Electrical Insulation / Dielectric Material Electrical and Electronic Resins

Electrically Insulative and Thermally Conductive Epoxy -- EPO-TEK® TD1001
from Epoxy Technology

EPO-TEK ® TD1001 is a thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few of its traits. It is particularly... [See More]

  • Features: High Dielectric; Thermally Conductive
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Epoxy
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Features: High Dielectric; Optical; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
ELAN-Cast® -- E 2154 Black Resin / C 2154 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
Momentive TSE322 Dielectric Silicone Adhesive 1kg -- MOSI01181
from Techsil Limited

Momentive TSE322 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits. Easy to use, one-component material. Fast cure at elevated temperature. Offers self-adhesion properties. [See More]

  • Features: High Dielectric; Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Momentive TSE3221S Dielectric Silicone Adh. 1kg -- MOSI01316
from Techsil Limited

TSE3221S is a heat curable translucent silicone adhesive designed for sealing and coating applications. This grade adheres well to a variety of substrates such as metals, plastics, ceramic and glass without the use of a primer. Potential applications include sealing and coating for hybrid Ics,... [See More]

  • Features: High Dielectric
  • Industry: Electronics
  • Chemical System: Silicone
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; Airbus standards
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black
from Master Bond, Inc.

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

  • Features: High Dielectric; Thermally Conductive; USP Class VI
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126
from Master Bond, Inc.

Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]

  • Features: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Shape: Liquid; Powder
  • Cure / Technology: Thermoset
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Features: High Dielectric; Thermally Conductive; NASA Low Outgassing
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: UV Curing
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Features: High Dielectric; Thermally Conductive; NASA Low Outgassing
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP
from Master Bond, Inc.

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

  • Features: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Features: High Dielectric; Thermal Insulation; NASA Low Outgassing
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; Airbus Standards
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Features: High Dielectric; Thermally Conductive; ISO 10993-5
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Features: High Dielectric; Optical; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Silicone
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F -- Supreme 34CA
from Master Bond, Inc.

Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]

  • Features: High Dielectric
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Features: High Dielectric
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Features: High Dielectric; Thermal Insulation; NASA low outgassing
  • Form / Shape: Grease, Paste; Powder
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Impregnating Resin
  • Chemical System: Epoxy
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Features: High Dielectric; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
Low Exotherm, Two Component Epoxy -- EP29LP
from Master Bond, Inc.

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Features: High Dielectric; Optical; Thermal Insulation
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
  • Chemical System: Epoxy
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Features: High Dielectric; Optical; Thermally Conductive; NASA Low Outgassing
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Low Viscosity, Fast Curing, Two Component Epoxy -- EP38
from Master Bond, Inc.

Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]

  • Features: High Dielectric
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Features: High Dielectric; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Features: High Dielectric
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: High Dielectric; Thermally Conductive; UL Rating; Solvent resistant
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Features: High Dielectric; Flame Retardant; Thermal Insulation; UL Rating
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Polyurethane
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Features: High Dielectric
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Features: High Dielectric; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Dielectric Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics -- ELASTOSIL® N198 BLACK
from Wacker Chemical Corp.

ELASTOSIL ® N198 BLACK US is a non-slump, RTV-1 oxime cure silicone rubber that cures on contact with moisture in the air. Special features. Neutral cure. Solvent-free. Primerless adhesion to most substrates. Available in Black or Gray. Application. ELASTOSIL ® N198 BLACK US is intended for... [See More]

  • Features: High Dielectric
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
Potting, Encapsulant Elastomer -- Bluesil™ Esa 7252 QC A/B
from Bluestar Silicones USA Corp.

Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]

  • Features: High Dielectric
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone
Di-Pak™ E-4500 Elastomeric Eletrical Insulating Compound -- E-4540
from Hapco, Inc.

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

  • Features: High Dielectric; Flame Retardant
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
TECHNOMELT PA 2692
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: High Dielectric; Thermally Conductive; UL Rating
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Features: High Dielectric
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
Elastomer Modified Epoxy -- 20-3236
from Epoxies Etc...

20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio. [See More]

  • Features: High Dielectric; Elastomer Modified Epoxy
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Epoxy
Ceramabond -- 890
from Aremco Products, Inc.

Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]

  • Features: High Dielectric; Electrically Conductive; Thermally Conductive
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Form / Shape: Grease, Paste
  • Industry: Electronics
Di-Pak™ E-4600 Elastomeric Eletrical Insulating Compound -- E-4650
from Hapco, Inc.

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

  • Features: High Dielectric; Flame Retardant
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: High Dielectric; Thermally Conductive; UL Rating
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Features: High Dielectric
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Chemical System: Polyurethane
One Component MicroElectric Grade Epoxy -- 50-3115
from Epoxies Etc...

50-3115 is a one part thermally conductive electrically insulating epoxy. This epoxy system is designed and engineered for demanding electronic bonding applications. It is formulated with low ionic high performance polymers and new proprietary thermally conductive fillers. [See More]

  • Features: High Dielectric; Thermally Conductive
  • Form / Shape: Grease, Paste
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: High Dielectric; Thermally Conductive; UL Rating; Hydrophobic
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyolefin
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Features: High Dielectric; Thermal Insulation
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4888
from Hapco, Inc.

High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]

  • Features: High Dielectric
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: High Dielectric; Thermally Conductive; UL Rating
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4901-2
from Hapco, Inc.

Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]

  • Features: High Dielectric
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
TECHNOMELT PA 668 Clear
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: High Dielectric; Optical; Thermally Conductive; UL Rating; UV resistant
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4200
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Features: High Dielectric
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset