Specialty / Other Electrical and Electronic Resins
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from RS Components, Ltd.
Tempflex is a non-corrosive single part RTV silicone sealant specifically designed for use on corrosion sensitive metallic surfaces. Trade Name = Loctite 5145 Tempflex. Package Type = Tube. Package Size = 40 ml. Cure Time = 72 h. Number of Parts = 1. Thermal Conductivity = 0.2W/mK. Colour =... [See More]
- Form / Shape: Tube
- Industry: Semiconductors, IC's
- Chemical System: Silicone
- Use Temperature: 392
from Hernon Manufacturing, Inc.
Blank Ammunition Sealant 48641 Is a medium viscosity, UV and LED curable compound formulated to provide high performance, fast curing, coating and sealing of ammunition blank tips. This product is also used for shallow potting applications. [See More]
- Form / Shape: 50 ml
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications. [See More]
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound
- Chemical System: Epoxy
- Form / Shape: Grease, Paste; Flowable Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from RS Components, Ltd.
Fast curing UV adhesive. Lower viscosity. Optically clear. Bonds glass to glass and glass to metal . Cures when exposed to UV radiation of 365nm wavelength. To obtain a full cure on surfaces exposed to air, radiation at 250nm is also required. Tensile strength 6 to 15N/mm ². Dielectric... [See More]
- Form / Shape: Bottle
- Industry: Semiconductors, IC's
- Chemical System: Silicone
- Thermal Conductivity: 0.1000
from Hernon Manufacturing, Inc.
Blank Ammunition Sealant 48642 Is a medium viscosity, UV and LED curable compound formulated to provide high performance, fast curing, coating and sealing of ammunition blank tips. This product is also used for shallow potting applications. [See More]
- Form / Shape: 250 ml
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably from other heat resistant epoxies in that it has far more toughness and... [See More]
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Semi-Solid
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Graphite
- Features: Thermally Conductive
from RS Components, Ltd.
Non-corrosive, 1-part, room temperature vulcanising (RTV) silicone rubber. Adhesive cures rapidly in contact with atmospheric moisture to form a tough rubber. Will not corrode copper or its alloys and exhibit excellent primerless adhesion when fully cured. Neutral Cure . Fast skin and cure times. [See More]
- Form / Shape: Cartridge
- Industry: Semiconductors, IC's
- Chemical System: Silicone
- Use Temperature: -58 to 428
from Hernon Manufacturing, Inc.
Blank Ammunition Sealant 53162 Is a medium viscosity, UV and LED curable compound formulated to provide high performance, fast curing, coating and sealing of ammunition blank tips. This product is also used for shallow potting applications. [See More]
- Form / Shape: 1 liter
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Form / Shape: Liquid; Primer
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Chemical System: Polyolefin
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Shiu Li Technology Co., Ltd
LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Graphite, Copper, Acrylic
- Features: Thermally Conductive
from RS Components, Ltd.
Non-corrosive, 1-part, room temperature vulcanising (RTV) silicone rubber. Retains all physical properties in working temperatures up to 300 ºC. The product is cured rapidly in contact with atmospheric moisture to a tough rubber. Will not corrode copper or its alloys and exhibit excellent... [See More]
- Form / Shape: Cartridge
- Industry: Semiconductors, IC's
- Chemical System: Silicone
- Use Temperature: -58 to 572
from Hernon Manufacturing, Inc.
External Ammunition Sealant 59521 is a single component UV curable anaerobic sealant. 59521 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Form / Shape: 50 ml
- Industry: Electronics; Electric Power
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Composition: Single Component
from Master Bond, Inc.
Master Bond Polymer System EP36AO is a truly unique one component high performance flexible epoxy system for electrical potting and encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Epoxy
- Form / Shape: Solid
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from RS Components, Ltd.
A heat curable, one part thixotropic paste adhesive for holding components in place during soldering operations on surface mount assemblies. High â € ˜green strength â € ™, or stickiness, ensures components do not move during handling, before curing has taken place. [See More]
- Form / Shape: Syringe
- Industry: Semiconductors, IC's
- Chemical System: Silicone
- Use Temperature: 284
from Hernon Manufacturing, Inc.
External Ammunition Sealant 59541 is a single component U.V. anaerobic sealant. 59541 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Form / Shape: 50 ml
- Industry: Electronics; Electric Power
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Composition: Single Component
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Hernon Manufacturing, Inc.
External Ammunition Sealant 59681 is a single component U.V. anaerobic sealant. 59681 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Form / Shape: 1 liter
- Industry: Electronics; Electric Power
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Composition: Single Component
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76040 is a single component, U.V curable anaerobic sealant. 76040 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Form / Shape: 50 ml
- Industry: Electronics; Electric Power
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Composition: Single Component
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76041 is a single component U.V. anaerobic sealant. 76041 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Form / Shape: 50 ml
- Industry: Electronics; Electric Power
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Composition: Single Component
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76060 is a single component U.V. anaerobic sealant. 76060 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Form / Shape: 1 liter
- Industry: Electronics; Electric Power
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Composition: Single Component
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76061 is a single component U.V. anaerobic sealant. 76061 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Form / Shape: 50 ml
- Industry: Electronics; Electric Power
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Composition: Single Component
from Shiu Li Technology Co., Ltd
LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76081 is a single component U.V. anaerobic sealant. 76081 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Form / Shape: 50 ml
- Industry: Electronics; Electric Power
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Composition: Single Component
from Shiu Li Technology Co., Ltd
LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76082 is a single component U.V. anaerobic sealant. 76082 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Form / Shape: 50 ml
- Industry: Electronics; Electric Power
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Composition: Single Component
from Shiu Li Technology Co., Ltd
LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76083 is a single component U.V. anaerobic sealant. 76083 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Form / Shape: 50 ml
- Industry: Electronics; Electric Power
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Composition: Single Component
from Shiu Li Technology Co., Ltd
Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Industry: Electronics
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76084 is a single component U.V. anaerobic sealant. 76084 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Form / Shape: 50 ml
- Industry: Electronics; Electric Power
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Composition: Single Component
from Shiu Li Technology Co., Ltd
LiPOLY T-work 8000 is a high performance thermally conductive interface pad. T-work 8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work 8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an... [See More]
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Hernon Manufacturing, Inc.
Formulations - Applications - Ammunition Sealant [See More]
- Form / Shape: 1 liter
- Industry: Electronics; Electric Power
from Shiu Li Technology Co., Ltd
LiPOLY T-work 9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work 9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Hernon Manufacturing, Inc.
EXTERNAL AMMO SEALANT 76070, LT YELLOW-AMBER, 1 LITER [See More]
- Form / Shape: 1 Liter
- Industry: Electronics; Electric Power
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Hernon Manufacturing, Inc.
Ammunition Primer Sealant 34194 is a single component 100% solid system offering a tough, dry coating with superior chemical and environmental resistance after cure. Ammunition Primer Sealant 34194 will cure rapidly when exposed to high intensity U.V. light. This coating is formulated to migrate... [See More]
- Form / Shape: 50 ml
- Industry: Electronics; Electric Power
- Cure / Technology: UV or Radiation Cured
- Composition: Single Component
from Shiu Li Technology Co., Ltd
LiPOLY Non-Silicone Thermal Compound N700A/B is made of non-silicon resin material and none low-molecular-weight siloxane. N700A/B helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Non-Silicone
- Features: Thermally Conductive; UL Rating
from Hernon Manufacturing, Inc.
Brake Bonder 362 is a black heat curing, nitrile/phenolic solvent-based adhesive. Cured Brake Bonder 362 furnishes excellent resistance to thermal shock, chemicals, and water. The cured bond withstands temperatures exceeding 600 °F (315 °C). The primary application for Brake Bonder 362 is... [See More]
- Form / Shape: 2 oz
- Industry: Electronics; Electric Power
from Shiu Li Technology Co., Ltd
Non-Silicone Thermal Compound N700C is made of non-silicon resin material and none low-molecular-weight siloxane. N700C helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is 5.0W/m*K. [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Non-Silicone
- Features: Thermally Conductive
from Hernon Manufacturing, Inc.
UV Curable Cylinlock ® 821 is a fast curing, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. Curing occurs when adhesive is confined between mating surfaces. The cured adhesive is a thermoset plastic suitable for exposure to most solvents and withstands... [See More]
- Form / Shape: 10 ml
- Industry: Electronics; Electric Power
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Shiu Li Technology Co., Ltd
Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Non-Silicone
- Features: Thermally Conductive
from Hernon Manufacturing, Inc.
Fusionbond ® 370 is a two components methacrylate adhesive. It is specially formulated for structural bonding of thermoplastics, metal, wood and composite assemblies. Fusionbond ® 370 is an excellent choice for composite bonding applications in the marine, automotive and construction... [See More]
- Form / Shape: 5 gal - part A
- Composition: Two Component
- Industry: Electronics; Electric Power
from Shiu Li Technology Co., Ltd
Non-Silicone Thermal Compound N800C-s is made of non-silicon resin material. No low molecular siloxane volatilization and low total volatile gas, no electrical contact & pollution problems. N800C-s can have low thermal resistance and high thermal conductivity. [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics; Electric Power
- Chemical System: Non-Silicone
- Features: Thermally Conductive
from Hernon Manufacturing, Inc.
Fusionbond ® 371 is a two components methacrylate adhesive. It is specially formulated for structural bonding of thermoplastics, metal, wood and composite assemblies. Fusionbond ® 371 is an excellent choice for composite bonding applications in the marine, automotive and construction... [See More]
- Form / Shape: 1 qt - part A
- Composition: Two Component
- Industry: Electronics; Electric Power
from Shiu Li Technology Co., Ltd
LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot. [See More]
- Form / Shape: Syringe/Cartridge/Pale
- Industry: Electronics
- Chemical System: Non-Silicone
- Features: Thermally Conductive
from Hernon Manufacturing, Inc.
Hernon ® has taken the excellent bond strength of Fusionbond adhesive family and merged it with the simplicity of a two-component, no-mix curing system to create Fusionbond ® 374. Fusionbond ® 374 is a 100% solid, room temperature cure, versatile structural adhesive which is used in... [See More]
- Form / Shape: 300 ml cartridge (10:2 ratio)
- Composition: Two Component
- Industry: Electronics; Electric Power
from Shiu Li Technology Co., Ltd
LiPOLY N-putty2-s series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 5.0 W/m*K, the high deformation can perfectly fill small air gaps to eliminate tolerances. It also can overcome... [See More]
- Form / Shape: Syringe/Cartridge/Pale
- Industry: Electronics; Electric Power
- Chemical System: Non-Silicone
- Features: Thermally Conductive
from Hernon Manufacturing, Inc.
Fusionbond ® 375 is a highly thixotropic, two component, room temperature curing, 1:1 ratio, methacrylate adhesive system. Fusionbond ® 375 is formulated to provide fixturing strength within 7 to 10 minutes. This adhesive product forms resilient bonds and maintains its strength over a wide... [See More]
- Form / Shape: 50 ml (two component)
- Industry: Electronics; Electric Power
- Chemical System: Acrylic; Vinyl
- Composition: Two Component
from Shiu Li Technology Co., Ltd
LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Syringe/Cartridge
- Industry: Electronics
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 47422 is a single component UV and anaerobic curing adhesive. Grenade Igniter Case Sealant 47422 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high performance thermoset plastic suitable for... [See More]
- Form / Shape: 1 liter
- Industry: Electronics; Electric Power
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Composition: Single Component
from Shiu Li Technology Co., Ltd
LiPOLY's NL-putty series is a silicone free, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone Free
- Form / Shape: Gel; Liquid; Syringe/Cartridge/Pale
- Industry: Electronics; Electric Power
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive. High thermal conductivity. Solvent-free formulation. Low viscosity [See More]
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
- Form / Shape: Paste
- Cure / Technology: Thermoset
from Indium Corporation
The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]
- Form / Shape: Sheet or Film; Ribbon
- Industry: Semiconductors, IC's
- Cure / Technology: Solder
- Features: Thermally Conductive
from Materion Corporation
Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength. [See More]
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
- Form / Shape: Powder; Resin
- Industry: Electronics
from Henkel Corporation - Electronics
ACHESON ELECTRODAG 5915 is a one component, fast cure, electrically conductive isotropic ink designed for bonding surface mount devices to flexible or rigid printed circuits. [See More]
- Industry: Electronics
- Viscosity: 120000
- Features: Electrically Conductive
from Epoxies Etc...
20-2028 is a light weight, two component, closed cell, liquid urethane foaming resin system designed for potting and encapsulating. [See More]
- Use: Encapsulant, Potting Compound
- Chemical System: Polyurethane
- Form / Shape: Foam
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset