Thermal Compound / Interface (Thermally Conductive) Electrical and Electronic Resins

Elecolit® 6603 Thermally Conductive Epoxy 30gm -- PNEL00008
from Techsil Limited

Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
4.0 x 5.0 Micron Foil -- NanoFoil®
from Indium Corporation

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

  • Features: Thermally Conductive
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000
from Epoxy Technology

EPO-TEK ® EK1000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy... [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Features: High Dielectric; Optical; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Features: High Dielectric; Thermally Conductive; UL Rating
  • Form / Shape: Liquid
  • Use: Impregnating Resin
  • Chemical System: Alkyd
MG Chemicals 8331 Silver Conductive Epoxy 115gm -- MGEP00007
from Techsil Limited

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Bundle Kit 40 Microns x .5 Inch Squares -- NanoFoil®
from Indium Corporation

Thickness of NanoFoil ®: 40 microns. Size of NanoFoil ®: .5 inch squares. Qty Per Bundle: 100 each. NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in... [See More]

  • Features: Thermally Conductive
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; Airbus standards
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
MG Chemicals Med Cure Thermal Epoxy Adhesive 6ml -- MGEP00014
from Techsil Limited

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Features: Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Engineered Solder Materials -- Indalloy® Alloys Liquid at Room Temperature
from Indium Corporation

Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]

  • Features: Thermally Conductive
  • Chemical System: Metal
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black
from Master Bond, Inc.

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

  • Features: High Dielectric; Thermally Conductive; USP Class VI
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
MG Chemicals Silver Conductive Epoxy (10 Min) 14gm -- MGEP00006
from Techsil Limited

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Indium Thermal Interface Materials (TIM)
from Indium Corporation

Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered as a... [See More]

  • Features: Thermally Conductive
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126
from Master Bond, Inc.

Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]

  • Features: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Shape: Liquid; Powder
  • Cure / Technology: Thermoset
MG Chemicals Silver Conductive Epoxy (10 Min) 19gm -- MGEP00004
from Techsil Limited

MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Liquid Metal Thermal Interface Material
from Indium Corporation

Several very low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are finding increased use in various applications as a replacement for toxic mercury, which has a high vapor pressure at room temperature. These alloys have reduced toxicity and lower... [See More]

  • Features: Thermally Conductive
  • Chemical System: Metal
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Features: High Dielectric; Thermally Conductive; NASA Low Outgassing
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: UV Curing
MG Chemicals Silver Conductive Epoxy (4 Hour) 21gm -- MGEP00005
from Techsil Limited

MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Solder Thermal Interface Materials
from Indium Corporation

Indium Corporation ’s Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in electronic devices. Thermal conductance for high power devices – with densities in excess of 1000 watts. End-of-life performance at the thermal interface – to avoid failures... [See More]

  • Features: Thermally Conductive
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Features: Electrically Conductive; Thermally Conductive; NASA Low Outgassing
  • Form / Shape: Grease, Paste
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
MG Chemicals Silver Conductive Epoxy (4 Hour)125gm -- MGEP00008
from Techsil Limited

MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: .5 Inch Squares - Qty 100 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Features: Thermally Conductive
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Features: High Dielectric; Thermally Conductive; NASA Low Outgassing
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
MG Chemicals Slow Cure Thermal Epoxy Adhesive 6ml -- MGEP00003
from Techsil Limited

MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Features: Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 1 Inch Squares: Qty 50 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Features: Thermally Conductive
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy; Polyphenylene Sulfide
MG Chemicals Thermal Conductive Epoxy 50ml -- MGEP00002
from Techsil Limited

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 1.5 Inch Squares - Qty 20 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Features: Thermally Conductive
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP
from Master Bond, Inc.

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

  • Features: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset
Momentive SilCool TSE3281 G Thermal Silicone 1kg -- MOSI01220
from Techsil Limited

TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for thermally conductive... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 2 Inch Squares: Qty 20 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Features: Thermally Conductive
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; Airbus Standards
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Momentive SnapSIL TN3005 Clear Silicone 310ml -- MOSI01370
from Techsil Limited

Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone
Thermal Interface Materials -- Thermal Interface Ribbon Kit
from Indium Corporation

The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]

  • Features: Thermally Conductive
  • Cure / Technology: Solder
  • Form / Shape: Sheet or Film; Ribbon
  • Industry: Semiconductors, IC's
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Features: High Dielectric; Thermally Conductive; ISO 10993-5
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Momentive SnapSIL TN3005 White Silicone 310ml -- MOSI01371
from Techsil Limited

Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Features: High Dielectric; Optical; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Silicone
Momentive SnapSIL TN3085 Grey Silicone 310ml -- MOSI01362
from Techsil Limited

Momentive SnapSIL TN3085 is a thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature to form an elastic, flame retardant silicone rubber. It offers primerless adhesion to many substrates. Designed for bonding applications in power supplies, securing PCB's to... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Features: High Dielectric; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
Momentive SnapSIL TN3305 Black Silicone 310ml -- MOSI01369
from Techsil Limited

Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Features: High Dielectric; Optical; Thermally Conductive; NASA Low Outgassing
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Momentive SnapSIL TN3305 Clear Silicone 310ml -- MOSI01367
from Techsil Limited

Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Features: High Dielectric; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Momentive SnapSIL TN3705 Black Silicone 310ml -- MOSI01366
from Techsil Limited

Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Features: High Dielectric; Optical; Thermally Conductive; NASA Low Outgassing
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Momentive SnapSIL TN3705 Clear Silicone 310ml -- MOSI01364
from Techsil Limited

Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone
NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance -- EP42-2LV Black
from Master Bond, Inc.

EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]

  • Features: High Dielectric; Thermally Conductive; NASA low outgassing
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Momentive TIA241GF Thermal Gap Filler 3.6kg Kit -- MOSI17211
from Techsil Limited

Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. [See More]

  • Features: Flame Retardant; Thermally Conductive
  • Form / Shape: Grease, Paste
  • Use: Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
New Epoxy Offers Rapid Cures and Chemical Resistance -- EP41S-F
from Master Bond, Inc.

Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]

  • Features: High Dielectric; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Momentive TIA350R Thermal Silicone Adhesive 1.04kg -- MOSI17210
from Techsil Limited

Momentive TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications. This grade cures quickly upon exposure to heat and adheres well to a wide variety of substrates. Recommended for use as a thermal interface material between dies and heat spreaders,... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone
  • Use Temperature: -40 to 200
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Momentive TSE322 Dielectric Silicone Adhesive 1kg -- MOSI01181
from Techsil Limited

Momentive TSE322 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits. Easy to use, one-component material. Fast cure at elevated temperature. Offers self-adhesion properties. [See More]

  • Features: High Dielectric; Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone
One Component Elastomeric System Features Excellent Thermal Conductivity -- X5TC
from Master Bond, Inc.

Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU •in/ft2 •hr • °F [1.44-1.73 W/m •K] while maintaining excellent electrical insulation properties. It is well suited for bonding dissimilar substrates and performs well when subjected to thermal... [See More]

  • Features: High Dielectric; Thermally Conductive
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Grease, Paste
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
Momentive TSE3331 Electronic Potting Silicone 2kg -- MOSI17151
from Techsil Limited

TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad range of operating... [See More]

  • Features: Thermally Conductive
  • Chemical System: Silicone
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
One component primer/adhesive for polyolefins, passes ISO 10993-5 test -- X21Med
from Master Bond, Inc.

Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]

  • Features: High Dielectric; Thermally Conductive; ISO 10993-5
  • Chemical System: Polyolefin
  • Form / Shape: Liquid; Primer
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Techsil® EP25485 Black Flame Retardant Epoxy 5kg -- TESI19080
from Techsil Limited

Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]

  • Features: Flame Retardant; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
One Component Thermally Conductive Epoxy Film -- FL901AO
from Master Bond, Inc.

Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]

  • Features: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Metal Oxide Thickened Dimethyl Silicone Compound -- Bluesil™ V-740
from Bluestar Silicones USA Corp.

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

  • Features: Thermally Conductive
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Features: Flame Retardant; Thermally Conductive; UL Rating
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. [See More]

  • Features: Thermally Conductive
  • Cure / Technology: Thermoset
  • Form / Shape: Grease, Paste
  • Industry: Electronics
Thermal Compound -- TC70
from Nordson EFD

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

  • Features: Thermally Conductive
  • Chemical System: Synthetic Based
  • Form / Shape: Grease, Paste
  • Cure / Technology: Air Setting / Film Drying
Gap Pad 1000HD -- 8806383648769
from Henkel Corporation - Electronics

Gap Pad ® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance. The conformable and elastic nature of Gap Pad ® 1000HD allows excellent... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Flexible Heat Transfer Compound -- EFS-1
from Thermon, Inc

EFS-1 is a preformed flexible heat transfer compound designed for use between plate-type external heating/ cooling coils and process vessels. Thermon ’s heat transfer compounds provide an efficient thermal connection between the coils and the process equipment. By eliminating the air voids... [See More]

  • Features: Thermally Conductive
  • Cure / Technology: Air Setting / Film Drying
  • Form / Shape: Pad
  • Industry: Electric Power
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
Aremco-Seal -- 613
from Aremco Products, Inc.

Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]

  • Features: Thermally Conductive
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Industry: Electronics
Flowable, One-component Silicone Sealant -- CENUSIL® RT 760 CN A/B
from Wacker Chemical Corp.

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

  • Features: Thermally Conductive
  • Chemical System: Silicone
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Thermally Conductive PU Potting Compound -- 20-2366FR
from Epoxies Etc...

20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyurethane
Gap Pad 1000SF -- 8806383747073
from Henkel Corporation - Electronics

The new Gap Pad 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensative applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad 1000SF is reinforced for easy material handling and... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Heat Transfer Compound -- NH Nonhardening
from Thermon, Inc

NH nonhardening heat transfer compound is used where thermal expansion and contraction could break the bond of a hardened compound. Thermon ’s heat transfer compounds provide an efficient thermal connection between the external heating source and the process equipment. Thermon ’s NH... [See More]

  • Features: Thermally Conductive
  • Cure / Technology: Air Setting / Film Drying
  • Form / Shape: Grease, Paste
  • Industry: Electric Power
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/7
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Features: High Dielectric; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Pourable, Addition-Curing RTV-2 Silicone Rubber -- ELASTOSIL® RT675 A/B
from Wacker Chemical Corp.

ELASTOSIL ® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. [See More]

  • Features: Thermally Conductive
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Silicone
Gap Pad 1450 -- 8806384107521
from Henkel Corporation - Electronics

Gap Pad ® 1450 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a permanent liner, which facilitates rework and improves puncture resistance and handling characteristics. The un-lined side of Gap Pad ® 1450 maintains a conformable, yet... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Heat Transfer Compound -- TFK-4 SS
from Thermon, Inc

T-99 is a specialty heat transfer compound formulated to provide exceptional thermal stability and superior bonding strength up to 1832 °F (1000 °C). Maximum exposure temperature 1832 °F (1000 °C) [See More]

  • Features: Thermally Conductive
  • Cure / Technology: Air Setting / Film Drying
  • Form / Shape: Grease, Paste
  • Industry: Electric Power
Epoxy Adhesive -- ANE-20904
from Protavic America, Inc.

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

  • Features: High Dielectric; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Ceramabond -- 890
from Aremco Products, Inc.

Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]

  • Features: High Dielectric; Electrically Conductive; Thermally Conductive
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Form / Shape: Grease, Paste
  • Industry: Electronics
Gap Pad 1500 -- 8806384238593
from Henkel Corporation - Electronics

Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Features: High Dielectric; Thermally Conductive
  • Form / Shape: Gel
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Gap Pad 1500R -- 8806384435201
from Henkel Corporation - Electronics

Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for good compliance to mating... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad 1500S30 -- 8806384533505
from Henkel Corporation - Electronics

Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad 1500S30 maintains a conformable, yet elastic nature that provides excellent interfacing and... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad 2000S40 -- 8806384697345
from Henkel Corporation - Electronics

Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography,... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad 2200SF -- 8806383845377
from Henkel Corporation - Electronics

Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad 2200SF is reinforced for easy material handling and added... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad 2202SF -- 8806383878145
from Henkel Corporation - Electronics

Gap Pad ® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad ® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap Pad ® 2202SF is specifically designed for... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad 3004SF -- 8806384861185
from Henkel Corporation - Electronics

Gap Pad ® 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. Gap Pad ® 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap Pad ® 3004SF is designed for applications that are silicone-sensitive. [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad 3500ULM -- 8806384893953
from Henkel Corporation - Electronics

Gap Pad ® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. The enhanced... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad 5000S35 -- 8806384959489
from Henkel Corporation - Electronics

Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability.The fiberglass reinforcement provides easy handling and converting, added electrical isolation and... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad A2000 -- 8806384664577
from Henkel Corporation - Electronics

Gap Pad A2000 acts as a thermal interface and electrical insulator between electrical components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad A3000 -- 8806384828417
from Henkel Corporation - Electronics

Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad A3000 has a reinforcement layer on the dark gold side of the material that assists in... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad EMI 1.0 -- 8807037599745
from Henkel Corporation - Electronics

Gap Pad EMI 1.0 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad HC1000 -- 8806383976449
from Henkel Corporation - Electronics

Gap Pad HC 1000 is an extremely conformable, low modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like ” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad HC3.0 -- 8806384009217
from Henkel Corporation - Electronics

Gap Pad ® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is well suited for high performance... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad VO -- 8806383550465
from Henkel Corporation - Electronics

Gap Pad VO is a cost effective thermally conductive interface. The material is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling. The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad VO Soft -- 8806383484929
from Henkel Corporation - Electronics

Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on a rubber-coated fiberglass carrier. The material can be used as an interface where one side is in contact with a... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad VO Ultra Soft -- 8806383616001
from Henkel Corporation - Electronics

Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low stress vibration dampening and shock absorbing characteristics. Gap Pad VO Ultra Soft is an electrically isolating material,... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Gap Pad VO Ultra Soft Black -- 8806383583233
from Henkel Corporation - Electronics

Gap Pad VO Ultra Soft-B is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Gap Pad VO Ultra Soft-B is an electrically isolating... [See More]

  • Features: Thermally Conductive
  • Industry: Electronics
Thermal Interface Material -- GAP PAD HC 5.0
from Henkel Corporation - Electronics

GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]

  • Features: Thermally Conductive
  • Form / Shape: Pad
  • Use: Gap Filler, Foam in Place Gasket
  • Industry: Electronics