electronics

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

• Features: High Dielectric; Thermally Conductive
• Form / Shape: Liquid

• Use: Die Bonding Adhesives
• Chemical System: Epoxy

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

• Features: Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial... [See More]

• Features: Thermally Conductive

• Industry: Electronics

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

• Features: High Dielectric; Thermally Conductive
• Form / Shape: Gel

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

• Features: Electrically Conductive; Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for good compliance to mating... [See More]

• Features: Thermally Conductive

• Industry: Electronics

MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]

• Features: Electrically Conductive; Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad 1500S30 maintains a conformable, yet elastic nature that provides excellent interfacing and... [See More]

• Features: Thermally Conductive

• Industry: Electronics

MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]

• Features: Electrically Conductive; Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography,... [See More]

• Features: Thermally Conductive

• Industry: Electronics

MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]

• Features: Electrically Conductive; Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad 2200SF is reinforced for easy material handling and added... [See More]

• Features: Thermally Conductive

• Industry: Electronics

MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

• Features: Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Gap Pad ® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad ® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap Pad ® 2202SF is specifically designed for... [See More]

• Features: Thermally Conductive

• Industry: Electronics

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

• Features: Electrically Conductive; Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Gap Pad ® 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. Gap Pad ® 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap Pad ® 3004SF is designed for applications that are silicone-sensitive. [See More]

• Features: Thermally Conductive

• Industry: Electronics

TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for thermally conductive... [See More]

• Features: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone

Gap Pad ® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. The enhanced... [See More]

• Features: Thermally Conductive

• Industry: Electronics

Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

• Features: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone

Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability.The fiberglass reinforcement provides easy handling and converting, added electrical isolation and... [See More]

• Features: Thermally Conductive

• Industry: Electronics

Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

• Features: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone

Gap Pad A2000 acts as a thermal interface and electrical insulator between electrical components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil... [See More]

• Features: Thermally Conductive

• Industry: Electronics

Momentive SnapSIL TN3085 is a thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature to form an elastic, flame retardant silicone rubber. It offers primerless adhesion to many substrates. Designed for bonding applications in power supplies, securing PCB's to... [See More]

• Features: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone

Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad A3000 has a reinforcement layer on the dark gold side of the material that assists in... [See More]

• Features: Thermally Conductive

• Industry: Electronics

Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

• Features: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone

Gap Pad EMI 1.0 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI... [See More]

• Features: Thermally Conductive

• Industry: Electronics

Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

• Features: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone

Gap Pad HC 1000 is an extremely conformable, low modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like ” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. [See More]

• Features: Thermally Conductive

• Industry: Electronics

Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]

• Features: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone

Gap Pad ® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is well suited for high performance... [See More]

• Features: Thermally Conductive

• Industry: Electronics

Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]

• Features: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone

Gap Pad VO is a cost effective thermally conductive interface. The material is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling. The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat... [See More]

• Features: Thermally Conductive

• Industry: Electronics

Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. [See More]

• Features: Flame Retardant; Thermally Conductive
• Form / Shape: Grease, Paste

• Use: Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on a rubber-coated fiberglass carrier. The material can be used as an interface where one side is in contact with a... [See More]

• Features: Thermally Conductive

• Industry: Electronics

Momentive TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications. This grade cures quickly upon exposure to heat and adheres well to a wide variety of substrates. Recommended for use as a thermal interface material between dies and heat spreaders,... [See More]

• Features: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -40 to 200

Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low stress vibration dampening and shock absorbing characteristics. Gap Pad VO Ultra Soft is an electrically isolating material,... [See More]

• Features: Thermally Conductive

• Industry: Electronics

Momentive TSE322 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits. Easy to use, one-component material. Fast cure at elevated temperature. Offers self-adhesion properties. [See More]

• Features: High Dielectric; Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone

GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]

• Features: Thermally Conductive
• Form / Shape: Pad

• Use: Gap Filler, Foam in Place Gasket
• Industry: Electronics

TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad range of operating... [See More]

• Features: Thermally Conductive
• Chemical System: Silicone

• Use: Encapsulant, Potting Compound
• Industry: Electronics