UV / Radiation Cured (also EB, Light) Electrical and Electronic Resins
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76040 is a single component, U.V curable anaerobic sealant. 76040 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 1 liter
- Composition: Single Component
from MacDermid Alpha Electronics Solutions
A UV-curing system, suitable for rapid curing and bonding in diverse applications, including coating and component fixing. Product Overview. A versatile, high-performance underfill adhesive specifically developed for electronics assembly applications. This single-component adhesive provides... [See More]
- Cure / Technology: UV or Radiation Cured
- Composition: Single Component
- Industry: Semiconductors, IC's; Electronics
from Master Bond, Inc.
UV17Med is a low viscosity, UV curable system with an affinity for bonding to a wide array of thermoplastic urethanes and passes stringent ISO10993-5 cytotoxicity standards. [See More]
- Cure / Technology: UV or Radiation Cured
- Industry: Photonics; Electronics
- Use: Encapsulant or Conformal Coating
- Composition: Single Component; Unfilled
from Dymax
Conformal Coating with Secondary Moisture Cure. Dual-cure 9481-E-PZ conformal coating is chemically resistant and free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO) and PIP 3:1. It is a UV/Visible light- and moisture-cure material that contains no added solvents. It is formulated to ensure... [See More]
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: Acrylated Urethane
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76041 is a single component U.V. anaerobic sealant. 76041 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Cure / Technology: UV or Radiation Cured; Dual Curing
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Chemical System: UV Curing
from Dymax
High-Performance Conformal Coating with Secondary Moisture Cure. Dual-cure 9483-Z conformal coating is free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO). It cures tack-free upon exposure to UV/Visible light and then with ambient moisture over time, on PCBs where shadow areas are present. The... [See More]
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: Acrylated Urethane
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76060 is a single component U.V. anaerobic sealant. 76060 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling. [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Chemical System: Epoxy; UV curing
- Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76061 is a single component U.V. anaerobic sealant. 76061 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76081 is a single component U.V. anaerobic sealant. 76081 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Key Features. Outstanding physical properties. Superb chemical resistance. Bonds well to many types of plastics. Withstands thermal cycling. Product Description. Master Bond UV18S is a specialty UV curable system for bonding, featuring good strength, toughness, and chemical resistance. It cures... [See More]
- Cure / Technology: UV or Radiation Cured
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Form / Shape: Liquid
- Composition: Single Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76082 is a single component U.V. anaerobic sealant. 76082 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76083 is a single component U.V. anaerobic sealant. 76083 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
UV10TKMed is USP Class VI approved and meets ISO10993-5 for cytotoxicity requirements. It is used in the assembly of medical devices and is capable of withstanding repeated sterilizations, including radiation, ethylene oxide, chemical sterilants and especially autoclaving. This higher viscosity, one... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Chemical System: Epoxy
- Composition: Single Component; Unfilled
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76084 is a single component U.V. anaerobic sealant. 76084 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; UV curing system
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: UV curable
from Hernon Manufacturing, Inc.
Ammunition Primer Sealant 34194 is a single component 100% solid system offering a tough, dry coating with superior chemical and environmental resistance after cure. Ammunition Primer Sealant 34194 will cure rapidly when exposed to high intensity U.V. light. This coating is formulated to migrate... [See More]
- Cure / Technology: UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Chemence Inc.
Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]
- Cure / Technology: Anaerobic; Reactive or Moisture Cured; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound
- Chemical System: Cyanoacrylate
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Wacker Chemical Corp.
SEMICOSIL ® 912 is a pourable, addition-curing, 2-part. silicone rubber that cures to a soft silicone gel when. mixed with ELASTOSIL ® CAT PT, ELASTOSIL ® CAT. PT-F or ELASTOSIL ® CAT UV. Special features. two-part, 10 : 1 mixing ratio. low viscosity. modular system allows flexible... [See More]
- Cure / Technology: UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Silicone
from Epoxies Etc...
UV Cure 60-7112 is a non-yellowing UV Curable urethane system. It is designed to provide low stress on electronic components and outstanding adhesion to a variety of substances. UV Cure 60-7112 also has high impact strength and flexibility. This material is a good choice when water and weather... [See More]
- Cure / Technology: UV or Radiation Cured
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound
- Chemical System: Urethane
from Shenzhen DeepMaterial Technologies Co., Ltd
Used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is usually used from -53°C to 204°C. [See More]
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
- Use Temperature: -63 to 399
- Industry: Electronics
- Elongation: 15.0
from Henkel Corporation - Electronics
Photocurable adhesive is designed for high throughput assembly operations. [See More]
- Cure / Technology: UV or Radiation Cured
- Composition: Single Component
- Industry: Electronics
- CTE: 29
from ND Industries, Inc.
Vibra-Tite light cure adhesives are single-part, photo-initiated acrylates that cure on demand when exposed to UV-light. Almost instant cure. Some cure with very low intensity. Flexible or rigid products available. High optical clarity & non-yellowing. Bonds a wide range of substrates [See More]
- Cure / Technology: UV or Radiation Cured
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Industry: Electronics; Electric Power
from Electro-Lite Corporation
ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]
- Cure / Technology: UV or Radiation Cured
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Epoxy
from Protavic America, Inc.
PNU 46220 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Polyurethane
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Cure / Technology: UV or Radiation Cured
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Polyurethane
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a conformal coating designed to provide strong protection from moisture and harsh chemicals. Compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
- Chemical System: Acrylic
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Industry: Electronics