Thermoplastic / Hot Melt Electrical and Electronic Resins

11 Results
Macromelt 6211 (Known as MACROMELT 6211) -- 8802588229633
from Henkel Corporation - Electronics

Known as MACROMELT 6211 ). Macromelt ® 6211 ™ is a polyamide hot melt adhesive that exhibits excellent low temperature flexibility. This product is suitable for bonding plastics, metal, flexible vinyl, and ABS. It is an excellent adhesive for telecommunication and power cables. It is... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Industry: Electronics
Polyurethane Hot Melt -- KHB8636
from Chemence Inc.

Krylex KHB8636 is a one component reactive polyurethane hot melt. It is solid at room temperature. It is a poly-battery assembly adhesive. After being applied warm the product will cool to allow immediate handling. Upon further exposure to ambient humidity Krylex KHB8636 will achieve high strength... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Form / Shape: Pellets
  • Use: Die Bonding Adhesives
  • Chemical System: Polyurethane
Reactive polyurethane Moisture curing Hot Melt Adhesive -- DM-6538
from Shenzhen DeepMaterial Technologies Co., Ltd

Easy to repair, fast curing, high elongation, low hardness. [See More]

  • Cure / Technology: Reactive or Moisture Cured; Thermoplastic / Hot Melt
  • Industry: Electronics
  • Use: Encapsulant or Conformal Coating
  • Use Temperature: -40 to 176
TECHNOMELT AS 8998
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyolefin
UV Thermally Curing Adhesive + heat accelerator -- DM-6425
from Shenzhen DeepMaterial Technologies Co., Ltd

In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable for the reinforcement of printed circuit boards and the bonding of various materials. After curing, the product has excellent flexibility and strength, making it... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt; UV or Radiation Cured
  • Use Temperature: -67 to 302
  • Industry: Electronics
  • Elongation: 218.0
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
TECHNOMELT PA 2692
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyolefin
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
TECHNOMELT PA 668 Clear
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide