Encapsulant / Potting Compound Electrical and Electronic Resins

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

• Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

• Form / Shape: Liquid
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Addition Cure

CHT's QSil 12 is a 2-part, condensation cure, transparent, low viscosity, liquid silicone elastomer which cures at room temperature. QSil 12 is primarily intended for electronic and lighting potting applications. This material is typically mixed at a ratio of 100:5. Once mixed, the material is... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Cure / Technology: Condensation
• Composition: Two Component  

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy [See More]

• Use: Encapsulant, Potting Compound
• Cure / Technology: Heat Curing

• Chemical System: Epoxy
• Industry: Semiconductors, IC's; Electronics

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Thermoset

CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep Section Catalyst by... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Cure / Technology: Condensation
• Composition: Two Component  

It is a conformal coating designed to provide strong protection from moisture and harsh chemicals. Compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
• Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured

• Chemical System: Acrylic
• Industry: Electronics

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
• Chemical System: UV Curing

• Form / Shape: Liquid
• Cure / Technology: UV or Radiation Cured; Dual Curing

CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The chemical composition... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Cure / Technology: Addition
• Composition: Two Component  

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

• Form / Shape: Grease, Paste
• Cure / Technology: Thermoset; Addition Cure

CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Cure / Technology: Addition
• Composition: Two Component  

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

• Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Thermoset

CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Cure / Technology: Addition
• Composition: Two Component  

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

• Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy; Polyphenylene Sulfide

• Form / Shape: Liquid
• Cure / Technology: Thermoset

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Silicone

• Form / Shape: Liquid
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The reccommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Cure / Technology: Thermoset

• Form / Shape: Liquid
• Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

• Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

• Form / Shape: Liquid
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Thermoset

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

• Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Thermoset

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Thermoset

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

• Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Thermoset

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]

• Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Thermoset

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]

• Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Semiconductors, IC's; Electronics; Electric Power

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
• Cure / Technology: Thermoset; UV or Radiation Cured

• Form / Shape: Liquid
• Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

• Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
• Chemical System: Silicone

• Form / Shape: Liquid
• Cure / Technology: Thermoset

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone
• Features: Thermally Conductive

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: UV or Radiation Cured

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

• Use: Die Bonding Adhesives; Encapsulant, Potting Compound
• Chemical System: Cyanoacrylate

• Form / Shape: Liquid
• Cure / Technology: Anaerobic; Reactive or Moisture Cured; UV or Radiation Cured

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

• Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
• Chemical System: Silicone

• Form / Shape: Liquid
• Cure / Technology: Reactive or Moisture Cured; Thermoset

Developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol ® UV dam encapsulants, such as Hysol 3323. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55... [See More]

• Use: Encapsulant, Potting Compound
• CTE: 25

• Industry: Electronics
• Viscosity: 8000

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Epoxy

• Form / Shape: Gel
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

• Use: Encapsulant, Potting Compound
• Cure / Technology: Thermoset

• Form / Shape: Liquid
• Industry: Electronics

MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely resistant to... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Epoxy

Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Silicone

• Form / Shape: Grease, Paste
• Industry: Electronics

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
• Chemical System: Polyurethane

• Form / Shape: Liquid
• Cure / Technology: Thermoset

WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Silicone

• Form / Shape: Liquid
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

KSC12028 is a silicone RTV gel developed for electronic applications requiring a re-penetrable self-sealing, silicone gel product. KSC12028 is a two part, solvent free, 1:1 mix ratio silicone that when mixed cures in 12 hours at room temperature. Alternatively, KSC12028 can be cured in approximately... [See More]

• Use: Die Bonding Adhesives; Encapsulant, Potting Compound
• Chemical System: Silicone

• Form / Shape: Gel
• Industry: Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Polyolefin

• Form / Shape: Pellets
• Cure / Technology: Thermoplastic / Hot Melt

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

• Use: Encapsulant, Potting Compound
• Cure / Technology: Thermoset

• Form / Shape: Liquid
• Industry: Electronics

MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this two-part epoxy protects... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Epoxy
• Features: Flame Retardant

Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements. [See More]

• Use: Die Bonding Adhesives; Encapsulant, Potting Compound
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Thermoset

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Polyamide

• Form / Shape: Pellets
• Cure / Technology: Thermoplastic / Hot Melt

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Polyurethane

• Form / Shape: Gel
• Cure / Technology: Thermoset

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

• Use: Encapsulant, Potting Compound
• Cure / Technology: Thermoset

• Form / Shape: Liquid
• Industry: Electronics

MG 834FRB is a black, flame retardant potting and encapsulation compound that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Thanks to its low viscosity, MG 834 FRB is the ideal choice when applications require small gaps or... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Epoxy
• Features: Flame Retardant

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Polyamide

• Form / Shape: Pellets
• Cure / Technology: Thermoplastic / Hot Melt

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Epoxy

• Form / Shape: Liquid
• Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

• Use: Encapsulant, Potting Compound
• Cure / Technology: Thermoset

• Form / Shape: Liquid
• Industry: Electronics

MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Epoxy

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Polyamide

• Form / Shape: Pellets
• Cure / Technology: Thermoplastic / Hot Melt

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

• Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Polyurethane

• Form / Shape: Liquid
• Cure / Technology: UV or Radiation Cured

High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]

• Use: Encapsulant, Potting Compound
• Cure / Technology: Thermoset

• Form / Shape: Liquid
• Industry: Electronics

MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Epoxy

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Polyolefin

• Form / Shape: Pellets
• Cure / Technology: Thermoplastic / Hot Melt

Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]

• Use: Encapsulant, Potting Compound
• Cure / Technology: Thermoset

• Form / Shape: Liquid
• Industry: Electronics

RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Polyamide

• Form / Shape: Pellets
• Cure / Technology: Thermoplastic / Hot Melt

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

• Use: Encapsulant, Potting Compound
• Cure / Technology: Thermoset

• Form / Shape: Liquid
• Industry: Electronics

RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep section without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Polyamide

• Form / Shape: Pellets
• Cure / Technology: Thermoplastic / Hot Melt

Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -54 to 260

Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -54 to 260

RTV560 is a silicone rubber compound from Momentive Performance Materials. It offers excellent release properties and also good adhesion capabilities with the use of a primer. This grade with cure at room temperature and retains its elastomeric properties across a wide temperature range. RTV560 is... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -115 to 260

RTV560 is a silicone rubber compound from Momentive Performance Materials. It offers excellent release properties and also good adhesion capabilities with the use of a primer. This grade with cure at room temperature and retains its elastomeric properties across a wide temperature range. RTV560 is... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -115 to 260

Momentive RTV60 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -54 to 260

Momentive RTV60 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -54 to 260

Momentive RTV60 is a two-component high temperature silicone rubber compound. RTV60 cures at room temperature and its composition is free of solvents and solvent odor. Momentive RTV60 offers excellent adhesion capabilities with the use of a primer, excellent release properties and retention of its... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone

RTV615 is crystal clear potting silicone from Momentive Performance materials which is widely known for its optical clarity benefits. Ideal for evaluation in applications such as potting solar cells for maximum light transmission and on electronic assemblies where component identification is... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -60 to 204

RTV615 is crystal clear potting silicone from Momentive Performance materials which is widely known for its optical clarity benefits. Ideal for evaluation in applications such as potting solar cells for maximum light transmission and on electronic assemblies where component identification is... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -60 to 204

RTV615 is crystal clear potting silicone from Momentive Performance materials which is widely known for its optical clarity benefits. Ideal for evaluation in applications such as potting solar cells for maximum light transmission and on electronic assemblies where component identification is... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -60 to 204

RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight or volume. Potential... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -60 to 204

RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight or volume. Potential... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -60 to 204

Momentive TSE325 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits. Easy to use, one-component material. Fast cure at elevated temperature. Offers self-adhesion properties. [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone

TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad range of operating... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Silicone
• Features: Thermally Conductive

Techsil ® VT2420LV is a crystal clear two-part, low viscosity room temperature curing polyurethane resin with high shore hardness. VT2420LV offers excellent outdoor weathering properties, due to the incorporation of both UV resistant base materials and the addition of UV stabilizers and... [See More]

• Use: Encapsulant, Potting Compound
• Industry: Electronics

• Chemical System: Polyurethane

Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]

• Use: Encapsulant, Potting Compound
• Chemical System: Epoxy

• Form / Shape: Liquid
• Industry: Electronics