Encapsulant / Potting Compound Electrical and Electronic Resins

Biocompatible, Spectrally Transparent Epoxy -- EPO-TEK® MED-301
from Epoxy Technology

EPO-TEK ® MED-301 is a Certified ISO 10993, biocompatible, spectrally transparent, very low viscosity, room temperature curing epoxy. Additional characteristics are self-leveling, short pot-life, and ease of application, either by dispensing or manual operation. EPO-TEK ® MED-301 is used... [See More]

  • Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Solder Joint Strengthening Encapsulant -- ALPHA® HiTech™ EN21-4210
from MacDermid Alpha Electronics Solutions

ALPHA ® HiTech ™ EN21-4210 Series of products are one-component epoxy systems designed to encapsulate the chip component thus protecting the device and strengthening the solder joints. These encapsulants prevent chip and IC devices from dropping out. In addition, these protect the chip/die... [See More]

  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Cure at 150°C and Hold for a Minimum of 10 Minutes (Convection Oven)
  • Chemical System: Epoxy
  • Industry: Semiconductors, IC's; Electronics
MG Chemicals Black Encapsulating/Potting Epoxy Kit -- MGEP00009
from Techsil Limited

MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely resistant to... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Epoxy
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Addition Cure
Light Cure Cyanoacrylate Instant Adhesive -- KU3064
from Chemence Inc.

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Cyanoacrylate
  • Form / Shape: Liquid
  • Cure / Technology: Anaerobic; Reactive or Moisture Cured; UV or Radiation Cured
ELAN-Cast® -- E 2154 Black Resin / C 2154 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
UV Epoxy -- EPO-TEK® OG133-8
from Epoxy Technology

EPO-TEK ® OG133-8 is an UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK ®... [See More]

  • Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset; UV or Radiation Cured
MG Chemicals Flame Retardant Potting Epoxy 375ml -- MGEP00013
from Techsil Limited

MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this two-part epoxy protects... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Flame Retardant
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Repenetrable 2 Part RTV Silicone Gel -- KSC12028
from Chemence Inc.

KSC12028 is a silicone RTV gel developed for electronic applications requiring a re-penetrable self-sealing, silicone gel product. KSC12028 is a two part, solvent free, 1:1 mix ratio silicone that when mixed cures in 12 hours at room temperature. Alternatively, KSC12028 can be cured in approximately... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Silicone
  • Form / Shape: Gel
  • Industry: Electronics
MG Chemicals FR Low Viscosity Potting Epoxy 375ml -- MGEP00016
from Techsil Limited

MG 834FRB is a black, flame retardant potting and encapsulation compound that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Thanks to its low viscosity, MG 834 FRB is the ideal choice when applications require small gaps or... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Flame Retardant
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: UV Curing
  • Form / Shape: Liquid
  • Cure / Technology: UV or Radiation Cured; Dual Curing
MG Chemicals Translucent Potting Epoxy 450ml -- MGEP00015
from Techsil Limited

MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Epoxy
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset; Addition Cure
MG Chemicals Translucent Potting Epoxy Kit 375ml -- MGEP00010
from Techsil Limited

MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Epoxy
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Momentive RTV12A Clear Potting Compound 454gm -- MOSI02055
from Techsil Limited

RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy; Polyphenylene Sulfide
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Momentive RTV12A Clear Potting Compound 907gm -- MOSI02056
from Techsil Limited

RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep section without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Momentive RTV31 High Temp Potting Silicone+DBT 1lb -- MOSI02075
from Techsil Limited

Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
  • Use Temperature: -54 to 260
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Momentive RTV31 High Temp Potting Silicone+DBT 2lb -- MOSI02076
from Techsil Limited

Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
  • Use Temperature: -54 to 260
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Momentive RTV560 Red Electronic Silicone +DBT 12lb -- MOSI02088
from Techsil Limited

RTV560 is a silicone rubber compound from Momentive Performance Materials. It offers excellent release properties and also good adhesion capabilities with the use of a primer. This grade with cure at room temperature and retains its elastomeric properties across a wide temperature range. RTV560 is... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
  • Use Temperature: -115 to 260
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Silicone
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Momentive RTV560 Red Electronic Silicone +DBT 1lb -- MOSI02087
from Techsil Limited

RTV560 is a silicone rubber compound from Momentive Performance Materials. It offers excellent release properties and also good adhesion capabilities with the use of a primer. This grade with cure at room temperature and retains its elastomeric properties across a wide temperature range. RTV560 is... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
  • Use Temperature: -115 to 260
High Glass Transition Temperature Epoxy System -- EP62-1
from Master Bond, Inc.

Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The reccommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
Momentive RTV60 Red Electronic Silicone +DBT 1lb -- MOSI02093
from Techsil Limited

Momentive RTV60 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
  • Use Temperature: -54 to 260
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Momentive RTV60 Red Electronic Silicone +DBT 2lb -- MOSI02094
from Techsil Limited

Momentive RTV60 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
  • Use Temperature: -54 to 260
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Momentive RTV60/9811 Red Potting Silicone 250ml -- MOSI02024
from Techsil Limited

Momentive RTV60 is a two-component high temperature silicone rubber compound. RTV60 cures at room temperature and its composition is free of solvents and solvent odor. Momentive RTV60 offers excellent adhesion capabilities with the use of a primer, excellent release properties and retention of its... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Momentive RTV615 Clear FDA Potting Silicone 1.1lb -- MOSI17097
from Techsil Limited

RTV615 is crystal clear potting silicone from Momentive Performance materials which is widely known for its optical clarity benefits. Ideal for evaluation in applications such as potting solar cells for maximum light transmission and on electronic assemblies where component identification is... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
  • Use Temperature: -60 to 204
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Momentive RTV615 Clear FDA Potting Silicone 2.2lb -- MOSI17098
from Techsil Limited

RTV615 is crystal clear potting silicone from Momentive Performance materials which is widely known for its optical clarity benefits. Ideal for evaluation in applications such as potting solar cells for maximum light transmission and on electronic assemblies where component identification is... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
  • Use Temperature: -60 to 204
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Momentive RTV615 Clear FDA Potting Silicone 44lb -- MOSI17175
from Techsil Limited

RTV615 is crystal clear potting silicone from Momentive Performance materials which is widely known for its optical clarity benefits. Ideal for evaluation in applications such as potting solar cells for maximum light transmission and on electronic assemblies where component identification is... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
  • Use Temperature: -60 to 204
NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance -- EP42-2LV Black
from Master Bond, Inc.

EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Momentive RTV627 Grey Potting Silicone 20lb/9.08kg -- MOSI17150
from Techsil Limited

RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight or volume. Potential... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
  • Use Temperature: -60 to 204
New Epoxy Offers Rapid Cures and Chemical Resistance -- EP41S-F
from Master Bond, Inc.

Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Momentive RTV627 Grey Potting Silicone 2lb / 908gm -- MOSI17149
from Techsil Limited

RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight or volume. Potential... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
  • Use Temperature: -60 to 204
One Component Toughened Epoxy System For Bonding And Sealing -- Supreme 17HT
from Master Bond, Inc.

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Momentive TSE325 White Potting Silicone 1kg -- MOSI01201
from Techsil Limited

Momentive TSE325 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits. Easy to use, one-component material. Fast cure at elevated temperature. Offers self-adhesion properties. [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Momentive TSE3331 Electronic Potting Silicone 2kg -- MOSI17151
from Techsil Limited

TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad range of operating... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
  • Features: Thermally Conductive
One component, high temperature resistant epoxy system for bonding and sealing -- EP17HTDA-1
from Master Bond, Inc.

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Techsil VT2420LV Clear Potting Polyurethane 250gm -- TEEP14085
from Techsil Limited

Techsil ® VT2420LV is a crystal clear two-part, low viscosity room temperature curing polyurethane resin with high shore hardness. VT2420LV offers excellent outdoor weathering properties, due to the incorporation of both UV resistant base materials and the addition of UV stabilizers and... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Polyurethane
One Component, Storage Stable Epoxy -- EP19HT
from Master Bond, Inc.

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Techsil® EP25485 Black Flame Retardant Epoxy 5kg -- TESI19080
from Techsil Limited

Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Industry: Electronics
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
  • Cure / Technology: Thermoset; UV or Radiation Cured
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
734 Flowable Sealant -- 734CL300ML CRT [734CL300ML CRT from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

10.1 oz Cartridge; Clear; One Part RTV Liquid; Cures At Room Temperature; Not For Use on Vertical Or Overhead Surfaces [See More]

  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Cure By Acetic Acid
  • Form / Shape: Liquid
  • Industry: Electronics
Electrical Encapsulation System -- VORATRON®
from Dow Polyurethanes

Energy has always had a special bond with Dow. Over 110 years ago, our company was founded when Herbert Dow used electricity to create bromine and chlorine from salt – a process still in use. Today, we ’re one of the largest suppliers of solutions that protect, conserve and manage energy... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electric Power
  • Chemical System: Epoxy; Polyurethane
Sil-Bond™ -- 905
from Aremco Products, Inc.

Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Industry: Electronics
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Electronics
Flowable, One-component Silicone Sealant -- CENUSIL® RT 760 CN A/B
from Wacker Chemical Corp.

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
  • Chemical System: Silicone
  • Features: Thermally Conductive
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: UV or Radiation Cured
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Gel
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Heat Curing Electronic Coating Silicone Compound -- Bluesil™ V-207
from Bluestar Silicones USA Corp.

Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone
  • Form / Shape: Liquid
  • Cure / Technology: Reactive or Moisture Cured; Thermoset
Hysol 3329 -- 8802594848769
from Henkel Corporation - Electronics

Developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol ® UV dam encapsulants, such as Hysol 3323. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55... [See More]

  • Use: Encapsulant, Potting Compound
  • CTE: 25
  • Industry: Electronics
  • Viscosity: 8000
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
734 Flowable Sealant -- 734CL90ML TUBE [734CL90ML TUBE from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

3 oz Tube; Clear; One Part RTV Liquid; Cures At Room Temperature; Not For Use on Vertical Or Overhead Surfaces [See More]

  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Cure By Acetic Acid
  • Form / Shape: Liquid
  • Industry: Electronics
Di-Pak™ E-4500 Elastomeric Eletrical Insulating Compound -- E-4540
from Hapco, Inc.

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Electronics
Silicone Elastomer Gel Encapsulant And Potting Compound -- SilGel® 612 A/B
from Wacker Chemical Corp.

WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Silicone
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Epoxy Adhesive & Potting Compound -- 10-3009
from Epoxies Etc...

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
TECHNOMELT AS 8998
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyolefin
  • Form / Shape: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Polyurethane
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Di-Pak™ E-4600 Elastomeric Eletrical Insulating Compound -- E-4650
from Hapco, Inc.

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Electronics
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyurethane
  • Form / Shape: Gel
  • Cure / Technology: Thermoset
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
  • Form / Shape: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Epoxy Adhesive -- ANE-46505
from Protavic America, Inc.

Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements. [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Electronics
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
TECHNOMELT PA 2692
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
  • Form / Shape: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4888
from Hapco, Inc.

High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]

  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Electronics
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Polyurethane
  • Form / Shape: Liquid
  • Cure / Technology: UV or Radiation Cured
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
  • Form / Shape: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4901-2
from Hapco, Inc.

Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]

  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Electronics
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyolefin
  • Form / Shape: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4200
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Electronics
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
  • Form / Shape: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
TECHNOMELT PA 668 Clear
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
  • Form / Shape: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt