Impregnating Resin Electrical and Electronic Resins
from MacDermid Alpha Electronics Solutions
Product Description. UR5608 hard polyurethane potting compound is a tough resin ideal for applications where thermal shock or temperature cycling is present. It ’s a good all round resin with good thermal conductivity and is flame retardant meeting UL94 V-0. These characteristics make it... [See More]
- Use: Encapsulant, Potting Compound; Impregnating Resin
- Industry: Electronics
- Chemical System: Polyurethane
- Features: Flame Retardant; Thermally Conductive
from Hernon Manufacturing, Inc.
Porosity Sealant (HPS) 38374R is the solution to leak proof parts, improving machinability, in addition to increasing the durability and surface quality for painting and plating. The required addition of HPS Initiator activates the dual-cure system enabling the system to cure anaerobically at room... [See More]
- Use: Impregnating Resin
- Cure / Technology: Thermoset
- Form / Shape: 4 gal
- Industry: Electronics; Electric Power
from ELANTAS PDG, Inc.
Water-borne epoxy emulsion - dip-and-bake impregnating resin [See More]
- Use: Impregnating Resin
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Master Bond, Inc.
LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity and a refractive index of 1.51. [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Cure / Technology: Cures by LED light
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from MacDermid Alpha Electronics Solutions
Product Description. ER1426 Transparent / Colourless Epoxy Encapsulation Resin is a two part resin designed for powder bonding and impregnation applications. It ’s a very low viscosity resin system ideal for use on complicated geometries or around components placed close together. The long... [See More]
- Use: Impregnating Resin
- Chemical System: Epoxy
- Form / Shape: Powder
- Cure / Technology: Thermoset
from Hernon Manufacturing, Inc.
Porosity Sealant (HPS) 59801 is a low viscosity liquid sealant designed for sealing interfacial leak paths in flexible electronic assemblies. It may also be used to enhance dielectric strength or seal porosity in passive materials. The dual-cure system incorporated in HPS 59801 offers the advantage... [See More]
- Use: Impregnating Resin
- Cure / Technology: Thermoset
- Form / Shape: 4 gal
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured
from Hernon Manufacturing, Inc.
Porosity Sealant (HPS) 990 is the solution to leak proof parts, improving machinability, in addition to increasing the durability and surface quality for painting and plating. HPS 990 is also excellent for sealing leak paths in rigid electronic assemblies. The hardened resins exhibit superior... [See More]
- Use: Impregnating Resin
- Cure / Technology: Thermoset
- Form / Shape: 4 gal
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
- Form / Shape: Grease, Paste; Powder
- Cure / Technology: Thermoset
from Hernon Manufacturing, Inc.
Porosity Sealant (HPS) 991R is the solution to leak proof parts, improving machinability, in addition to increasing the durability and surface quality for painting and plating. The required addition of HPS Initiator 91 activates HPS 991R enabling the system to cure at elevated temperatures (HPS... [See More]
- Use: Impregnating Resin
- Cure / Technology: Thermoset
- Form / Shape: 5 gal
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Hernon Manufacturing, Inc.
Porosity Sealant (HPS) 994 is the solution to leak proof parts, improving machinability, in addition to increasing the durability and surface quality for painting and plating. The hardened resins exhibit superior chemical resistance and higher temperature stability. The microscopic voids, where... [See More]
- Use: Impregnating Resin
- Cure / Technology: Thermoset
- Form / Shape: 50 gal / 55 gal
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Hernon Manufacturing, Inc.
Formulations - Applications - Impregnation - HPS Accelerator 28 [See More]
- Use: Impregnating Resin
- Industry: Electronics; Electric Power
- Form / Shape: 4 oz
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Cure / Technology: Thermoset; UV or Radiation Cured
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Hernon Manufacturing, Inc.
Hernon ® HPS Initiator 91 is used to activate Hernon ® Hernon Porosity Sealant (HPS) resins. Hernon ® HPS Initiator 91 activates HPS 991R enabling the system to cure at elevated temperatures. [See More]
- Use: Impregnating Resin
- Industry: Electronics; Electric Power
- Form / Shape: 500 gm
from Master Bond, Inc.
EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical strength properties and electrical insulation values. EP41S-5 offers convenient handling with... [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Impregnating Resin
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Hernon Manufacturing, Inc.
Formulations - Applications - Impregnation - HPS Initiator 92 [See More]
- Use: Impregnating Resin
- Industry: Electronics; Electric Power
- Form / Shape: 500 gm
from Master Bond, Inc.
Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration and shock. [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Hernon Manufacturing, Inc.
Porosity Sealant (HPS) 41814 is the solution to leak proof parts, improving machinability, in addition to increasing the durability and surface quality for painting and plating. The hardened resins exhibit superior chemical resistance and elevated temperature stability. The microscopic voids, where... [See More]
- Use: Impregnating Resin
- Cure / Technology: Thermoset
- Form / Shape: 50 gal / 55 gal
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity. [See More]
- Use: Encapsulant, Potting Compound; Impregnating Resin
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Hernon Manufacturing, Inc.
Formulations - Applications - Impregnation - HPS Stabilizer 27 [See More]
- Use: Impregnating Resin
- Industry: Electronics; Electric Power
- Form / Shape: 1 gal
from Master Bond, Inc.
Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in underfill, impregnation and porosity sealing applications, while it also performs well in bonding, coating or... [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Impregnating Resin
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Techsil Limited
MG Chemicals 4226 Super Corona Dope is a highly insulating coating with excellent arc and corona resistance. This low viscosity, one part varnish is ready to use and adheres well to many substrates. This products insulates transformers, coils, motor windings, and various electronic generator parts... [See More]
- Use: Impregnating Resin
- Industry: Electronics
from Sanchem, Inc.
is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]
- Use: Impregnating Resin
- Cure / Technology: Non-Drying
- Form / Shape: Gel
- Industry: Electronics; Electric Power
from Protavic America, Inc.
Silver filled epoxy system for tantalum & ceramic termination coating. This product is commonly used for flexible termination of capacitors and offers high strength and flexibility. This product is the "gold" standard for flexible termination. Solvent adjusted. Please contact us for product... [See More]
- Use: Impregnating Resin
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Techsil Limited
MG Chemicals 4226 Super Corona Dope is a highly insulating coating with excellent arc and corona resistance. This low viscosity, one part varnish is ready to use and adheres well to many substrates. This products insulates transformers, coils, motor windings, and various electronic generator parts... [See More]
- Use: Impregnating Resin
- Industry: Electronics