Gap Filling Compound Electrical and Electronic Resins
from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Addition Cure
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from MacDermid Alpha Electronics Solutions
Product Description. TCOR RTV Thermally Conductive Oxime is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture. The product offers a high degree of thermal conductivity and is suitable for use over a very wide temperature range, making it ideal for a... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Cure / Technology: Reactive or Moisture Cured
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from MacDermid Alpha Electronics Solutions
Product Description. HTS Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive interface material which will operate over a wide temperature range. Electrolube Heat Transfer Compound is recommended where the... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset; Addition Cure
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy; Polyphenylene Sulfide
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Industry: Electronics
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Grease, Paste; Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Syringe/Cartridge
- Industry: Electronics
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The reccommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Shiu Li Technology Co., Ltd
LiPOLY's NL-putty series is a silicone free, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone Free
- Form / Shape: Gel; Liquid; Syringe/Cartridge/Pale
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY ’s PK223 is a material designed for gap filling. The thermal conductivity is 2.0W/m*K. The hardness is Shore 00/30 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY ’s PK404 is a material designed for gap filling. The thermal conductivity is 4.0W/m*K. The hardness is Shore 00/40 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
- Form / Shape: Grease, Paste; Powder
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY ’s PK605 is a material designed for gap filling. The thermal conductivity is 6.0 W/m*K. The hardness is Shore 00/60 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY ’s PK700 is a material designed for gap filling. The thermal conductivity is 7.0 W/m*K. The hardness is Shore 00/55 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY HC-93 is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P,... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY SP is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P, diode,... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY TP200 is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P,... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Shiu Li Technology Co., Ltd
AS17 is an advanced insulation material composed of a fiber composite made from porous silica, aluminum nitride, and other materials, with an extremely low thermal conductivity of 0.028 W/m·K. AS17 is notable for its ability to prevent thermal runaway, its ultra-low density, and its high-temperature... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: High Dielectric; Thermal Insulation
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
AS27 is an advanced insulation material composed of nanoscale porous silica, carbon, and other materials, with an extremely low thermal conductivity of 0.009 W/m·K, making it one of the lowest-known thermal conductivity solid materials. AS27 is renowned for its ultra-low density, exceptional thermal... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Features: High Dielectric; Thermal Insulation
from Master Bond, Inc.
Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY AS200 is a thermally conductive gel designed for gap filling. The thermal conductivity is 2.0 W/m*K. The hardness is Shore 00/30, with high flexibility and compressibility. AS200 has ultra-low oil bleeding properties, which helps reduce pollutants from silicon oil, keeping electronic... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Master Bond, Inc.
Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY AS400 is a thermally conductive gel designed for gap filling. The thermal conductivity is 4.0 W/m*K. The hardness is Shore 00/45, with high flexibility and compressibility. AS400 has ultra-low oil bleeding properties, which helps reduce pollutants from silicon oil, keeping electronic... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Techsil Limited
Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Industry: Electronics
from Epoxies Etc...
10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond polyester mesh to aluminum frames and... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Gel
- Cure / Technology: Thermoset
from Chemence Inc.
KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure... [See More]
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Industry: Electronics
from Acoustical Solutions, Inc.
FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
- Form / Shape: Grease, Paste
- Composition: Single Component
from Henkel Corporation - Electronics
DC0114 epoxy underfill is suitable for high reliability applications due to its combination of properties. It can be applied to ceramic or organic substrates, including solder masks and polyimide. [See More]
- Use: Gap Filler, Foam in Place Gasket
- CTE: 39
- Industry: Electronics
- Viscosity: 20000
from Wacker Chemical Corp.
SEMICOSIL ® 962 TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft, flexible and tacky rubber with excellent thermal conductivity. [See More]
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Gel
- Cure / Technology: Air Setting / Film Drying; Thermoset
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Industry: Electronics
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Polyurethane
- Form / Shape: Liquid
- Cure / Technology: UV or Radiation Cured
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Acoustical Solutions, Inc.
SSP Firestop Putty is perfect for metallic conduits, telephone, data or electrical power cable penetrations. A variety of sleeved and non-sleeved applications have been tested and proven providing the ultimate in installation versatility. Non-hardening and reusable, SSP Firestop Putty addresses the... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
- Form / Shape: Grease, Paste
- Composition: Single Component
from Henkel Corporation - Electronics
GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
- Form / Shape: Pad
- Features: Thermally Conductive
from Epoxies Etc...
20-2100 FR is a two component, room temperature curing, low viscosity polyurethane system for potting, casting, encapsulating and sealing electronic components and assemblies. 20-2100 FR is a flame retardant self extinguishing system. It meets the stringent requirements of UL 94-VO. Designed for... [See More]
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Polyurethane
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset