Powder Electrical and Electronic Resins

7 Results
Thermal Paste for Electronics -- Electrolube ® HTC Non-Silicone Thermal Interface Material
from MacDermid Alpha Electronics Solutions

Product Overview. HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and reliable thermal coupling of electrical and electronic components, or between any surfaces where thermal conductivity or heat dissipation is important. It is ideal for application... [See More]

  • Form / Shape: Grease, Paste; Powder
  • Industry: Semiconductors, IC's; Electronics
  • Chemical System: Silicone
  • Features: Thermally Conductive
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Form / Shape: Grease, Paste; Powder
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Impregnating Resin
  • Cure / Technology: Thermoset
Thermal Paste for Electronics -- Electrolube ® HTCP Non-Silicone Transfer Compound Plus
from MacDermid Alpha Electronics Solutions

Product Overview. HTCP Non-Silicone Thermal Interface Material is a "Plus" version of Electrolube ’s successful HTC, offering ultimate thermal conductivity along with the benefits of a non-silicone base oil. The exceptional properties of HTCP result from the novel use of various metal oxide... [See More]

  • Form / Shape: Grease, Paste; Powder
  • Industry: Semiconductors, IC's; Electronics
  • Chemical System: Silicone
  • Features: High Dielectric; Thermally Conductive
Two Component Toughened Epoxy Adhesive -- EP126
from Master Bond, Inc.

Master Bond Polymer System EP126 is a two component toughened epoxy resin based high temperature resistant adhesive system with continuous service capability at 500 °F and outstanding chemical resistance. This unique high performance epoxy adhesive compound can also withstand temperatures as... [See More]

  • Form / Shape: Liquid; Powder
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Thermal Paste for Electronics -- Electrolube ® HTS Silicone Heat Transfer Compound
from MacDermid Alpha Electronics Solutions

Product Overview. HTS Silicone Heat Transfer Compound is a metal oxide-filled silicone oil, providing an extremely efficient and thermally conductive interface material that operates over a wide temperature range. Electrolube Heat Transfer Compound is recommended for achieving efficient and reliable... [See More]

  • Form / Shape: Grease, Paste; Powder
  • Industry: Semiconductors, IC's; Electronics
  • Chemical System: Silicone
  • Composition: Filled
Thermal Paste for Electronics -- Electrolube ® HTSP Silicone Heat Transfer Compound Plus
from MacDermid Alpha Electronics Solutions

Product Overview. HTSP Silicone Heat Transfer Compound Plus is a modified "Plus" version of Electrolube ’s successful HTS, offering superior thermal conductivity and a wide temperature range through the use of silicone base oils. Its exceptional properties stem from the novel use of metal... [See More]

  • Form / Shape: Grease, Paste; Powder
  • Industry: Semiconductors, IC's; Electronics
  • Chemical System: Silicone
  • Features: High Dielectric; Thermally Conductive
Ceramabond -- 571
from Aremco Products, Inc.

Bonds plated metals to ceramic, heaters, ignitors, gasketing [See More]

  • Form / Shape: Liquid; Powder
  • Cure / Technology: Thermoset
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Industry: Electronics