Thermoplastic / Hot Melt Electrical and Electronic Resins
from Henkel Corporation - Electronics
Known as MACROMELT 6211 ). Macromelt ® 6211 ™ is a polyamide hot melt adhesive that exhibits excellent low temperature flexibility. This product is suitable for bonding plastics, metal, flexible vinyl, and ABS. It is an excellent adhesive for telecommunication and power cables. It is... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Industry: Electronics
from Chemence Inc.
Krylex KHB8636 is a one component reactive polyurethane hot melt. It is solid at room temperature. It is a poly-battery assembly adhesive. After being applied warm the product will cool to allow immediate handling. Upon further exposure to ambient humidity Krylex KHB8636 will achieve high strength... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Form / Shape: Pellets
- Use: Die Bonding Adhesives
- Chemical System: Polyurethane
from Shenzhen DeepMaterial Technologies Co., Ltd
Easy to repair, fast curing, high elongation, low hardness. [See More]
- Cure / Technology: Reactive or Moisture Cured; Thermoplastic / Hot Melt
- Industry: Electronics
- Use: Encapsulant or Conformal Coating
- Use Temperature: -40 to 176
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Form / Shape: Pellets
- Use: Encapsulant, Potting Compound
- Chemical System: Polyolefin
from Shenzhen DeepMaterial Technologies Co., Ltd
In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable for the reinforcement of printed circuit boards and the bonding of various materials. After curing, the product has excellent flexibility and strength, making it... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; UV or Radiation Cured
- Use Temperature: -67 to 302
- Industry: Electronics
- Elongation: 218.0
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Form / Shape: Pellets
- Use: Encapsulant, Potting Compound
- Chemical System: Polyamide
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Form / Shape: Pellets
- Use: Encapsulant, Potting Compound
- Chemical System: Polyamide
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Form / Shape: Pellets
- Use: Encapsulant, Potting Compound
- Chemical System: Polyamide
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Form / Shape: Pellets
- Use: Encapsulant, Potting Compound
- Chemical System: Polyolefin
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Form / Shape: Pellets
- Use: Encapsulant, Potting Compound
- Chemical System: Polyamide
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Form / Shape: Pellets
- Use: Encapsulant, Potting Compound
- Chemical System: Polyamide