Powder Electrical and Electronic Resins
from MacDermid Alpha Electronics Solutions
Product Description. ER1426 Transparent / Colourless Epoxy Encapsulation Resin is a two part resin designed for powder bonding and impregnation applications. It ’s a very low viscosity resin system ideal for use on complicated geometries or around components placed close together. The long... [See More]
- Form / Shape: Powder
- Chemical System: Epoxy
- Use: Impregnating Resin
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]
- Form / Shape: Liquid; Powder
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Form / Shape: Grease, Paste; Powder
- Chemical System: Epoxy
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond Polymer System EP126 is a two component toughened epoxy resin based high temperature resistant adhesive system with continuous service capability at 500 °F and outstanding chemical resistance. This unique high performance epoxy adhesive compound can also withstand temperatures as... [See More]
- Form / Shape: Liquid; Powder
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Aremco Products, Inc.
Bonds plated metals to ceramic, heaters, ignitors, gasketing [See More]
- Form / Shape: Liquid; Powder
- Cure / Technology: Thermoset
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Industry: Electronics