Pad Electrical and Electronic Resins

Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]

• Form / Shape: Pad
• Industry: Electronics; Electric Power

• Chemical System: Flexible Graphite Material
• Features: Thermally Conductive

LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

• Chemical System: Silicone
• Features: Thermally Conductive; UL Rating

LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Chemical System: Silicone

• Use: Gap Filler, Foam in Place Gasket
• Industry: Electronics

LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

• Chemical System: Silicone
• Features: Thermally Conductive; UL Rating

LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Chemical System: Silicone

• Use: Gap Filler, Foam in Place Gasket
• Industry: Electronics

LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

• Chemical System: Silicone
• Features: Thermally Conductive; UL Rating

LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

• Chemical System: Silicone
• Features: Thermally Conductive; UL Rating

GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]

• Form / Shape: Pad
• Industry: Electronics

• Use: Gap Filler, Foam in Place Gasket
• Features: Thermally Conductive