UV / Radiation Cured (also EB, Light) Electrical and Electronic Resins
from Shenzhen DeepMaterial Technologies Co., Ltd
Used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is usually used from -53°C to 204°C. [See More]
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
- Use Temperature: -63 to 399
- Industry: Electronics
- Elongation: 15.0
from Master Bond, Inc.
One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Cure / Technology: UV or Radiation Cured; Dual Curing
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Chemical System: UV Curing
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a conformal coating designed to provide strong protection from moisture and harsh chemicals. Compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
- Chemical System: Acrylic
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Industry: Electronics
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient temperatures which does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. When exposed to a source of UV light of adequate wave... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
from Master Bond, Inc.
UV10TKMed is USP Class VI approved and meets ISO10993-5 for cytotoxicity requirements. It is used in the assembly of medical devices and is capable of withstanding repeated sterilizations, including radiation, ethylene oxide, chemical sterilants and especially autoclaving. This higher viscosity, one... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Chemical System: Epoxy
- Composition: Single Component; Unfilled
from Master Bond, Inc.
Master Bond UV22DC80-1 is a one part nanosilica filled system for bonding and sealing and coating applications in the aerospace, optical and electronic industries. This video demonstrates the epoxy based system's unique dual curing mechanism of both UV light and heat, allowing it to cure dissimilar... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; UV curing system
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: UV curable
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Chemence Inc.
Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]
- Cure / Technology: Anaerobic; Reactive or Moisture Cured; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound
- Chemical System: Cyanoacrylate
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from ND Industries, Inc.
Vibra-Tite light cure adhesives are single-part, photo-initiated acrylates that cure on demand when exposed to UV-light. Almost instant cure. Some cure with very low intensity. Flexible or rigid products available. High optical clarity & non-yellowing. Bonds a wide range of substrates [See More]
- Cure / Technology: UV or Radiation Cured
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Industry: Electronics; Electric Power
from Wacker Chemical Corp.
SEMICOSIL ® 912 is a pourable, addition-curing, 2-part. silicone rubber that cures to a soft silicone gel when. mixed with ELASTOSIL ® CAT PT, ELASTOSIL ® CAT. PT-F or ELASTOSIL ® CAT UV. Special features. two-part, 10 : 1 mixing ratio. low viscosity. modular system allows flexible... [See More]
- Cure / Technology: UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Silicone
from Henkel Corporation - Electronics
Photocurable adhesive is designed for high throughput assembly operations. [See More]
- Cure / Technology: UV or Radiation Cured
- Composition: Single Component
- Industry: Electronics
- CTE: 29
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Electro-Lite Corporation
ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]
- Cure / Technology: UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Epoxy
from Epoxies Etc...
UV Cure 60-7112 is a non-yellowing UV Curable urethane system. It is designed to provide low stress on electronic components and outstanding adhesion to a variety of substances. UV Cure 60-7112 also has high impact strength and flexibility. This material is a good choice when water and weather... [See More]
- Cure / Technology: UV or Radiation Cured
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound
- Chemical System: Urethane
from Protavic America, Inc.
PNU 46220 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Polyurethane
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Cure / Technology: UV or Radiation Cured
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Polyurethane