Room Temp. Cure / Vulcanizing Electrical and Electronic Resins
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Impregnating Resin (optional feature)
- Chemical System: Alkyd
from Master Bond, Inc.
EP30AO is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation and environmental protection are required and heat transfer must be maintained. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76040 is a single component, U.V curable anaerobic sealant. 76040 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 1 liter
- Composition: Single Component
from MacDermid Alpha Electronics Solutions
A thixotropic two-part silicone potting compound specifically crafted to safeguard LED drivers and a range of other components. Product Overview. SC4003 is a thixotropic two-part silicone potting and encapsulating resin designed for the Indian market. Primarily developed for the protection of LED... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Use: Encapsulant, Potting Compound
- Industry: Semiconductors, IC's; Electronics
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Addition Cure
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76041 is a single component U.V. anaerobic sealant. 76041 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76060 is a single component U.V. anaerobic sealant. 76060 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76061 is a single component U.V. anaerobic sealant. 76061 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76081 is a single component U.V. anaerobic sealant. 76081 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Silicone
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76082 is a single component U.V. anaerobic sealant. 76082 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76083 is a single component U.V. anaerobic sealant. 76083 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76084 is a single component U.V. anaerobic sealant. 76084 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 40995 is a single component anaerobic thread locking and sealing adhesive. Grenade Igniter Case Sealant 40995 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high-performance thermoset plastic... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 1 liter
- Composition: Single Component
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 47422 is a single component UV and anaerobic curing adhesive. Grenade Igniter Case Sealant 47422 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high performance thermoset plastic suitable for... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Chemical System: Polyolefin
- Form / Shape: Liquid; Primer
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Hernon Manufacturing, Inc.
ReAct ® 730 is a high strength non-flammable structural adhesive. This adhesive provides a resilient and rapid cure at room temperature when used with Hernon ® Activator 56 or Activator 59. ReAct ® 730 will provide high strength bonds on a variety of metals, ceramics, glass, and some... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Industry: Electronics; Electric Power
- Form / Shape: 25 ml
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond ® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: 50 ml (two component)
- Use: Encapsulant, Potting Compound
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 316 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. Tuffbond ® 316 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: 50 ml (two component)
- Use: Encapsulant, Potting Compound
- Industry: Electronics; Electric Power
from Master Bond, Inc.
EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical strength properties and electrical insulation values. EP41S-5 offers convenient handling with... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Impregnating Resin
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: 50 ml (two component)
- Use: Encapsulant, Potting Compound
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 47771 adhesive/sealant is a two-component epoxy. This adhesive is a 100% solid system, one to one ratio, room temperature cure system. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Form / Shape: 50 ml (two component)
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy; Polyphenylene Sulfide
from Hernon Manufacturing, Inc.
Tuffbond ® 65891 is a two-component, room temperature cure system. Tuffbond ® 65891 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: 50 ml (two component)
- Use: Encapsulant, Potting Compound
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration and shock. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Cylinlock ® 845 is a fast curing, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. This compound will cure on metallic or non-metallic substrates and is suitable for exposure to most solvents and withstands temperatures of 300 °F (149 °C). Hernon... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Industry: Electronics; Electric Power
- Form / Shape: 250 ml
from Master Bond, Inc.
Optically clear EP29LPHE is a two component epoxy that has notable toughness along with high elongation, which imparts good impact and shock resistance. It bonds well to a wide variety of substrates including metals, ceramics, glass, optical fibers, graphite and many rubbers and plastics. Its... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Bullet Proof 650 is an environmentally friendly, single component, room temperature cure sealant and coating material. Bullet Proof 650 is formulated to waterproof and seal the interface between a bullet and cartridge. Bullet Proof 650 coats the inside of large shells to prevent the corrosive attack... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Industry: Electronics; Electric Power
- Form / Shape: 2 oz
- Composition: Single Component
from Master Bond, Inc.
Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Hernon Manufacturing, Inc.
UV Curable Cylinlock ® 820 is a fast curing, high-strength anaerobic adhesive designed to retain and seal cylindrical assemblies. Curing occurs when adhesive is confined between mating surfaces. The cured adhesive is a thermoset plastic suitable for exposure to most solvents. Augments or... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
from Master Bond, Inc.
Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Dripstop ® 943 is an adhesive/sealant specifically formulated for the sealing and mild locking of Hydraulic and Pneumatic threaded parts. Dripstop ® 943 will positively seal pipe threads, standard nuts and bolts, fittings for hydraulic and pneumatic systems, air conditioners, fittings for... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Chemical System: Epoxy
from Bluestar Silicones USA Corp.
Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Silicone
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Silicone
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Graphene Laboratories, Inc.
Our G6E-TSHV ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Chemical System: Epoxy
- Form / Shape: Liquid
- Industry: Electronics; Electric Power
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Industry: Electronics
- Form / Shape: Grease, Paste
- Composition: Two Component
from Henkel Corporation - Electronics
HYSOL ® ES1000 ™ is a two-component, long pot life casting system with excellent handling properties. This material has good thermal shock resistance and low exotherm, making it suitable for encapsulation of various components and modules. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Industry: Electronics
- Chemical System: Epoxy
- Composition: Two Component
from Phelps Industrial Products
Phelps Style 9815 is 100% RTV (room temperature vulcanizing) silicone that can be used anywhere a high temperature sealant/adhesive is required. This high temp silicone sealant builds a formed-in-place gasket at operating temperatures up to 310 °C. Phelps Style 9815 high temperature silicone... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Form / Shape: Gel
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: Grease, Paste; Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Polyurethane
- Form / Shape: Liquid
- Industry: Electronics
from Graphene Laboratories, Inc.
Our G6E-TSAL ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Gel
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. Hapflex ™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex ™ 700/800 products exhibit high tensile strength, high tear strength, and excellent elongation. All Hapflex... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Polyurethane
- Form / Shape: Liquid
- Industry: Electronics
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Industry: Electronics
from Epoxies Etc...
50-2370 is a new thermally conductive polyurethane potting compound. This system is designed for low stress on sensitive components during and after cure. It is formulated for applications requiring low exotherm, low shrinkage, excellent electrical properties and a rapid 5 minute gel time. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: Gel
- Use: Encapsulant, Potting Compound
- Chemical System: Polyurethane