Thermosetting / Crosslinking Electrical and Electronic Resins
from Hernon Manufacturing, Inc.
External Ammunition Sealant 59521 is a single component UV curable anaerobic sealant. 59521 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Addition Cure
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from ELANTAS North America Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from MacDermid Alpha Electronics Solutions
Product Description. ER1122 adhesive epoxy resin is a two part encapsulation and potting compound for general purpose electronic applications with a clear amber finish. It can be hot or cold cured, and the cured compound is a tough resin. The resin exhibits superior adhesion to a rage of materials,... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Hernon Manufacturing, Inc.
External Ammunition Sealant 59541 is a single component U.V. anaerobic sealant. 59541 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from MacDermid Alpha Electronics Solutions
Product Description. ER2188 General purpose epoxy potting compound is a two part epoxy resin for general use within the electronics industry. It ’s a good all round resin offering a cost effective solution for a wide range of applications where protection is required. ER2188 is flame retardant... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Hernon Manufacturing, Inc.
External Ammunition Sealant 59681 is a single component U.V. anaerobic sealant. 59681 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 1 liter
- Composition: Single Component
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from MacDermid Alpha Electronics Solutions
Product Description. ER2223 highly chemical resistant epoxy potting compound has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive industry. It has excellent chemical resistance, including most fluids found in the engine compartment of... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76040 is a single component, U.V curable anaerobic sealant. 76040 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from MacDermid Alpha Electronics Solutions
Product Description. ER6001 is a two-part epoxy adhesive / encapsulation resin which has been developed for the Indian market primarily for the encapsulation of electrical components. The resin has good chemical resistance and a wide operating temperature range, performing exceptionally at high... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics
- Chemical System: Epoxy
- Use Temperature: -40 to 302
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76041 is a single component U.V. anaerobic sealant. 76041 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Liquid; Powder
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from MacDermid Alpha Electronics Solutions
Product Description. ER2218 very low viscosity, flame retardant epoxy which has been formulated for use as a potting compound / encapsulation resin. Boasting excellent thermal stability ER2218 has been specifically designed for compatibility with reflow applications, therefore remaining stable for... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76060 is a single component U.V. anaerobic sealant. 76060 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 1 liter
- Composition: Single Component
from Master Bond, Inc.
Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]
- Cure / Technology: Thermoset
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Form / Shape: Liquid
- Composition: Single Component; Unfilled
from MacDermid Alpha Electronics Solutions
Product Description. DCB SCC3 Black conformal coating is a specialist modified alkyd coating which has been specifically designed to meet the highest defence standards in both Europe and the United States. Sharing the same properties as DCA, DCB also offers camouflage to the PCB by being black... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics
- Use: Encapsulant or Conformal Coating
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76061 is a single component U.V. anaerobic sealant. 76061 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Cure / Technology: Thermoset; Addition Cure
- Form / Shape: Grease, Paste
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from MacDermid Alpha Electronics Solutions
Product Description. ER2183 Thermally conductive epoxy potting compound is an epoxy resin which meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission. It is a low viscosity alternative to ER2220 system which is ideal for potting and... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76081 is a single component U.V. anaerobic sealant. 76081 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from MacDermid Alpha Electronics Solutions
Product Description. ER2221 thermally conductive epoxy potting compound has been formulated as high temperature resistant and thermally conductive encapsulation resin which retains excellent characteristics throughout thermal cycling. ER2221 exhibits excellent thermal resistance up to an operating... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76082 is a single component U.V. anaerobic sealant. 76082 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy; Polyphenylene Sulfide
from MacDermid Alpha Electronics Solutions
Product Description. ER1426 Transparent / Colourless Epoxy Encapsulation Resin is a two part resin designed for powder bonding and impregnation applications. It ’s a very low viscosity resin system ideal for use on complicated geometries or around components placed close together. The long... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Powder
- Use: Impregnating Resin
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76083 is a single component U.V. anaerobic sealant. 76083 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76084 is a single component U.V. anaerobic sealant. 76084 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Hernon ® External Ammunition Sealant 59621 is a single component U.V. anaerobic sealant. 59621 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
UV Curable Cylinlock ® 821 is a fast curing, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. Curing occurs when adhesive is confined between mating surfaces. The cured adhesive is a thermoset plastic suitable for exposure to most solvents and withstands... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Industry: Electronics; Electric Power
- Form / Shape: 10 ml
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 47422 is a single component UV and anaerobic curing adhesive. Grenade Igniter Case Sealant 47422 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high performance thermoset plastic suitable for... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 1 liter
- Composition: Single Component
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Silicone
from Hernon Manufacturing, Inc.
HASA 39781 is a single-component, anaerobic, structural adhesive designed for bonding rigid assemblies. HASA 39781 cure is accomplished when mating surfaces including metal, glass and ceramics are joined together. Accelerated cures are possible with the application of primers or by a short, low... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics; Electric Power
- Form / Shape: 10 liters
- Composition: Single Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
HASA 722 is a single-component, anaerobic, structural adhesive designed for bonding rigid assemblies. HASA 722 cure is accomplished when mating surfaces including metal, glass and ceramics are joined together. Accelerated cures are possible with the application of primers or by a short, low... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml
- Composition: Single Component
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 395 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 395 will change from amber to a reddish brown upon cure. Bonding the voice... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: TUFFBOND 395, LT AMBER, 300 ML CARTRIDGE
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The reccommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Hernon Manufacturing, Inc.
Tuffbond ® 394 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 394 will change from amber-yellow to a reddish brown upon cure. Bonding the... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: 300 ml cartridge
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]
- Cure / Technology: Thermoset
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Form / Shape: Liquid
- Composition: Single Component; Unfilled
from Hernon Manufacturing, Inc.
Ultrabond ® 3443 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond ® 3443 is excellent for bonding and tacking many parts. Ultrabond ® 3443 can also be cured with heat above 200 °F (93 °C) or Activator 56 or... [See More]
- Cure / Technology: Thermoset
- Form / Shape: 25 ml
- Use: Encapsulant or Conformal Coating
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Ultrabond ® 71813 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond ® 71813 is excellent for bonding and tacking many parts. Ultrabond ® 71813 can also be cured with heat above 200 °F (93 °C) or Activator 56... [See More]
- Cure / Technology: Thermoset
- Form / Shape: 25 ml
- Use: Encapsulant or Conformal Coating
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Ultrabond ® 748 is a single component 100% solid adhesive/sealant formulated to bond and seal electronic assemblies. Ultrabond ® 748 can also be cured with heat above 200 °F (93 °C) or using a primer. [See More]
- Cure / Technology: Thermoset
- Industry: Electronics; Electric Power
- Form / Shape: 25 ml
- Composition: Single Component
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Hernon Manufacturing, Inc.
Ultrabond ® 773 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond ® 773 is excellent for bonding and tacking many parts. Ultrabond ® 773 can also be cured with heat above 200 °F (93 °C) or EF Primer 56. [See More]
- Cure / Technology: Thermoset
- Form / Shape: 25 ml
- Use: Encapsulant or Conformal Coating
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste; Powder
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 40995 is a single component anaerobic thread locking and sealing adhesive. Grenade Igniter Case Sealant 40995 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high-performance thermoset plastic... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; UV or Radiation Cured
- Industry: Electronics; Electric Power
- Form / Shape: 1 liter
- Composition: Single Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Porosity Sealant (HPS) 38374R is the solution to leak proof parts, improving machinability, in addition to increasing the durability and surface quality for painting and plating. The required addition of HPS Initiator activates the dual-cure system enabling the system to cure anaerobically at room... [See More]
- Cure / Technology: Thermoset
- Form / Shape: 4 gal
- Use: Impregnating Resin
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Hernon Manufacturing, Inc.
Porosity Sealant (HPS) 59801 is a low viscosity liquid sealant designed for sealing interfacial leak paths in flexible electronic assemblies. It may also be used to enhance dielectric strength or seal porosity in passive materials. The dual-cure system incorporated in HPS 59801 offers the advantage... [See More]
- Cure / Technology: Thermoset
- Form / Shape: 4 gal
- Use: Impregnating Resin
- Industry: Electronics; Electric Power
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Silicone
from Sherwin-Williams Protective & Marine Coatings
ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Liquid
- Industry: Electric Power
from Hapco, Inc.
Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Henkel Corporation - Electronics
LOCTITE 3619 is used for ultra low temperature cure, high speed syringe dispense. [See More]
- Cure / Technology: Anaerobic; Thermoset
- Industry: Electronics
from Techsil Limited
Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics
- Chemical System: Epoxy
- Features: Electrically Conductive; Thermally Conductive
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Chemical System: Epoxy
- Form / Shape: Liquid
- Industry: Electronics; Electric Power
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Silicone
from Bluestar Silicones USA Corp.
A White, Two-Component, Electronic protevtive coating, Heat Cure Silicone. Properties. Viscosity 35000. Hardness Sha 42. Description. Bluesil V-204 is a white, two component, addition cure, heat curing silicone compound. It is designed as a protective coating for light sensitive electronic circuits... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: Silicone
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Chemical System: Epoxy
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. Electrically conductive. Long work life. Bonds difficult to wet surfaces [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Industry: Electronics
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a one-component, thermosetting epoxy resin. It is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stress in handheld electronic devices. [See More]
- Cure / Technology: Thermoset; Heat Curing
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Cure / Technology: Thermoset
- Chemical System: Silicone
- Form / Shape: Gel
- Industry: Electronics
from Hapco, Inc.
Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics
- Chemical System: Epoxy
- Features: Electrically Conductive; Thermally Conductive
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Gel
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Polyurethane
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive. High thermal conductivity. Solvent-free formulation. Low viscosity [See More]
- Cure / Technology: Thermoset
- Form / Shape: Paste
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Hapco, Inc.
Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Graphene Laboratories, Inc.
G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics
- Chemical System: Epoxy
- Features: Thermally Conductive
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Industry: Electronics
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications. Electrically conductive. Thermally conductive. Good dispensing characteristics. Hydrophobic [See More]
- Cure / Technology: Thermoset
- Features: Electrically Conductive
- Industry: Electronics
- CTE: 34
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics
- Chemical System: Epoxy
- Features: Electrically Conductive; Thermally Conductive
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Hapco, Inc.
High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics
- Chemical System: Epoxy
- Features: Electrically Conductive; Thermally Conductive
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Cure / Technology: Thermoset; Option of one or two component
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
- Chemical System: Epoxy
from Hapco, Inc.
Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics
- Chemical System: Epoxy
- Features: Electrically Conductive; Thermally Conductive
from Protavic America, Inc.
PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
- Chemical System: Polyurethane
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics
- Chemical System: Epoxy
- Features: Electrically Conductive; Thermally Conductive
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics
- Chemical System: Epoxy
- Features: Thermally Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics
- Chemical System: Epoxy
- Features: Electrically Conductive; Thermally Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
Elecolit ® 323 is a silver filled two part epoxy adhesive specially developed for bonding open chip components. This semiconducting grade has passed the autoclave test (1000h) and is suitable for use on semi conductors, it has no effect on bond wire adhesion. It can cured at either room... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics
- Chemical System: Epoxy
- Features: Electrically Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
Elecolit ® 3653 is a 1 component silver filled, solvent-free conductive epoxy adhesive used in applications which are subject to vibrations or quick temperature fluctuations. This unique product can be cured thermally in a very short period of time and cures to a 60 - 75 Shore D material. Silver... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics
- Chemical System: Epoxy
- Features: Electrically Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
Elecolit ® 414 is a single component silver-filled, electrically conductive coating substance that hardens into a flexible, chemical resistant, expandable, non-deformable and friction resistant film. Grey in colour, Elecolit ® 414 has a viscosity of 20,000 to 25,000 mPas and when used with... [See More]
- Cure / Technology: Thermoset
- Industry: Electronics
- Chemical System: Epoxy
- Features: Electrically Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power