Thermal Insulation / Heat Insulating Electrical and Electronic Resins
from Epoxy Technology
EPO-TEK ® OD1001 is a thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device... [See More]
- Features: High Dielectric; Optical; Thermal Insulation
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound
- Chemical System: Epoxy
from Master Bond, Inc.
Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/ °C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. It has outstanding dimensional stability and will bond well to a wide variety of substrates, including... [See More]
- Features: High Dielectric; Optical; Thermal Insulation; NASA Low Outgassing
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Features: High Dielectric; Thermal Insulation; NASA Low Outgassing
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]
- Features: High Dielectric; Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]
- Features: High Dielectric; Thermal Insulation
- Form / Shape: Grease, Paste
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Features: High Dielectric; Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient temperatures which does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Features: High Dielectric; Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Cure / Technology: Thermoset; UV or Radiation Cured
from Master Bond, Inc.
Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. When exposed to a source of UV light of adequate wave... [See More]
- Features: High Dielectric; Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset; UV or Radiation Cured
from Master Bond, Inc.
Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Features: High Dielectric; Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
from Master Bond, Inc.
Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220 °F. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates. It is... [See More]
- Features: High Dielectric; Thermal Insulation
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
MasterSil 930 is an acetoxy type fluorosilicone for bonding, sealing and coating. Its most prominent feature is excellent chemical resistance, particularly to fuels, oils and solvents when compared to more standard silicones. Some of the chemicals that this product can withstand better than... [See More]
- Features: Thermal Insulation
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Silicone
from Master Bond, Inc.
Two component, low viscosity EP121CL-LO features an extraordinary long open time at room temperature of at least 2-3 days. This heat curable epoxy has excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, rubbers and plastics. EP121CL-LO is noteworthy for... [See More]
- Features: High Dielectric; Optical; Thermal Insulation; NASA Low Outgassing
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Features: High Dielectric; Thermal Insulation; NASA low outgassing
- Form / Shape: Grease, Paste; Powder
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
from Master Bond, Inc.
UV10TKMed is USP Class VI approved and meets ISO10993-5 for cytotoxicity requirements. It is used in the assembly of medical devices and is capable of withstanding repeated sterilizations, including radiation, ethylene oxide, chemical sterilants and especially autoclaving. This higher viscosity, one... [See More]
- Features: High Dielectric; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured
- Chemical System: Epoxy
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive and does... [See More]
- Features: High Dielectric; Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Features: High Dielectric; Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Cure / Technology: Thermoset; UV or Radiation Cured
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Features: Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]
- Features: High Dielectric; Optical; Thermal Insulation
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical... [See More]
- Features: High Dielectric; Thermal Insulation
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Epoxies Etc...
10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]
- Features: High Dielectric; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Features: High Dielectric; Flame Retardant; Thermal Insulation; UL Rating
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Polyurethane
from Epoxies Etc...
Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace industries. [See More]
- Features: High Dielectric; Thermal Insulation
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Features: Electrically Conductive; Thermal Insulation
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset; UV or Radiation Cured
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Features: High Dielectric; Thermal Insulation
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset