Semiconductors / IC Packaging Electrical and Electronic Resins

Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000
from Epoxy Technology

EPO-TEK ® EK1000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy... [See More]

  • Industry: Semiconductors, IC's; Electronics
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
1987166 [88318 from Henkel Corporation - Industrial]
from RS Components, Ltd.

Tempflex is a non-corrosive single part RTV silicone sealant specifically designed for use on corrosion sensitive metallic surfaces. Trade Name = Loctite 5145 Tempflex. Package Type = Tube. Package Size = 40 ml. Cure Time = 72 h. Number of Parts = 1. Thermal Conductivity = 0.2W/mK. Colour =... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Silicone
  • Form / Shape: Tube
  • Use Temperature: 392
Capillary Underfill -- ALPHA® HiTech™ CU11-3127
from MacDermid Alpha Electronics Solutions

ALPHA ® HiTech ™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA ® HiTech ™ CU11-3127 protects the solder joints from mechanical stresses such as drop... [See More]

  • Industry: Semiconductors, IC's; Electronics
  • Composition: Single Component
  • Chemical System: Epoxy
  • CTE: 16 to 111
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
4.0 x 5.0 Micron Foil -- NanoFoil®
from Indium Corporation

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Features: Thermally Conductive
UV Epoxy -- EPO-TEK® OG133-8
from Epoxy Technology

EPO-TEK ® OG133-8 is an UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK ®... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics
  • Form / Shape: Grease, Paste
  • Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: Epoxy
3303908 [267424 from Henkel Corporation - Industrial]
from RS Components, Ltd.

Fast curing UV adhesive. Lower viscosity. Optically clear. Bonds glass to glass and glass to metal . Cures when exposed to UV radiation of 365nm wavelength. To obtain a full cure on surfaces exposed to air, radiation at 250nm is also required. Tensile strength 6 to 15N/mm ². Dielectric... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Silicone
  • Form / Shape: Bottle
  • Thermal Conductivity: 0.1000
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Bundle Kit 40 Microns x .5 Inch Squares -- NanoFoil®
from Indium Corporation

Thickness of NanoFoil ®: 40 microns. Size of NanoFoil ®: .5 inch squares. Qty Per Bundle: 100 each. NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Features: Thermally Conductive
458733
from RS Components, Ltd.

Non-corrosive, 1-part, room temperature vulcanising (RTV) silicone rubber. Adhesive cures rapidly in contact with atmospheric moisture to form a tough rubber. Will not corrode copper or its alloys and exhibit excellent primerless adhesion when fully cured. Neutral Cure . Fast skin and cure times. [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Silicone
  • Form / Shape: Cartridge
  • Use Temperature: -58 to 428
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Engineered Solder Materials -- Indalloy® Alloys Liquid at Room Temperature
from Indium Corporation

Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Form / Shape: Liquid
  • Features: Thermally Conductive
458793
from RS Components, Ltd.

Non-corrosive, 1-part, room temperature vulcanising (RTV) silicone rubber. Retains all physical properties in working temperatures up to 300 ºC. The product is cured rapidly in contact with atmospheric moisture to a tough rubber. Will not corrode copper or its alloys and exhibit excellent... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Silicone
  • Form / Shape: Cartridge
  • Use Temperature: -58 to 572
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black
from Master Bond, Inc.

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Indium Thermal Interface Materials (TIM)
from Indium Corporation

Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered as a... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Features: Thermally Conductive
567581
from RS Components, Ltd.

A heat curable, one part thixotropic paste adhesive for holding components in place during soldering operations on surface mount assemblies. High â € ˜green strength â € ™, or stickiness, ensures components do not move during handling, before curing has taken... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Silicone
  • Form / Shape: Syringe
  • Use Temperature: 284
Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126
from Master Bond, Inc.

Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Chemical System: Epoxy
  • Form / Shape: Liquid; Powder
  • Cure / Technology: Thermoset
Liquid Metal Thermal Interface Material
from Indium Corporation

Several very low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are finding increased use in various applications as a replacement for toxic mercury, which has a high vapor pressure at room temperature. These alloys have reduced toxicity and lower... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Form / Shape: Liquid
  • Features: Thermally Conductive
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: UV Curing
Solder Thermal Interface Materials
from Indium Corporation

Indium Corporation ’s Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in electronic devices. Thermal conductance for high power devices – with densities in excess of 1000 watts. End-of-life performance at the thermal interface – to avoid failures... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Features: Thermally Conductive
Elastomer Based, One Component Adhesive and Primer -- X21
from Master Bond, Inc.

Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Composition: Single Component; Unfilled
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: .5 Inch Squares - Qty 100 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Features: Thermally Conductive
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Grease, Paste
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 1 Inch Squares: Qty 50 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Features: Thermally Conductive
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 1.5 Inch Squares - Qty 20 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Features: Thermally Conductive
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy; Polyphenylene Sulfide
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 2 Inch Squares: Qty 20 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Form / Shape: Sheet or Film
  • Features: Thermally Conductive
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP
from Master Bond, Inc.

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset
Thermal Interface Materials -- Thermal Interface Ribbon Kit
from Indium Corporation

The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]

  • Industry: Semiconductors, IC's
  • Cure / Technology: Solder
  • Form / Shape: Sheet or Film; Ribbon
  • Features: Thermally Conductive
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Silicone
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F -- Supreme 34CA
from Master Bond, Inc.

Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Composition: Two Component  ; Unfilled
High Glass Transition Temperature Epoxy System -- EP62-1
from Master Bond, Inc.

Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The reccommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
High Performance, Elastomer-Based, One Component Adhesive -- X-5
from Master Bond, Inc.

Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Composition: Single Component; Unfilled
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
High Temperature Resistant Epoxy Compound -- EP45HT
from Master Bond, Inc.

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Grease, Paste; Powder
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Impregnating Resin
  • Chemical System: Epoxy
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
High Tensile Strength, One Component Epoxy -- EP15
from Master Bond, Inc.

Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Pore Sealant/Lubricant -- Auroguard NP-12
from Technic, Inc.

A non aqueous coating which reduces porosity and improves the wear resistance of gold plated surfaces in electronic component and connector applications. [See More]

  • Industry: Semiconductors, IC's
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone
Metal Oxide Thickened Dimethyl Silicone Compound -- Bluesil™ V-740
from Bluestar Silicones USA Corp.

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Composition: Two Component  
Thermal Compound -- TC70
from Nordson EFD

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

  • Industry: Semiconductors, IC's; Electronics
  • Chemical System: Synthetic Based
  • Form / Shape: Grease, Paste
  • Cure / Technology: Air Setting / Film Drying
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Industry: Semiconductors, IC's; Electronics
  • Form / Shape: Gel
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyurethane
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Polyurethane
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset; UV or Radiation Cured
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Chemical System: Polyurethane
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset