Pad Electrical and Electronic Resins
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Form / Shape: Pad
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Form / Shape: Pad
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Form / Shape: Pad
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Form / Shape: Pad
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Form / Shape: Pad
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Use: Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Form / Shape: Pad
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Use: Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Form / Shape: Pad
- Features: Thermally Conductive
- Industry: Electronics
- Use Temperature: ? to 320
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Use: Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Form / Shape: Pad
- Features: Thermally Conductive
- Industry: Electronics
- Use Temperature: ? to 320
from Shiu Li Technology Co., Ltd
LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Form / Shape: Pad
- Features: Thermally Conductive
- Industry: Electronics
- Use Temperature: ? to 320
from Shiu Li Technology Co., Ltd
LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Form / Shape: Pad
- Features: Thermally Conductive
- Industry: Electronics
- Use Temperature: ? to 320
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Use: Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Form / Shape: Pad
- Features: Thermally Conductive
- Industry: Electronics
- Use Temperature: ? to 320
from Shiu Li Technology Co., Ltd
LiPOLY Non-Silicone Thermal Compound N700A/B is made of non-silicon resin material and none low-molecular-weight siloxane. N700A/B helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Non-Silicone
- Features: Thermally Conductive; UL Rating
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Form / Shape: Pad
- Features: Thermally Conductive
- Industry: Electronics
- Use Temperature: ? to 320
from Shiu Li Technology Co., Ltd
Non-Silicone Thermal Compound N700C is made of non-silicon resin material and none low-molecular-weight siloxane. N700C helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is 5.0W/m*K. [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Non-Silicone
- Features: Thermally Conductive
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Form / Shape: Pad
- Features: Thermally Conductive
- Industry: Electronics
- Use Temperature: ? to 320
from Shiu Li Technology Co., Ltd
Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Non-Silicone
- Features: Thermally Conductive
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m ·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in ²/W at 50psi, ensuring... [See More]
- Form / Shape: Pad
- Features: Thermally Conductive
- Industry: Electronics
from Shiu Li Technology Co., Ltd
Non-Silicone Thermal Compound N800C-s is made of non-silicon resin material. No low molecular siloxane volatilization and low total volatile gas, no electrical contact & pollution problems. N800C-s can have low thermal resistance and high thermal conductivity. [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics; Electric Power
- Chemical System: Non-Silicone
- Features: Thermally Conductive
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m ·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in ²/W at 50psi, ensuring... [See More]
- Form / Shape: Pad
- Features: Thermally Conductive
- Industry: Electronics
- Use Temperature: -40 to 257
from Henkel Corporation - Electronics
GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]
- Form / Shape: Pad
- Industry: Electronics
- Use: Gap Filler, Foam in Place Gasket
- Features: Thermally Conductive
from Ohmite Manufacturing Co.
Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]
- Form / Shape: Pad
- Industry: Electronics; Electric Power
- Chemical System: Flexible Graphite Material
- Features: Thermally Conductive