Specialty / Other Electrical and Electronic Resins
from CHT USA Inc.
CHT's AS1821 is is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is one in a range of Acetone cure products which are solvent free. It exhibits excellent primerless adhesion to many substrates and cures rapidly at room temperature when in... [See More]
- Cure / Technology: Acetone
- Industry: Electronics
- Chemical System: Silicone
- Composition: Single Component
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Addition Cure
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from ELANTAS North America Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Sets at R.T. with E 810-1 Accelerator
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Shiu Li Technology Co., Ltd
LiPOLY ’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing (optional feature); High Heat
- Form / Shape: Gel; Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Silicone
from CHT USA Inc.
AS5702 is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is one in a range of Alkoxy cure products which are solvent free. It exhibits excellent primerless adhesion to many substrates and cures at room temperature when in contact with... [See More]
- Cure / Technology: Alkoxy
- Industry: Electronics
- Chemical System: Silicone
- Composition: Single Component
from Master Bond, Inc.
Master Bond LED405Med is a one part, nano filled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets ISO 10993-5 for cytotoxicity and resists sterilization. It can cure up to 1/8 think and has low shrinkage upon cure. It also features... [See More]
- Cure / Technology: Thermoset; LED Cure
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Form / Shape: Liquid
- Composition: Single Component; Filled
from CHT USA Inc.
CHT ’s AS1803 is a white, non-corrosive, neutral cure 1-part RTV silicone adhesive sealant. This product will not corrode copper or its alloys and is designed for use with electronic components. It is part of CHT's range of Acetone cure products which are all solvent free. It features a fast... [See More]
- Cure / Technology: Acetone
- Industry: Electronics
- Chemical System: Silicone
- Composition: Single Component
from Master Bond, Inc.
Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. It is able to partially cure or fixture up to 6 mm deep or in cross sections under LED light at the right intensity. [See More]
- Cure / Technology: Thermoset; LED cures with LED light source
- Industry: Semiconductors, IC's; Photonics; Electronics
- Chemical System: LED curing
- Composition: Single Component; Unfilled
from CHT USA Inc.
CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]
- Cure / Technology: Alkoxy
- Industry: Electronics
- Chemical System: Silicone
- Composition: Single Component
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Cure / Technology: UV or Radiation Cured; Dual Curing
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Chemical System: UV Curing
from CHT USA Inc.
CHT's QSil 12 is a 2-part, condensation cure, transparent, low viscosity, liquid silicone elastomer which cures at room temperature. QSil 12 is primarily intended for electronic and lighting potting applications. This material is typically mixed at a ratio of 100:5. Once mixed, the material is... [See More]
- Cure / Technology: Condensation
- Industry: Electronics
- Use: Encapsulant, Potting Compound
- Composition: Two Component
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Cure / Technology: Thermoset; Addition Cure
- Form / Shape: Grease, Paste
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from CHT USA Inc.
CHT ’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also flame... [See More]
- Cure / Technology: Addition
- Chemical System: Silicone
- Form / Shape: Gel
- Industry: Electronics
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; UV curing system
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: UV curable
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a fast curing, fast flowing liquid epoxy resin designed for capillary flow filling chip size packages, is to improve the process speed in production and design its rheological design, let it penetrate 25µm clearance, minimize induced stress, improve temperature cycling performance, with... [See More]
- Cure / Technology: Heat Curing
- Industry: Electronics
- Chemical System: Epoxy
- Viscosity: 3500 to 7000
from Indium Corporation
The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]
- Cure / Technology: Solder
- Industry: Semiconductors, IC's
- Form / Shape: Sheet or Film; Ribbon
- Features: Thermally Conductive
from Wacker Chemical Corp.
ELASTOSIL ® RT 563 is a pourable, room-temperature-vulcanizing, condensation-curing, two-component silicone rubber. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Condensation Cured
- Form / Shape: Grease, Paste
- Use: Encapsulant, Potting Compound
- Chemical System: Silicone
from Sanchem, Inc.
is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]
- Cure / Technology: Non-Drying
- Form / Shape: Gel
- Use: Impregnating Resin
- Industry: Electronics; Electric Power
from Shenzhen DeepMaterial Technologies Co., Ltd
Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a... [See More]
- Cure / Technology: Heat curing
- Industry: Semiconductors, IC's
- Chemical System: Epoxy; Silicone
- Features: Electrically Conductive
from Shenzhen DeepMaterial Technologies Co., Ltd
In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable for the reinforcement of printed circuit boards and the bonding of various materials. After curing, the product has excellent flexibility and strength, making it... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; UV or Radiation Cured; UV Heat Curing
- Elongation: 95.0
- Industry: Electronics
- Viscosity: 9000 to 20000