Specialty / Other Electrical and Electronic Resins

Thermal Interface Materials -- Thermal Interface Ribbon Kit
from Indium Corporation

The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]

  • Form / Shape: Sheet or Film; Ribbon
  • Industry: Semiconductors, IC's
  • Cure / Technology: Solder
  • Features: Thermally Conductive
One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications -- EP17HTND-CCM
from Master Bond, Inc.

Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications. [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste; Flowable Paste
  • Cure / Technology: Thermoset
1987166 [88318 from Henkel Corporation - Industrial]
from RS Components, Ltd.

Tempflex is a non-corrosive single part RTV silicone sealant specifically designed for use on corrosion sensitive metallic surfaces. Trade Name = Loctite 5145 Tempflex. Package Type = Tube. Package Size = 40 ml. Cure Time = 72 h. Number of Parts = 1. Thermal Conductivity = 0.2W/mK. Colour =... [See More]

  • Form / Shape: Tube
  • Industry: Semiconductors, IC's
  • Chemical System: Silicone
  • Use Temperature: 392
One Component Liquid Epoxy Resin EP36CLV -- EP36CLV
from Master Bond, Inc.

Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably from other heat resistant epoxies in that it has far more toughness and... [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Semi-Solid
  • Cure / Technology: Thermoset
3303908 [267424 from Henkel Corporation - Industrial]
from RS Components, Ltd.

Fast curing UV adhesive. Lower viscosity. Optically clear. Bonds glass to glass and glass to metal . Cures when exposed to UV radiation of 365nm wavelength. To obtain a full cure on surfaces exposed to air, radiation at 250nm is also required. Tensile strength 6 to 15N/mm ². Dielectric... [See More]

  • Form / Shape: Bottle
  • Industry: Semiconductors, IC's
  • Chemical System: Silicone
  • Thermal Conductivity: 0.1000
One component primer/adhesive for polyolefins, passes ISO 10993-5 test -- X21Med
from Master Bond, Inc.

Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]

  • Form / Shape: Liquid; Primer
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Chemical System: Polyolefin
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
458733
from RS Components, Ltd.

Non-corrosive, 1-part, room temperature vulcanising (RTV) silicone rubber. Adhesive cures rapidly in contact with atmospheric moisture to form a tough rubber. Will not corrode copper or its alloys and exhibit excellent primerless adhesion when fully cured. Neutral Cure . Fast skin and cure times. [See More]

  • Form / Shape: Cartridge
  • Industry: Semiconductors, IC's
  • Chemical System: Silicone
  • Use Temperature: -58 to 428
One Part, Thermally Conductive, Heat Resistant Epoxy -- EP36AO
from Master Bond, Inc.

Master Bond Polymer System EP36AO is a truly unique one component high performance flexibilized epoxy system for electrical potting and encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Solid
  • Cure / Technology: Thermoset
458793
from RS Components, Ltd.

Non-corrosive, 1-part, room temperature vulcanising (RTV) silicone rubber. Retains all physical properties in working temperatures up to 300 ºC. The product is cured rapidly in contact with atmospheric moisture to a tough rubber. Will not corrode copper or its alloys and exhibit excellent... [See More]

  • Form / Shape: Cartridge
  • Industry: Semiconductors, IC's
  • Chemical System: Silicone
  • Use Temperature: -58 to 572
567581
from RS Components, Ltd.

A heat curable, one part thixotropic paste adhesive for holding components in place during soldering operations on surface mount assemblies. High â € ˜green strength â € ™, or stickiness, ensures components do not move during handling, before curing has taken... [See More]

  • Form / Shape: Syringe
  • Industry: Semiconductors, IC's
  • Chemical System: Silicone
  • Use Temperature: 284
ACHESON ELECTRODAG 5915 -- 8799582519297
from Henkel Corporation - Electronics

ACHESON ELECTRODAG 5915 is a one component, fast cure, electrically conductive isotropic ink designed for bonding surface mount devices to flexible or rigid printed circuits. [See More]

  • Industry: Electronics
  • Viscosity: 120000
  • Features: Electrically Conductive
Sputtering Targets -- Silver Epoxy Bonding Cement
from Materion Corporation

Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength. [See More]

  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
  • Form / Shape: Powder; Resin
  • Industry: Electronics
Foam In Place Rigid PU Foam -- 20-2028
from Epoxies Etc...

20-2028 is a light weight, two component, closed cell, liquid urethane foaming resin system designed for potting and encapsulating. [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyurethane
  • Form / Shape: Foam
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset