Pad Electrical and Electronic Resins

Thermal Interface Material -- GAP PAD HC 5.0
from Henkel Corporation - Electronics

GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]

  • Form / Shape: Pad
  • Industry: Electronics
  • Use: Gap Filler, Foam in Place Gasket
  • Features: Thermally Conductive
Flexible Heat Transfer Compound -- EFS-1
from Thermon, Inc

EFS-1 is a preformed flexible heat transfer compound designed for use between plate-type external heating/ cooling coils and process vessels. Thermon ’s heat transfer compounds provide an efficient thermal connection between the coils and the process equipment. By eliminating the air voids... [See More]

  • Form / Shape: Pad
  • Industry: Electric Power
  • Cure / Technology: Air Setting / Film Drying
  • Composition: Single Component