Thermosetting / Crosslinking Electrical and Electronic Resins

Elecolit® 6603 Thermally Conductive Epoxy 30gm -- PNEL00008
from Techsil Limited

Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]

  • Cure / Technology: Thermoset
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Addition Cure
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
ELAN-Cast® -- E 2154 Black Resin / C 2154 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
Electrically and Highly Thermally Conductive Die Attach Adhesive -- ALPHA® ATROX® HT900-1
from MacDermid Alpha Electronics Solutions

ATROX ® HT900-1 is a thermosetting conductive die attach adhesive designed for LED packages. The unique chemistry of the ATROX ® HT900-1 allows the material to be cured at lower temperatures compared to standard die attach adhesives, while maintaining its material properties. ATROX ®... [See More]

  • Cure / Technology: Thermoset; Cured by Thermal Processing in Standard IR, Full Convection, Conduction or Vapor Phase Oven Equipment
  • Industry: Semiconductors, IC's; Electronics
  • Use: Die Bonding Adhesives
  • Features: Electrically Conductive
Biocompatible, Spectrally Transparent Epoxy -- EPO-TEK® MED-301
from Epoxy Technology

EPO-TEK ® MED-301 is a Certified ISO 10993, biocompatible, spectrally transparent, very low viscosity, room temperature curing epoxy. Additional characteristics are self-leveling, short pot-life, and ease of application, either by dispensing or manual operation. EPO-TEK ® MED-301 is used... [See More]

  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: Epoxy
MG Chemicals 8331 Silver Conductive Epoxy 115gm -- MGEP00007
from Techsil Limited

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

  • Cure / Technology: Thermoset
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Optical Epoxy -- EPO-TEK® OM125
from Epoxy Technology

A room temperature curing fiber optic grade epoxy. It was designed for Telecordia 1221 applications of fiber optics and is also ideal for eliminating cracking of the glass core in multi-mode constructed optical fibers. [See More]

  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Industry: Photonics
MG Chemicals Med Cure Thermal Epoxy Adhesive 6ml -- MGEP00014
from Techsil Limited

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Cure / Technology: Thermoset
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Thermally Conductive
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
UV Epoxy -- EPO-TEK® OG133-8
from Epoxy Technology

EPO-TEK ® OG133-8 is an UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK ®... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured
  • Form / Shape: Grease, Paste
  • Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: Epoxy
MG Chemicals Silver Conductive Epoxy (10 Min) 14gm -- MGEP00006
from Techsil Limited

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

  • Cure / Technology: Thermoset
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black
from Master Bond, Inc.

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
MG Chemicals Silver Conductive Epoxy (10 Min) 19gm -- MGEP00004
from Techsil Limited

MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]

  • Cure / Technology: Thermoset
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126
from Master Bond, Inc.

Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]

  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Form / Shape: Liquid; Powder
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
MG Chemicals Silver Conductive Epoxy (4 Hour) 21gm -- MGEP00005
from Techsil Limited

MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]

  • Cure / Technology: Thermoset
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
Elastomer Based, One Component Adhesive and Primer -- X21
from Master Bond, Inc.

Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]

  • Cure / Technology: Thermoset
  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Composition: Single Component; Unfilled
MG Chemicals Silver Conductive Epoxy (4 Hour)125gm -- MGEP00008
from Techsil Limited

MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]

  • Cure / Technology: Thermoset
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Cure / Technology: Thermoset; Addition Cure
  • Form / Shape: Grease, Paste
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
MG Chemicals Slow Cure Thermal Epoxy Adhesive 6ml -- MGEP00003
from Techsil Limited

MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Cure / Technology: Thermoset
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Thermally Conductive
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
MG Chemicals Thermal Conductive Epoxy 50ml -- MGEP00002
from Techsil Limited

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Cure / Technology: Thermoset
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy; Polyphenylene Sulfide
Panacol Elecolit® 323 Silver Filled Epoxy 28gm -- PNEL00002
from Techsil Limited

Elecolit ® 323 is a silver filled two part epoxy adhesive specially developed for bonding open chip components. This semiconducting grade has passed the autoclave test (1000h) and is suitable for use on semi conductors, it has no effect on bond wire adhesion. It can cured at either room... [See More]

  • Cure / Technology: Thermoset
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Electrically Conductive
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP
from Master Bond, Inc.

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
Panacol Elecolit® 3653 Silver Conductive Epoxy 50g -- PNEL00005
from Techsil Limited

Elecolit ® 3653 is a 1 component silver filled, solvent-free conductive epoxy adhesive used in applications which are subject to vibrations or quick temperature fluctuations. This unique product can be cured thermally in a very short period of time and cures to a 60 - 75 Shore D material. Silver... [See More]

  • Cure / Technology: Thermoset
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Electrically Conductive
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
Panacol Elecolit® 414 1-Part Silver Filled Epoxy -- PNEL00001
from Techsil Limited

Elecolit ® 414 is a single component silver-filled, electrically conductive coating substance that hardens into a flexible, chemical resistant, expandable, non-deformable and friction resistant film. Grey in colour, Elecolit ® 414 has a viscosity of 20,000 to 25,000 mPas and when used with... [See More]

  • Cure / Technology: Thermoset
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Electrically Conductive
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Silicone
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
High Glass Transition Temperature Epoxy System -- EP62-1
from Master Bond, Inc.

Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The reccommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
High Performance, Elastomer-Based, One Component Adhesive -- X-5
from Master Bond, Inc.

Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]

  • Cure / Technology: Thermoset
  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Composition: Single Component; Unfilled
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
High Temperature Resistant Epoxy Compound -- EP45HT
from Master Bond, Inc.

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Industry: Semiconductors, IC's; Electronics; Electric Power
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Grease, Paste; Powder
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Impregnating Resin
  • Chemical System: Epoxy
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
High Tensile Strength, One Component Epoxy -- EP15
from Master Bond, Inc.

Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]

  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
ArmorSeal® 5020 Resurfacer
from Sherwin-Williams Protective & Marine Coatings

ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]

  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Industry: Electric Power
Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. [See More]

  • Cure / Technology: Thermoset
  • Industry: Electronics
  • Form / Shape: Grease, Paste
  • Composition: Single Component; Unfilled
Silicone Elastomer Gel Encapsulant And Potting Compound -- SilGel® 612 A/B
from Wacker Chemical Corp.

WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]

  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Silicone
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Industry: Electronics
Heat Cure Silicone -- Bluesil™ V-204 A/B
from Bluestar Silicones USA Corp.

A White, Two-Component, Electronic protevtive coating, Heat Cure Silicone. Properties. Viscosity 35000. Hardness Sha 42. Description. Bluesil V-204 is a white, two component, addition cure, heat curing silicone compound. It is designed as a protective coating for light sensitive electronic circuits... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Chemical System: Silicone
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone
Polyurethane Encapsulation -- Series-Six
from Dow Polyurethanes

Series-Six Polyurethane Encapsulant is a two-component, modified polyurethane system. The Series-Six system includes: Series-Six Rail Embedment Material. Series-Six One-Part Primer. Series-Six A55 Rail Embedment Material. Series-Six A65 Rail Embedment Material. Series-Six A2 Two-part Primer. [See More]

  • Cure / Technology: Thermoset
  • Industry: Electric Power
  • Chemical System: Polyurethane
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Industry: Electronics; Electric Power
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
LOCTITE 3619 -- 8802601435137
from Henkel Corporation - Electronics

LOCTITE 3619 is used for ultra low temperature cure, high speed syringe dispense. [See More]

  • Cure / Technology: Anaerobic; Thermoset
  • Industry: Electronics
Thermally Conductive Silicone Rubber Compound -- ELASTOSIL® RT 743 LV-K A/B
from Wacker Chemical Corp.

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

  • Cure / Technology: Thermoset
  • Chemical System: Silicone
  • Form / Shape: Gel
  • Industry: Electronics
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Polyurethane
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Gel
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
Di-Pak™ E-4500 Elastomeric Eletrical Insulating Compound -- E-4540
from Hapco, Inc.

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Electrically Conductive Epoxy -- 40-3905
from Epoxies Etc...

40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]

  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives
  • Industry: Electronics
Di-Pak™ E-4600 Elastomeric Eletrical Insulating Compound -- E-4650
from Hapco, Inc.

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Cure / Technology: Thermoset; Option of one or two component
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4888
from Hapco, Inc.

High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Chemical System: Polyurethane
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4901-2
from Hapco, Inc.

Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4200
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics